Patents by Inventor Jwei Wien Liu

Jwei Wien Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7476961
    Abstract: An improved method for fabricating a window frame/window piece assembly is disclosed in this application. A window frame having an opening in its inner portion is provided. According to one aspect, the window frame can be formed from a unitary piece of sheet metal. A transparent piece is attached to the inner portion of the window frame through a molding process. According to one embodiment, the window frame is placed within a mold such that the inner portion of the window frame projects into an inner cavity inside the mold. After the mold has been closed, a transparent material is injected into the inner cavity so that it bonds with the inner portion of the window frame. After the bond of between the transparent material and the window frame is set, the window frame/window piece assembly is removed from the mold. According to another embodiment, a plurality of window frames may be loaded into a single mold so that a plurality of window frame/window piece assemblies can be fabricated in a single batch.
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: January 13, 2009
    Assignee: Texas Instruments Incorporated
    Inventors: Bradley M. Haskett, John Patrick O'Connor, Jwei Wien Liu
  • Patent number: 7402458
    Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.
    Type: Grant
    Filed: April 28, 2005
    Date of Patent: July 22, 2008
    Assignee: Texas Instruments Incorporated
    Inventors: Bradley Morgan Haskett, John Patrick O'Connor, Steven E. Smith, Mark Myron Miller, Ivan Kmecko, Jwei Wien Liu, Edward Carl Fisher, Frank O. Armstrong, Daniel C. Estabrook, Jeffrey E. Faris
  • Patent number: 7314816
    Abstract: A package that resists creation of particles in a package cavity. A package according to one embodiment of the present invention contains a mechanical device attached to the floor of the package substrate. Epoxy typically is used to attach the device. Electrical connections are provided by bond wires connecting bond pads on the substrate with bond pads on the device. A window is attached to the substrate to form a cavity around the device. A thin masking layer on portions of the package cavity surface prevents the surface from generating particles. The thin masking layer may be any material that resists particle generation. The masking layer on the cavity walls optionally extends out of the cavity and onto the upper surface of the package.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: January 1, 2008
    Assignee: Texas Instruments Incorporated
    Inventors: Jwei Wien Liu, John P. O'Connor
  • Patent number: 7163838
    Abstract: An improved method for fabricating a window frame/window piece assembly is disclosed in this application. A window frame having an opening in its inner portion is provided. According to one aspect, the window frame can be formed from a unitary piece of sheet metal. A transparent piece is attached to the inner portion of the window frame through a molding process. According to one embodiment, the window frame is placed within a mold such that the inner portion of the window frame projects into an inner cavity inside the mold. After the mold has been closed, a transparent material is injected into the inner cavity so that it bonds with the inner portion of the window frame. After the bond of between the transparent material and the window frame is set, the window frame/window piece assembly is removed from the mold. According to another embodiment, a plurality of window frames may be loaded into a single mold so that a plurality of window frame/window piece assemblies can be fabricated in a single batch.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: January 16, 2007
    Assignee: Texas Instruments Incorporated
    Inventors: Bradley M. Haskett, John Patrick O'Connor, Jwei Wien Liu
  • Patent number: 6992375
    Abstract: An anchor to hold getter materials in place within a micromechanical device package substrate. First and second cavity faces define an anchor cavity and mechanically retain a getter away from a region holding the micromechanical device. The getter anchor may be formed in a substrate comprised of at least three layers. The layers form a cavity in the substrate with a wide bottom portion—formed in the middle layer and a relatively narrower top portion—formed by the top layer. The narrow portion helps to retain the getter in the cavity by creating a mechanical lock on the wide portion of getter in the bottom of the cavity.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: January 31, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Roger A. Robbins, Jwei Wien Liu, Jack C. Smith, Edward Carl Fisher, Joyce Wong Holton
  • Patent number: 6894853
    Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: May 17, 2005
    Assignee: Texas Instruments Incorporated
    Inventors: Bradley Morgan Haskett, John Patrick O'Connor, Steven E. Smith, Mark Myron Miller, Ivan Kmecko, Jwei Wien Liu, Edward Carl Fisher, Frank O. Armstrong, Daniel C. Estabrook, Jeffrey E. Farris
  • Patent number: 6879147
    Abstract: A drop-in environmental control material carrier assembly 55, which improves the performance and lowers the cost of semiconductor packages. The disclosed approach positions the environmental control materials inside the package cavity by means of a drop-in environmental control material carrier assembly 54, which can hold up to eight materials. In the case of a packaged micromirror, the getters consist of at least three types; i.e., (1) one for absorbing moisture inside the package, (2) one for absorbing adhesive outgassing constituents inside the package, and (3) one for storing the PFDA lubricant used to prevent the micromirror mirrors from sticking. The performance and lifetime of the micromirror devices are improved and the cost of projection display systems, in which these micromirrors are central components, is lowered.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: April 12, 2005
    Assignee: Texas Instruments Incorporated
    Inventors: Vincent C. Lopes, Jwei Wien Liu
  • Patent number: 6876071
    Abstract: A package that resists creation of particles in a package cavity. A package according to one embodiment of the present invention contains a mechanical device attached to the floor of the package substrate. Epoxy typically is used to attach the device. Electrical connections are provided by bond wires connecting bond pads on the substrate with bond pads on the device. A window is attached to the substrate to form a cavity around the device. A thin masking layer on portions of the package cavity surface prevents the surface from generating particles. The thin masking layer may be any material that resists particle generation. The masking layer on the cavity walls optionally extends out of the cavity and onto the upper surface of the package.
