Abstract: An apparatus for the vacuum treatment of substrates in a vacuum chamber includes a substrate support device with a pylon which can be rotated about a longitudinal axis and has holding means for substrates and a plasma discharge device assigned to the pylon. The plasma discharge device includes more than two plate-shaped electrodes having excitation areas, the excitation areas of which are all oriented in the direction of the pylon and a power supply device for the excitation of a plasma discharge, by at least one electrical voltage applied to at least two of the electrodes, is provided, the excited plasma acting at least on parts of the pylon and on substrates that can be arranged on them. A process performs the vacuum coating by the apparatus.

Abstract: An inline coating system has an introduction chamber comprising an introduction gate, a first buffer chamber which connects to the introduction chamber and which can be separated from the introduction chamber by means of a first sluice gate and other components. The first buffer chamber has a gap sluice device with at least one slit diaphragm, and when the first insertion gate is opened or closed, a pressure gradient within the first buffer chamber is adjusted between the pressure in the region of the second insertion gate and the pressure in the region of the first insertion gate.

Abstract: An apparatus for the vacuum treatment of substrates in a vacuum chamber includes a substrate support device with a pylon which can be rotated about a longitudinal axis and has holding means for substrates and a plasma discharge device assigned to the pylon. The plasma discharge device includes more than two plate-shaped electrodes having excitation areas, the excitation areas of which are all oriented in the direction of the pylon and a power supply device for the excitation of a plasma discharge, by at least one electrical voltage applied to at least two of the electrodes, is provided, the excited plasma acting at least on parts of the pylon and on substrates that can be arranged on them. A process performs the vacuum coating by the apparatus.

Abstract: The invention relates to a method for operating an inline coating system which has an introduction chamber comprising an introduction gate, a first buffer chamber which connects to the introduction chamber and which can be separated from the introduction chamber by means of a first sluice gate and other components.

Abstract: The invention relates to a heat treatment inner chamber (3) for thermally processing a substrate (20), having walls (10) which enclose an inner space (24) of the heat treatment inner chamber (3), having a mounting apparatus (8) for mounting the substrate (20) during the thermal processing and having an energy source (11) for introducing energy into the inner space (24) of the heat treatment inner chamber (3), at least one part of the inner sides of the walls (10) being formed in order to reflect power introduced by the energy source (11), wherein the at least one part of the inner sides of the walls (10) consists of a material which is highly reflective at least for infrared radiation.

Abstract: A treatment chamber for thermal processing of an areal substrate including a transport arrangement for conveying and supporting the substrate during the thermal processing and a gas-guiding arrangement for convective heating or cooling of the substrate, where the gas-guiding arrangement has outlet openings, by means of which the temperature-controlled gas is guided onto the substrate, and where a removal arrangement is provided, by means of which the gases introduced into the treatment chamber via the gas-guiding arrangement can be removed in a targeted fashion, such that the treatment chamber can be embodied as a heat-treatment chamber or as a cooling chamber.

Abstract: An apparatus for coating an areal substrate, for example a rectangular plate comprises a vaporizer source and a distributor system for the supply of vaporized material onto the substrate. The distributor system comprises a line source, with this line source and the substrate is movable relative to one another. The apparatus serves preferably for the production of flat screens with organic light-emitting diodes.

Abstract: A process for the deposition of transparent and conductive indium-tin oxide (ITO) films with a particularly low resistance of preferably less than 200 ??cm and a small surface roughness of preferably less than 1 nm on a substrate, wherein combined BF/DC sputtering of an indium-tin oxide (ITO) target is employed and wherein the process gas is supplemented by an argon/hydrogen mixture as reaction gas during the sputtering, as well as ITO-films with the above-named characteristics.

Abstract: A process for the deposition of transparent and conductive indium-tin oxide (ITO) films with a particularly low resistance of preferably less than 200 ??cm and a small surface roughness of preferably less than 1 nm on a substrate, wherein combined BF/DC sputtering of an indium-tin oxide (ITO) target is employed and wherein the process gas is supplemented by an argon/hydrogen mixture as reaction gas during the sputtering, as well as ITO-films with the above-named characteristics.

Abstract: A process for the deposition of transparent and conductive indium-tin oxide (ITO) films with a particularly low resistance of preferably less than 200 ??cm and a small surface roughness of preferably less than 1 nm on a substrate, wherein combined HF/DC sputtering of an indium-tin oxide (ITO) target is employed and wherein the process gas is supplemented by an argon/hydrogen mixture as reaction gas during the sputtering, as well as ITO-films with the above-named characteristics.

Abstract: A process for the deposition of transparent and conductive indium-tin oxide (ITO) films with a particularly low resistance of preferably less than 200 &mgr;&OHgr;cm and a small surface roughness of preferably less than 1 nm on a substrate, wherein combined HF/DC sputtering of an indium-tin oxide (ITO) target is employed and wherein the process gas is supplemented by an argon/hydrogen mixture as reaction gas during the sputtering, as well as ITO-films with the above-named characteristics.

Abstract: An apparatus for coating an areal substrate, for example a rectangular plate comprises a vaporizer source and a distributor system for the supply of vaporized material onto the substrate. The distributor system comprises a line source, with this line source and the substrate is movable relative to one another. The apparatus serves preferably for the production of flat screens with organic light-emitting diodes.