Abstract: An inlet system for a metal-organic chemical vapor deposition (MOCVD) apparatus is provided. The inlet system includes an inlet module and a subsidiary inlet module. The inlet module admits a reactant gas. The subsidiary inlet module admits a carrier gas. The subsidiary inlet module is disposed outside the inlet module to reduce turbulent flow, prevent the reactant gas from contaminating the inner wall of a reactor chamber, and concentrate the reactant gas, so as to enhance the reaction rate of the reactant gas and the growth rate of films.

Abstract: The present invention relates to a gas flow guiding device for use in a crystal-growing furnace. The gas flow guiding device has an insulation layer enclosing a crucible, a gas inlet mounted in the upper insulation layer, and a gas exit formed in the lateral insulation layer. A plurality of guide plates are radially arranged around the opening of the gas inlet, so that the free surface of the melt is blown by the guided gas flow in such a manner that the gas flow takes the impurity away from the free surface efficiently. As a result, the crystal ingot obtained by solidifying the melt will exhibit a reduced concentration of impurities and an improved crystal quality.

Abstract: The present invention discloses a MOCVD gas diffusion system with gas inlet baffles. With the adoption of multiple detachable air inlet baffles under the MO gas (Metal Organic gas) inlet and the hydride gas inlet, the gas diffusion system can easily and effectively reduce the pre-reaction of the MO gas and the hydride gas near the gas inlets, prevent metal diffusions around the inlets and make the metal layer generated on the wafers on the wafer carrier be very even, the MO gas used is also massively reduced to save great cost. The MOCVD process with the diffusion system of the present invention thus has a great potential in application to productions of high-performance LED epitaxy.

Abstract: The present invention relates to a gas supply device for use in a crystal-growing furnace. The gas supply device has an insulation layer enclosing a crucible, a gas inlet mounted in the insulation layer, and a gas exit formed in the insulation layer. A gas flow guide shield with an adjustable angle is disposed at the opening of the gas inlet, so that the free surface of the melt is blown by the guided gas flow in such a manner that the gas flow takes the impurity away from the free surface efficiently. As a result, the crystal ingot obtained by solidifying the melt will exhibit a reduced concentration of impurities and an improved crystal quality.

Abstract: The present invention relates to a gas flow guiding device for use in a crystal-growing furnace. The gas flow guiding device has an insulation layer enclosing a crucible, a gas inlet mounted in the upper insulation layer, and a gas exit formed in the lateral insulation layer. A plurality of guide plates are radially arranged around the opening of the gas inlet, so that the free surface of the melt is blown by the guided gas flow in such a manner that the gas flow takes the impurity away from the free surface efficiently. As a result, the crystal ingot obtained by solidifying the melt will exhibit a reduced concentration of impurities and an improved crystal quality.

Abstract: The present invention relates to a hot zone device for use in a crystal-growing furnace. The hot zone device has a gas inlet. The gas inlet is mounted in an insulation layer at a position above the crucible in a manner protruding into an interior of the crucible. The insulation layer is formed with a gas exit. The gas inlet is positioned such that the opening thereof is spaced apart from the free surface of the melt contained in the crucible by a distance substantially equal to or shorter than 10 cm, so as to allow the free surface of the melt to be blown by the guided gas flow in such a manner that the gas flow takes the impurity away from the free surface efficiently. As a result, the crystal ingot obtained by solidifying the melt will exhibit a reduced concentration of impurities and an improved crystal quality.

Abstract: The present invention provides a method for measuring the PN-junction temperature of a light-emitting diode (LED), which uses a reference voltage to establish the function of current, real power, power factor, or driving-time interval on temperature. The initial and thermal-equilibrium values of current, real power, power factor, or driving-time interval are measured, and hence the variations thereof are calculated. Referring to the pre-established function, the temperature change is given. By the temperature change and the initial temperature, the PN-junction temperature of the LED is thereby deduced.

Abstract: The present invention provides a method for measuring the PN-junction temperature of a light-emitting diode (LED), which uses a reference voltage to establish the function of current, real power, power factor, or driving-time interval on temperature. The initial and thermal-equilibrium values of current, real power, power factor, or driving-time interval are measured, and hence the variations thereof are calculated. Referring to the pre-established function, the temperature change is given. By the temperature change and the initial temperature, the PN-junction temperature of the LED is thereby deduced.