    Type: Grant
    Filed: July 1, 2002
    Date of Patent: April 5, 2005
    Assignee: Texas Instruments Incorporated
    Inventors: Jwei Wien Liu, John P. O'Connor
  • Patent number: 6833944
    Abstract: A low-cost, high-performance, reliable micromirror package (300) that replaces the ceramic substrate in conventional packages with a printed circuit board substrate (30) and a molded plastic case (33), and the cover glass with a window (36), preferably an optically clear plastic window. The printed circuit board substrate (30) allows for either external bond pads or flex cable connection of the micromirror package to the projector's motherboard. These packages support flexible snap-in, screw-in, ultrasonic plastic welding, or adhesive welding processes to overcome the high cost seam welding process of many conventional packages.
    Type: Grant
    Filed: January 23, 2004
    Date of Patent: December 21, 2004
    Assignee: Texas Instruments Incorporated
    Inventor: Jwei Wien Liu
  • Patent number: 6833942
    Abstract: A low-cost, high-performance, reliable micromirror package (300) that replaces the ceramic substrate in conventional packages with a printed circuit board substrate (30) and a molded plastic case (33), and the cover glass with a window (36), preferably an optically clear plastic window. The printed circuit board substrate (30) allows for either external bond pads or flex cable connection of the micromirror package to the projector's motherboard. These packages support flexible snap-in, screw-in, ultrasonic plastic welding, or adhesive welding processes to overcome the high cost seam welding process of many conventional packages.
    Type: Grant
    Filed: January 23, 2004
    Date of Patent: December 21, 2004
    Assignee: Texas Instruments Incorporated
    Inventor: Jwei Wien Liu
  • Publication number: 20040150058
    Abstract: A low-cost, high-performance, reliable micromirror package (300) that replaces the ceramic substrate in conventional packages with a printed circuit board substrate (30) and a molded plastic case (33), and the cover glass with a window (36), preferably an optically clear plastic window. The printed circuit board substrate (30) allows for either external bond pads or flex cable connection of the micromirror package to the projector's motherboard. These packages support flexible snap-in, screw-in, ultrasonic plastic welding, or adhesive welding processes to overcome the high cost seam welding process of many conventional packages.
    Type: Application
    Filed: January 23, 2004
    Publication date: August 5, 2004
    Inventor: Jwei Wien Liu
  • Publication number: 20040150870
    Abstract: A low-cost, high-performance, reliable micromirror package (300) that replaces the ceramic substrate in conventional packages with a printed circuit board substrate (30) and a molded plastic case (33), and the cover glass with a window (36), preferably an optically clear plastic window. The printed circuit board substrate (30) allows for either external bond pads or flex cable connection of the micromirror package to the projector's motherboard. These packages support flexible snap-in, screw-in, ultrasonic plastic welding, or adhesive welding processes to overcome the high cost seam welding process of many conventional packages.
    Type: Application
    Filed: January 23, 2004
    Publication date: August 5, 2004
    Inventor: Jwei Wien Liu
  • Patent number: 6762868
    Abstract: A drop-in aperture 20, which improves the performance and lowers the cost of electro-optical SLM packages. The disclosed package provides a separate metal light shield (aperture) 20 and antireflective coated cover 33, and positions the aperture 20 inside the package 40 in close proximity to the SLM's 41 surface. This approach further uses an on-chip SLM light shield to define the projected screen border, thereby making the edge definition of the metal drop-in aperture less critical. Therefore, the cover can be mounted well away from the plane of the SLM, which relaxes the defect requirements of the cover and lowers the cost of the overall package. The package of this invention improves the performance and lifetime and lowers the cost of projection display systems.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: July 13, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Jwei Wien Liu, Thomas A. Kocian
  • Publication number: 20040061492
    Abstract: A drop-in environmental control material carrier assembly 55, which improves the performance and lowers he cost of semiconductor packages. The disclosed approach positions the environmental control materials inside the package cavity by means of a drop-in environmental control material carrier assembly 54, which can hold up to eight materials. In the case of a packaged micromirror, the getters consist of at least three types; i.e., (1) one for absorbing moisture inside the package, (2) one for absorbing adhesive outgassing constituents inside the package, and (3) one for storing the PFDA lubricant used to prevent the micromirror mirrors from sticking. The performance and lifetime of the micromirror devices are improved and the cost of projection display systems, in which these micromirrors are central components, is lowered.
