Abstract: A chassis arrangement that minimizes lateral flame spread from card to card within the chassis, and increases heat dissipation from the chassis, comprising a heat sink attached to the inside of the chassis cover to dissipate excess heat from within the chassis, and PCB shields disposed between the circuit cards of the chassis and acting in concert with the heat sink to act as physical and thermal barriers to prevent lateral flame spread from card to card due to flame and hot gas wrap-around.

Abstract: An ultraviolet exposure unit for exposing both sides of a printed circuit board to ultraviolet light to cause ultraviolet sensitive materials which have been applied to said printed circuit board to cure. A vertically positioned curing chamber and a printed circuit board carrier system provide vertical orientation and simultaneous application of ultraviolet light to both sides of the printed circuit board when such ultraviolet materials are applied to both sides of the printed circuit board.

Abstract: A first method repairs the conductor traces of a printed circuit board assembly and includes the steps of first locating and isolating a break in an existing conductor trace. After the brake is isolated, an extrusion of a conductive resin material is applied, utilizing an extrusion delivery system. The conductive resin is then cured, hardening the conductive resin. A second method reworks the conductor traces of the printed circuit board assembly. This method severs an existing conductor path between existing electrical elements on the printed circuit board assembly and builds a conductor path to form a new connection. The method includes the steps of severing the conductor trace extending between the leads of a first and a second electrical element. Next, utilizing an extrusion delivery system, a conductive resin is extruded onto the printed circuit board assembly between the lead of the first electrical element and the lead of a third electrical element.

Abstract: A printed wiring board with zones therein of controlled thermal coefficient of expansion including a first layer of first material, a second layer of second material and a third layer of a third material positioned between the first and the second layers. The third layer includes a first area whereat the material is removed and replaced with a control material possessing a thermal coefficient of expansion different from the first, second and third layers. The third layer and the control material each possess a first side bonded to a first side of the first layer and a second side bonded to a first side of a second layer to form the printed wiring board. Electronic components may be mounted on a second side of the first layer, the second layer, or both the first and second layers and the control material may be varied in composition and thickness to change thermal expansion in the zone above and below the control material.