Patents by Inventor Jwu-jiun Yang

Jwu-jiun Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8854450
    Abstract: An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard character regions of two substrates; capturing at least two partially actual images of two substrates in different waiting spaces, respectively; comparing to obtain at least two partially actual character regions of the two substrates, respectively; building actual coordinate systems of the two substrates, respectively; comparing the actual coordinate systems of the two substrates with each other to obtain a set of offset values; moving the two substrates from the different waiting spaces to an alignment-and-installation space based on the set of offset values and a predetermined movement value, respectively; and stacking the two substrates with each other to finish the alignment and installation in the alignment-and-installation space.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: October 7, 2014
    Assignee: Metal Industries Research & Development Centre
    Inventors: Chorng-tyan Lin, Chih-chin Wen, Chun-ming Yang, Jwu-jiun Yang
  • Patent number: 8644591
    Abstract: An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: February 4, 2014
    Assignee: Metal Industries Research & Development Centre
    Inventors: Chorng-tyan Lin, Chih-chin Wen, Chun-ming Yang, Jwu-jiun Yang
  • Publication number: 20130147942
    Abstract: An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard character regions of two substrates; capturing at least two partially actual images of two substrates in different waiting spaces, respectively; comparing to obtain at least two partially actual character regions of the two substrates, respectively; building actual coordinate systems of the two substrates, respectively; comparing the actual coordinate systems of the two substrates with each other to obtain a set of offset values; moving the two substrates from the different waiting spaces to an alignment-and-installation space based on the set of offset values and a predetermined movement value, respectively; and stacking the two substrates with each other to finish the alignment and installation in the alignment-and-installation space.
    Type: Application
    Filed: January 17, 2012
    Publication date: June 13, 2013
    Applicant: Metal Industries Research & Development Centre
    Inventors: CHORNG-TYAN LIN, Chih-chin Wen, Chun-ming Yang, Jwu-jiun Yang
  • Publication number: 20130148878
    Abstract: An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment.
    Type: Application
    Filed: January 17, 2012
    Publication date: June 13, 2013
    Applicant: Metal Industries Research & Development Centre
    Inventors: Chorng-tyan Lin, Chih-Chin Wen, Chun-ming Yang, Jwu-jiun Yang