Patents by Inventor Justin M. Huttula
Justin M. Huttula has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11963335Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a sandwich plate construction heatsink. The sandwich plate construction heatsink can include a cold plate, one or more heat pipes over the cold plate, and a top plate over the one or more heat pipes. The cold plate can include a channel to accommodate the one or more heat pipes and/or the top plate can include a channel to accommodate the one or more heat pipes. The cold plate can be over a heat source in the electronic device.Type: GrantFiled: June 26, 2020Date of Patent: April 16, 2024Assignee: Intel CorporationInventors: Juha Tapani Paavola, Jerrod Peterson, Justin M. Huttula, Ellann Cohen, Ruander Cardenas
-
Patent number: 11930620Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.Type: GrantFiled: June 27, 2020Date of Patent: March 12, 2024Assignee: Intel CorporationInventors: Jeff Ku, Cora Nien, Gavin Sung, Tim Liu, Lance Lin, Wan Yu Liu, Gerry Juan, Jason Y. Jiang, Justin M. Huttula, Evan Piotr Kuklinski, Juha Tapani Paavola, Arnab Sen, Hari Shanker Thakur, Prakash Kurma Raju
-
Patent number: 11656247Abstract: A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.Type: GrantFiled: March 31, 2017Date of Patent: May 23, 2023Assignee: Intel CorporationInventors: Ronald Michael Kirby, Erkan Acar, Joe Walczyk, Youngseok Oh, Justin M Huttula, Mohanraj Prabhugoud
-
Publication number: 20230022182Abstract: Thermal management systems having pre-stressed biasing elements and related methods are disclosed. An example electronic component includes a circuit board, a processor coupled to the circuit board, and a thermally conductive structure positioned adjacent the processor. The thermally conductive structure is to dissipate heat generated by the processor. The electronic component includes a pre-stressed biasing element coupled to the thermally conductive structure and positioned between the processor and the thermally conductive structure. The pre-stressed biasing element is pre-stressed prior to attachment to the thermally conductive structure and the circuit board.Type: ApplicationFiled: March 31, 2022Publication date: January 26, 2023Inventors: Juha Paavola, Justin M. Huttula, Jerrod Peterson, Shawn McEuen, Kerry A. Stevens
-
Publication number: 20200396864Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.Type: ApplicationFiled: June 27, 2020Publication date: December 17, 2020Applicant: Intel CorporationInventors: Jeff Ku, Cora Nien, Gavin Sung, Tim Liu, Lance Lin, Wan Yu Liu, Gerry Juan, Jason Y. Jiang, Justin M. Huttula, Evan Piotr Kuklinski, Juha Tapani Paavola, Arnab Sen, Hari Shanker Thakur, Prakash Kurma Raju
-
Publication number: 20200337178Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a sandwich plate construction heatsink. The sandwich plate construction heatsink can include a cold plate, one or more heat pipes over the cold plate, and a top plate over the one or more heat pipes. The cold plate can include a channel to accommodate the one or more heat pipes and/or the top plate can include a channel to accommodate the one or more heat pipes. The cold plate can be over a heat source in the electronic device.Type: ApplicationFiled: June 26, 2020Publication date: October 22, 2020Applicant: Intel CorporationInventors: Juha Tapani Paavola, Jerrod Peterson, Justin M. Huttula, Ellann Cohen, Ruander Cardenas
-
Publication number: 20200141979Abstract: A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.Type: ApplicationFiled: March 31, 2017Publication date: May 7, 2020Inventors: Ronald Michael Kirby, Erkan Acar, Joe Walczyk, Youngseok Oh, Justin M Huttula, Mohanraj Prabhugoud
-
Patent number: 10644458Abstract: A shielded interconnect array and associated methods are described. Examples of the shielded interconnect array include socket connections that include conductive members with flexible bends. In examples shown, corresponding grounded conductive members with flexible bends are located adjacent to other conductive members with flexible bends to provide shielding.Type: GrantFiled: March 31, 2017Date of Patent: May 5, 2020Assignee: Intel CorporationInventors: Youngseok Oh, Justin M Huttula, Mohanraj Prabhugoud, Ronald Kirby, Joe Walczyk, Erkan Acar
-
Publication number: 20180287305Abstract: A shielded interconnect array and associated methods are described. Examples of the shielded interconnect array include socket connections that include conductive members with flexible bends. In examples shown, corresponding grounded conductive members with flexible bends are located adjacent to other conductive members with flexible bends to provide shielding.Type: ApplicationFiled: March 31, 2017Publication date: October 4, 2018Inventors: Youngseok Oh, Justin M. Huttula, Mohanraj Probhugoud, Ronald Kirby, Joe Walczyk, Erkan Acar
-
Patent number: 9922619Abstract: Disclosed herein is a computing device configured to send display data to a display through a near-field communication (NFC) interface. The computing device includes a chassis, a primary display, and a near-field communication interface to transmit display data to a secondary display.Type: GrantFiled: March 26, 2015Date of Patent: March 20, 2018Assignee: Intel CorporationInventors: Anand S. Konanur, Ulun Karacaoglu, Justin M. Huttula, Farid Adrangi
-
Publication number: 20160180805Abstract: Disclosed herein is a computing device configured to send display data to a display through a near-field communication (NFC) interface. The computing device includes a chassis, a primary display, and a near-field communication interface to transmit display data to a secondary display.Type: ApplicationFiled: March 26, 2015Publication date: June 23, 2016Applicant: Intel CorporationInventors: Anand S. Konanur, Ulun Karacaoglu, Justin M. Huttula, Farid Adrangi
-
Publication number: 20030064702Abstract: A housing device is described that protects hardware and software useful in connecting a personal computer (PC) to a network. The housing device is versatile so as to allow for a plurality of configuration and installation combinations. This versatility allows an installer to mount the housing device either horizontally or vertically. When mounted horizontally, the installer has yet another option to prop the housing device upright via use of an easel on the back or allow it to lie flat with the easel folded under a main body component. Serrated edges are provided on the easel so as to allow for tension to be placed on the wires or cables coupled to the housing device so that the wires or cables do not become disconnected from the housing device.Type: ApplicationFiled: September 28, 2001Publication date: April 3, 2003Inventors: Robert L. Van Egmond, Shawn S. Mceuen, Gary L. Bookhardt, Doug G. Bennett, Justin M. Huttula, Josh Gordon, Ryan Wilday