Abstract: Hot melt adhesive compositions containing hyper-branched SBS block copolymers and end use applications thereof. The hyper-branched SBS is characterized in having a ratio between light-scattering molecular weight (of non-di-block polymer) and GPC molecular weight (of non-di-block polymer) greater than 1.4 and having ratio between light scattering molecular weight molecular weight (of non-di-block polymer) and light scattering molecular weight molecular weight (of di-block polymer) greater than 5. The ratio between light scattering molecular weight MW (of non-di-block polymer) and light scattering molecular weight MW (of di-block polymer) also defines the number of arms for the hyper branched structure. The weight average molecular weight of each arm of the hyper-branched SBS block copolymer is less than about 100,000.

Abstract: Hot melt adhesive compositions containing hyper-branched SBS block copolymers and end use applications thereof. The hyper-branched SBS is characterized in having a ratio between light-scattering molecular weight (of non-di-block polymer) and GPC molecular weight (of non-di-block polymer) greater than 1.4 and having ratio between light scattering molecular weight molecular weight (of non-di-block polymer) and light scattering molecular weight molecular weight (of di-block polymer) greater than 5. The ratio between light scattering molecular weight MW (of non-di-block polymer) and light scattering molecular weight MW (of di-block polymer) also defines the number of arms for the hyper branched structure. The weight average molecular weight of each arm of the hyper-branched SBS block copolymer is less than about 100,000.

Abstract: An autofeeding low application temperature hot melt application system comprising a hot melt tank, a compact integrated auto feed, and operates at temperatures of not more than 260° F.

Abstract: A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from about 5 to about 60 weight percent ethylene vinyl acetate with about 30 to about 50 weight percent VA content and having a melt index of about 700 to about 4,000 dg/min; a tackifier; and wax with a melting point of about 125 to about 180° F.

Abstract: Apparatus for dispensing viscous liquid, such as hot melt adhesive, including an automated adhesive conveyance (e.g., pneumatic transfer) feed unit, a heated melt tank, a pump, heated hose, dispensing valve, and control unit. The adhesive unit is specifically designed to run at maximum temperature of 275° F.

Abstract: Hot melt adhesives that contain an N-alpha olefin wax have substantially improved open times.

Abstract: A hot melt adhesive based on ethylene-2-ethylhexyl acrylate copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.

Abstract: Hot melt adhesive that is applied at or below 300° F. and that can withstand temperatures when bonded and stressed that are within 100° F. of their application temperature.

Abstract: A low application temperature, high heat resistant hot melt adhesive comprising an adhesive polymer and a modified rosin and/or modified terpene which has a molecular weight to softening point ratio of less that about 10. The adhesive is particularly well-suited for hot filled packaging applications.

Abstract: A low application temperature, high heat resistant hot melt adhesive comprising an adhesive polymer and a modified rosin and/or modified terpene which has a molecular weight to softening point ratio of less that about 10. The adhesive is particularly well-suited for hot filled packaging applications.