Patents by Inventor Justin Mehaffy

Justin Mehaffy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8378015
    Abstract: Hot melt adhesive compositions containing hyper-branched SBS block copolymers and end use applications thereof. The hyper-branched SBS is characterized in having a ratio between light-scattering molecular weight (of non-di-block polymer) and GPC molecular weight (of non-di-block polymer) greater than 1.4 and having ratio between light scattering molecular weight molecular weight (of non-di-block polymer) and light scattering molecular weight molecular weight (of di-block polymer) greater than 5. The ratio between light scattering molecular weight MW (of non-di-block polymer) and light scattering molecular weight MW (of di-block polymer) also defines the number of arms for the hyper branched structure. The weight average molecular weight of each arm of the hyper-branched SBS block copolymer is less than about 100,000.
    Type: Grant
    Filed: February 15, 2010
    Date of Patent: February 19, 2013
    Assignee: Henkel AG & Co. KGaA
    Inventors: Qiwei He, Yuhong Hu, Alethea Pollock, Justin Mehaffy, Michael G. Harwell
  • Publication number: 20100210163
    Abstract: Hot melt adhesive compositions containing hyper-branched SBS block copolymers and end use applications thereof. The hyper-branched SBS is characterized in having a ratio between light-scattering molecular weight (of non-di-block polymer) and GPC molecular weight (of non-di-block polymer) greater than 1.4 and having ratio between light scattering molecular weight molecular weight (of non-di-block polymer) and light scattering molecular weight molecular weight (of di-block polymer) greater than 5. The ratio between light scattering molecular weight MW (of non-di-block polymer) and light scattering molecular weight MW (of di-block polymer) also defines the number of arms for the hyper branched structure. The weight average molecular weight of each arm of the hyper-branched SBS block copolymer is less than about 100,000.
    Type: Application
    Filed: February 15, 2010
    Publication date: August 19, 2010
    Inventors: Qiwei He, Yuhong Hu, Alethea Pollock, Justin Mehaffy, Michael G. Harwell
  • Publication number: 20070080157
    Abstract: An autofeeding low application temperature hot melt application system comprising a hot melt tank, a compact integrated auto feed, and operates at temperatures of not more than 260° F.
    Type: Application
    Filed: October 6, 2005
    Publication date: April 12, 2007
    Inventors: Justin Mehaffy, David Duckworth, John Rye
  • Publication number: 20060116459
    Abstract: A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from about 5 to about 60 weight percent ethylene vinyl acetate with about 30 to about 50 weight percent VA content and having a melt index of about 700 to about 4,000 dg/min; a tackifier; and wax with a melting point of about 125 to about 180° F.
    Type: Application
    Filed: January 12, 2006
    Publication date: June 1, 2006
    Inventors: Brian Morrison, Ingrid Cole, Justin Mehaffy
  • Publication number: 20050274740
    Abstract: Apparatus for dispensing viscous liquid, such as hot melt adhesive, including an automated adhesive conveyance (e.g., pneumatic transfer) feed unit, a heated melt tank, a pump, heated hose, dispensing valve, and control unit. The adhesive unit is specifically designed to run at maximum temperature of 275° F.
    Type: Application
    Filed: June 14, 2005
    Publication date: December 15, 2005
    Inventors: David Duckworth, Joseph Maziotti, Justin Mehaffy
  • Publication number: 20050261416
    Abstract: Hot melt adhesives that contain an N-alpha olefin wax have substantially improved open times.
    Type: Application
    Filed: May 21, 2004
    Publication date: November 24, 2005
    Inventors: Brian Morrison, Jagruti Patel, Justin Mehaffy
  • Publication number: 20050042469
    Abstract: A hot melt adhesive based on ethylene-2-ethylhexyl acrylate copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.
    Type: Application
    Filed: August 22, 2003
    Publication date: February 24, 2005
    Inventors: Lie-zhong Gong, Melissa Allen, Justin Mehaffy, Darshak Desai, Dale Haner, Tuyet Le
  • Publication number: 20050003197
    Abstract: Hot melt adhesive that is applied at or below 300° F. and that can withstand temperatures when bonded and stressed that are within 100° F. of their application temperature.
    Type: Application
    Filed: July 3, 2003
    Publication date: January 6, 2005
    Inventors: David Good, Justin Mehaffy, Dale Haner, Jagruti Patel, Brian Morrison, Fidelin Willybiro
  • Patent number: 6593407
    Abstract: A low application temperature, high heat resistant hot melt adhesive comprising an adhesive polymer and a modified rosin and/or modified terpene which has a molecular weight to softening point ratio of less that about 10. The adhesive is particularly well-suited for hot filled packaging applications.
    Type: Grant
    Filed: February 6, 2001
    Date of Patent: July 15, 2003
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Dale L. Haner, Brian Carillo, Justin Mehaffy
  • Publication number: 20020146526
    Abstract: A low application temperature, high heat resistant hot melt adhesive comprising an adhesive polymer and a modified rosin and/or modified terpene which has a molecular weight to softening point ratio of less that about 10. The adhesive is particularly well-suited for hot filled packaging applications.
    Type: Application
    Filed: February 6, 2001
    Publication date: October 10, 2002
    Inventors: Dale L. Haner, Brian Carillo, Justin Mehaffy