Abstract: A method and structure uses a decentralized network to connect and manage multiple devices. The method includes the steps of: applying for a decentralized identity in the decentralized network, and binding the decentralized identity with a digital identity; storing a correspondingly generated binding information in the decentralized network; authorizing one of the devices, to which the digital identity is allowed to connect, and an allowable account; storing a correspondingly generated authorization information in the decentralized network; when necessary, updating and storing an authentication information of the bound digital identity in the decentralized network; retrieving the authentication information from the decentralized network through a terminal device to process certification for connecting the one of the devices.

Abstract: A method and structure uses a decentralized network to connect and manage multiple devices. The method includes the steps of: applying for a decentralized identity in the decentralized network, and binding the decentralized identity with a digital identity; storing a correspondingly generated binding information in the decentralized network; authorizing one of the devices, to which the digital identity is allowed to connect, and an allowable account; storing a correspondingly generated authorization information in the decentralized network; when necessary, updating and storing an authentication information of the bound digital identity in the decentralized network; retrieving the authentication information from the decentralized network through a terminal device to process certification for connecting the one of the devices.

Abstract: The present invention relates to a verification architecture of an infrared thermal imaging array module, which includes the following steps. Perform specification design of thermal imaging module, epitaxy, and verification of optical characteristics for calibrating epitaxial parameters. Perform a fabrication process of single-device-type sensing device and verification of changing-temperature optoelectronic measurement by measuring and calibrating at low temperatures by changing temperatures and voltages. Perform a fabrication process of focal-plane array and verification of optoelectronic uniformity and test for dark-current uniformity. Perform a fabrication process and verification of jointing and thinning the focal-plane array and the ROIC. The focal-plane sensing module and the ROIC are jointed by indium bonding, and optoelectronic signal conversion is performed using the sensing array module. Perform the verification of integrated test on thermal image quality.

Abstract: The present invention relates to a verification architecture of an infrared thermal imaging array module, which includes the following steps. Perform specification design of thermal imaging module, epitaxy, and verification of optical characteristics for calibrating epitaxial parameters. Perform a fabrication process of single-device-type sensing device and verification of changing-temperature optoelectronic measurement by measuring and calibrating at low temperatures by changing temperatures and voltages. Perform a fabrication process of focal-plane array and verification of optoelectronic uniformity and test for dark-current uniformity. Perform a fabrication process and verification of jointing and thinning the focal-plane array and the ROIC. The focal-plane sensing module and the ROIC are jointed by indium bonding, and optoelectronic signal conversion is performed using the sensing array module. Perform the verification of integrated test on thermal image quality.