Patents by Inventor Justin Tinhsi LEE

Justin Tinhsi LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230282997
    Abstract: Examples of a supporting assembly for supporting an installable component are described. The supporting assembly comprises a supporting member. The supporting assembly may further include a latch bar extending longitudinally to support the installable component. The supporting assembly may further include a coupling arm and a control knob. In an example, the control knob may be rotatable, and is to control rotation of the latch bar.
    Type: Application
    Filed: July 31, 2020
    Publication date: September 7, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chun-Wei Kuo, Chien-Hao CHEN, Bang-Zhong XU, Justin Tinhsi LEE
  • Publication number: 20230152843
    Abstract: According to an example, an electronic device comprises a device housing having an outer surface, a pivot element disposed within an indentation having a set of detents, and a support structure rotatable about the pivot element. The support structure may comprise a projecting element to engage with each detent of the set of detents. Upon a force being applied at a first portion of the support structure, the support structure is to rotate such that a second portion of the support structure is to protrude from the outer surface of the device housing.
    Type: Application
    Filed: April 23, 2020
    Publication date: May 18, 2023
    Inventors: Tien Liang CHUNG, Justin TINHSI LEE, Chien-Yi WANG
  • Publication number: 20230007801
    Abstract: Examples of an installation module for installing a circuit-based component are described. The installation module comprises a base plate having a pair of longitudinal edges and a pair of lateral edges. The installation module may further include a supporting element to support a circuit-based component installed within the installation module. The installation module may further include first wall, a second wall and a back wall. In an example, a retaining element to retain the circuit-based component when installed, may be provided on one of the first wall and the second wall. The back wall may further include a tab which extends from a longitudinal edge of the back wall, and when pulled, is to disengage the installation module from a chassis of a computing device.
    Type: Application
    Filed: December 6, 2019
    Publication date: January 5, 2023
    Inventors: Tien Liang CHUNG, Chien-Yi WANG, Justin Tinhsi Lee
  • Patent number: 11096304
    Abstract: A cage for accommodating an electronic component is described, where the electronic component may be susceptible to damage upon impact. The cage may include a first wall, a second wall, a third wall, and a fourth wall. In an example, the first wall and the third wall may be positioned transversely to the second wall and the fourth wall. In an example, a first indentation may be formed on the first wall and a second indentation may be formed on the third wall. In said example, the first indentation and the second indentation may have a gap there between to accommodate the electronic component.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: August 17, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Yi Wang, Tien Liang Chung, Justin Tinhsi Lee
  • Publication number: 20210176886
    Abstract: A cage for accommodating an electronic component is described, where the electronic component may be susceptible to damage upon impact. The cage may include a first wall, a second wall, a third wall, and a fourth wall. In an example, the first wall and the third wall may be positioned transversely to the second wall and the fourth wall. In an example, a first indentation may be formed on the first wall and a second indentation may be formed on the third wall. In said example, the first indentation and the second indentation may have a gap there between to accommodate the electronic component.
    Type: Application
    Filed: December 6, 2019
    Publication date: June 10, 2021
    Inventors: Chien-Yi WANG, Tien Liang CHUNG, Justin Tinhsi LEE