Patents by Inventor Justine A. Mooney
Justine A. Mooney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10399295Abstract: A passive electrical article including a dielectric layer having a nonwoven material.Type: GrantFiled: July 12, 2016Date of Patent: September 3, 2019Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Rui Yang, Guoping Mao, Dipankar Ghosh, Ji-Hwa Lee, Seungbae Min, Justine A. Mooney
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Publication number: 20190135611Abstract: A Micro Electrical Mechanical Systems (MEMS) article including a non-planar surface and a continuous film conforming to the non-planar surface is described. The continuous film includes a polymer layer disposed between two metal layers and is patterned to define one or more MEMS elements.Type: ApplicationFiled: January 7, 2019Publication date: May 9, 2019Inventors: Phillip J. Bergeron, Brent D. Lunceford, John D. Geissinger, Douglas B. Gundel, Justine A. Mooney, Ravi Palaniswamy, Siang Sin Foo
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Patent number: 10207916Abstract: A flexible film including one or more MEMS elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.Type: GrantFiled: May 11, 2015Date of Patent: February 19, 2019Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Phillip J. Bergeron, Brent D. Lunceford, John D. Geissinger, Douglas B. Gundel, Justine A. Mooney, Ravi Palaniswamy, Siang Sin Foo
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Patent number: 10128422Abstract: Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.Type: GrantFiled: October 19, 2015Date of Patent: November 13, 2018Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Alejandro Aldrin II Agcaoili Narag, Jian Xia Gao, Justine A. Mooney
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Publication number: 20170290212Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one cavity extending from the second major surface toward the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer.Type: ApplicationFiled: June 19, 2017Publication date: October 5, 2017Inventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin II Agacaoili Narag, Siang Sin Foo, Fong Liang Tan, Wei Meng Pee, Andrew J. Ouderkirk, Justine A. Mooney
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Patent number: 9716061Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semi-conductor device to the conductive layer.Type: GrantFiled: February 17, 2012Date of Patent: July 25, 2017Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Il Agcaoili Narag, Siang Sin Foo, Fong Liang Tan, Wei Meng Pee, Andrew J. Ouderkirk, Justine A. Mooney
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Patent number: 9698563Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.Type: GrantFiled: October 27, 2011Date of Patent: July 4, 2017Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Il Agcaoili Narag, James R. White, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney, Nathan P. Kreutter, Qihong Nie, Jian Xia Gao
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Patent number: 9674938Abstract: Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.Type: GrantFiled: October 27, 2011Date of Patent: June 6, 2017Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Il Agcaoili Narag, James R. White, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney, Nathan P. Kreutter, Qihong Nie, Jian Xia Gao
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Publication number: 20170073215Abstract: A flexible film including one or more MEMS elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.Type: ApplicationFiled: May 11, 2015Publication date: March 16, 2017Inventors: Phillip J. Bergeron, Brent D. Lunceford, John D. Geissinger, Douglas B. Gundel, Justine A. Mooney, Ravi Palaniswamy, Siang Sin Foo
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Patent number: 9564568Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.Type: GrantFiled: September 21, 2015Date of Patent: February 7, 2017Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin II Agcaoili Narag, Siang Sin Foo, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney
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Publication number: 20160318279Abstract: A passive electrical article including a dielectric layer having a nonwoven material.Type: ApplicationFiled: July 12, 2016Publication date: November 3, 2016Inventors: Rui Yang, Guoping Mao, Dipankar Ghosh, Ji-Hwa Lee, Seungbae Min, Justine A. Mooney
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Patent number: 9482416Abstract: Provided is an article comprising a flexible circuit comprising a polymeric dielectric layer having first and second major surfaces, one or both of the first and second major surfaces having a conductive layer thereon, wherein at least one conductive layer comprises an electrical circuit configured to power one or more light emitting semi-conductor devices located on the flexible circuit, wherein the flexible circuit is shaped to form a three dimensional structure.Type: GrantFiled: November 20, 2012Date of Patent: November 1, 2016Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Alejandro Aldrin Il Agcaoili Narag, Ravi Palaniswamy, Arokiaraj Jesudoss, Justine A. Mooney
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Publication number: 20160049567Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.Type: ApplicationFiled: September 21, 2015Publication date: February 18, 2016Inventors: Ravi PALANISWAMY, Arokiaraj JESUDOSS, Alejandro Aldrin II Agcaoili NARAG, Siang Sin FOO, Fong Liang TAN, Andrew J. OUDERKIRK, Justine A. MOONEY
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Publication number: 20160043294Abstract: Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.Type: ApplicationFiled: October 19, 2015Publication date: February 11, 2016Inventors: Ravi PALANISWAMY, Alejandro Aldrin II Agcaoili NARAG, Jian Xia GAO, Justine A. MOONEY
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Patent number: 9236547Abstract: Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.Type: GrantFiled: August 8, 2012Date of Patent: January 12, 2016Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Alejandro Aldrin Il Agcaoili Narag, Jian Xia Gao, Justine A. Mooney
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Patent number: 9179543Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.Type: GrantFiled: October 27, 2011Date of Patent: November 3, 2015Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Il Agcaoili Narag, Siang Sin Foo, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney
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Publication number: 20140321126Abstract: Provided is an article comprising a flexible circuit comprising a polymeric dielectric layer having first and second major surfaces, one or both of the first and second major surfaces having a conductive layer thereon, wherein at least one conductive layer comprises an electrical circuit configured to power one or more light emitting semiconductor devices located on the flexible circuit, wherein the flexible circuit is shaped to form a three dimensional structure.Type: ApplicationFiled: November 20, 2012Publication date: October 30, 2014Inventors: Alejandro Aldrin II Agcaoili Narag, Ravi Palaniswamy, Arokiaraj Jesudoss, Justine A. Mooney
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Publication number: 20140153263Abstract: Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.Type: ApplicationFiled: August 8, 2012Publication date: June 5, 2014Applicant: 3M Innovative Properties CompanyInventors: Ravi Palaniswamy, Alejandro Aldrin II Agcaoili Narag, Jian Xia Gao, Justine A. Mooney
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Publication number: 20140036461Abstract: Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.Type: ApplicationFiled: October 27, 2011Publication date: February 6, 2014Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin II Agcaoili Narag, James R White, Fong Liang Tan, Andrew J Ouderkirk, Justine A Mooney, Nathan P Kreutter, Qihong Nie, Jian Xia Gao
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Publication number: 20130320390Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semi-conductor device to the conductive layer.Type: ApplicationFiled: February 17, 2012Publication date: December 5, 2013Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Agcaoili Narag, II, Siang Sin Foo, Fong Liang Tan, Wei Meng Pee, Andrew J. Ouderkirk, Justine A. Mooney