Patents by Inventor JUWEI LEE

JUWEI LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode packaging device
    Patent number: 11569410
    Abstract: An LED packaging device includes a frame including a bottom wall having a bottom surface and a surrounding wall extending upwardly from the bottom wall, at least one LED chip, a plurality of spaced-apart reflectors and a packaging body. The bottom and surrounding walls cooperatively define a mounting space. The surrounding wall has an internal side surface facing the mounting space and a top surface facing away from the bottom surface. The LED chip is disposed on the bottom surface and is received in the mounting space. Each of the reflectors is disposed on a peripheral region of the bottom surface. The packaging body covers the LED chip and the reflectors, such that the LED chip is sealed inside the mounting space.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: January 31, 2023
    Assignee: Quanzhou Sanan Semiconductor Technology Co., Ltd.
    Inventors: Junpeng Shi, Juwei Lee, Chen-Ke Hsu
  • LIGHT EMITTING DIODE PACKAGING DEVICE
    Publication number: 20210050473
    Abstract: An LED packaging device includes a frame including a bottom wall having a bottom surface and a surrounding wall extending upwardly from the bottom wall, at least one LED chip, a plurality of spaced-apart reflectors and a packaging body. The bottom and surrounding walls cooperatively define a mounting space. The surrounding wall has an internal side surface facing the mounting space and a top surface facing away from the bottom surface. The LED chip is disposed on the bottom surface and is received in the mounting space. Each of the reflectors is disposed on a peripheral region of the bottom surface. The packaging body covers the LED chip and the reflectors, such that the LED chip is sealed inside the mounting space.
    Type: Application
    Filed: November 2, 2020
    Publication date: February 18, 2021
    Inventors: JUNPENG SHI, JUWEI LEE, CHEN-KE HSU