    Type: Application
    Filed: September 30, 2003
    Publication date: April 1, 2004
    Inventors: Vincent C. Lopes, Jwei Wien Liu
  • Patent number: 6704131
    Abstract: A low-cost, high-performance, reliable micromirror package (300) that replaces the ceramic substrate in conventional packages with a printed circuit board substrate (30) and a molded plastic case (33), and the cover glass with a window (36), preferably an optically clear plastic window. The printed circuit board substrate (30) allows for either external bond pads or flex cable connection of the micromirror package to the projector's motherboard. These packages support flexible snap-in, screw-in, ultrasonic plastic welding, or adhesive welding processes to overcome the high cost seam welding process of many conventional packages.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: March 9, 2004
    Assignee: Texas Instruments Incorporated
    Inventor: Jwei Wien Liu
  • Publication number: 20040012087
    Abstract: An improved method for fabricating a window frame/window piece assembly is disclosed in this application. A window frame having an opening in its inner portion is provided. According to one aspect, the window frame can be formed from a unitary piece of sheet metal. A transparent piece is attached to the inner portion of the window frame through a molding process. According to one embodiment, the window frame is placed within a mold such that the inner portion of the window frame projects into an inner cavity inside the mold. After the mold has been closed, a transparent material is injected into the inner cavity so that it bonds with the inner portion of the window frame. After the bond of between the transparent material and the window frame is set, the window frame/window piece assembly is removed from the mold. According to another embodiment, a plurality of window frames may be loaded into a single mold so that a plurality of window frame/window piece assemblies can be fabricated in a single batch.
    Type: Application
    Filed: July 22, 2002
    Publication date: January 22, 2004
    Applicant: Texas Instruments, Inc.
    Inventors: Bradley M. Haskett, John Patrick O'Connor, Jwei Wien Liu
  • Patent number: 6664779
    Abstract: A drop-in environmental control material carrier assembly 55, which improves the performance and lowers the cost of semiconductor packages. The environmental control materials are positioned inside the package cavity by means of a drop-in environmental control material carrier assembly 54, which can hold up to eight materials. Three types of environmental control materials are typically used in micromirror packages: (1) one for absorbing moisture inside the package, (2) one for absorbing adhesive outgassing constituents inside the package, and (3) one for storing the PFDA lubricant used to prevent the micromirror mirrors from sticking. The performance and lifetime of the micromirror devices are improved and the cost of projection display systems, in which these micromirrors are central components, is lowered.
    Type: Grant
    Filed: November 5, 2001
    Date of Patent: December 16, 2003
    Assignee: Texas Instruments Incorporated
    Inventors: Vincent C. Lopes, Jwei Wien Liu
  • Patent number: 6649435
    Abstract: A system and method of aligning a micromirror array to the micromirror package and the micromirror package to a display system. The system and method improve the alignment of the micromirror array to the display system by using a consistent set of precision reference regions. The micromirror package substrate 700 engages an alignment fixture portion of a die mounter 702 during the die mount operation, and a similar fixture when installed in a display system. The package substrate 700 is held by the predefined regions on two edges and the three predefined regions on the top surface. When mounting the device in the package optical techniques may be used for x-y plane alignment. Spring plunger 710 biases the substrate against the contact points 708 on the top surface. In the display system or other end equipment, a socket contacts the same six points to align the device.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: November 18, 2003
    Assignee: Texas Instruments Incorporated
    Inventors: Jwei Wien Liu, Satyan R. Kalyandurg
  • Publication number: 20030210452
    Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.
    Type: Application
    Filed: May 10, 2002
    Publication date: November 13, 2003
    Applicant: Texas Instruments, Inc.
    Inventors: Bradley Morgan Haskett, John Patrick O'Connor, Steven E. Smith, Mark Myron Miller, Ivan Kmecko, Jwei Wien Liu, Edward Carl Fisher, Frank O. Armstrong, Daniel C. Estabrook, Jeffrey E. Farris
  • Publication number: 20030000737
    Abstract: A package that resists creation of particles in a package cavity. The package is ideally suited for use with microelectromechanical devices. A package according to one embodiment of the present invention contains a mechanical device (302), for example a micromirror device, attached to the floor (304) of the package substrate (306). Epoxy (308) typically is used to attach the device (302). Electrical connections are provided by bond wires (310) connecting bond pads (312) on the substrate (306) with bond pads on the device (302). A window (314) is attached to the substrate (306) to form a cavity (316) around the device. A thin masking layer (318) on portions of the package cavity surface prevents the surface from generating particles. The thin masking layer (318) may be any material that resists particle generation. Malleable metals are ideal.
    Type: Application
    Filed: July 1, 2002
    Publication date: January 2, 2003
    Inventors: Jwei Wien Liu, John P. O'Connor