Abstract: Providing a fabrication method of a periodic domain inversion structure. A nonlinear optical ferroelectric material substrate is provided. A photoresist layer is formed on the upper and the lower surface of the substrate, and periodic gratings formed by interference of two laser beams are employed to expose the photoresist layer on the upper surface. Meanwhile, the two laser beams pass through the substrate, so the periodic gratings are used to expose the photoresist layer on the lower surface. A development process is performed to form a periodic photoresist pattern on the two surfaces of the substrate. A conductive layer is formed above the substrate for covering the photoresist pattern and the surface of the exposed substrate. The photoresist pattern and a portion of the conductive layer thereon are removed by lift-off. A voltage is applied to the substrate via the remaining conductive layer to polarize parts of the substrate.

Abstract: A method of measuring LED junction temperature includes the steps of: (a) obtaining a temperature curve of an LED; (b) inputting at least one rated AC voltage to the LED; (c) measuring a temperature at a specific point on an outer packaging structure of the LED, putting the temperature measured at the specific point into the temperature curve, and calculating a junction temperature of the LED by interpolation; and (d) substituting the result from the calculation in the step (c) into a numerical analysis model to obtain temperature oscillation of the LED.

Abstract: An mold having a sub-micron, or even nano, structure is fabricated. The mold is a porous aluminum oxide mold. With the mold, a sub-micron pattern is easily imprinted on a large surface of a substrate or a LED. No expensive equipment is necessary. The fabricating process is fast and cheap and thus meets the needs of producers.

Abstract: A method of thermal stress compensation includes providing a substrate. A first film is then formed on the substrate. Thereafter, a second film is also formed on the substrate. The second film has a negative coefficient of thermal expansion.

Abstract: A mold having a sub-micro, or even nano, structure is fabricated. The mold is a porous mold. With the mold, a sub-micro pattern is easily imprinted on a large surface of a substrate or a LED. No expansive equipment is necessary. The fabricating process is fast and cheap; and thus meets producer's needs.

Abstract: A fabricating method for patterned sapphire substrate is provided. The fabricating method includes the following processes. First, a sapphire substrate is provided, and a mask layer is formed on the sapphire substrate, wherein the mask layer with appropriate pattern exposes a part of the sapphire substrate. Then, a wet etching process is performed to remove the exposed part of the sapphire substrate, wherein an etchant in the wet etching process includes sulfuric acid and the mixture of the sulfuric acid and the phosphoric acid. Next, the mask layer is removed to form the patterned sapphire substrate. Further, a fabricating method for light-emitting diode is provided.

Abstract: A structure of a submount for thermal package has a high heat dissipation and a low spreading thermal resistance. The submount has a specific ratio of height to side length.

Abstract: Providing a fabrication method of a periodic domain inversion structure. A nonlinear optical ferroelectric material substrate is provided. A photoresist layer is formed on the upper and the lower surface of the substrate, and periodic gratings formed by interference of two laser beams are employed to expose the photoresist layer on the upper surface. Meanwhile, the two laser beams pass through the substrate, so the periodic gratings are used to expose the photoresist layer on the lower surface. A development process is performed to form a periodic photoresist pattern on the two surfaces of the substrate. A conductive layer is formed above the substrate for covering the photoresist pattern and the surface of the exposed substrate. The photoresist pattern and a portion of the conductive layer thereon are removed by lift-off. A voltage is applied to the substrate via the remaining conductive layer to polarize parts of the substrate.

Abstract: A heat shield and a crystal growth equipment are provided, in which the length-adjustable and hybrid-angle heat shield is provided for the crystal growth equipments. The heat shield is adapted for not only guiding the inert gas flow but also speeding up the flow rate of the gas and the cooling rate of the crystal so as to raise the axial temperature gradient at the solid-molten interface, the growth rate of the crystal and the productivity. The heat shield further can also reduce the possibility of microdefect nucleation to improve the quality of crystal at the same time. In addition, the length of heat shield can be adjusted according to the distance between the heat shield and the semiconductor material melt in different crucibles in case that the crucibles are made by different factories. This can reduce the cost of the heat shield manufacturing.

Abstract: A structure of thermal stress compensation at least comprises a substrate, a first film and a second film. The substrate has a first positive coefficient of thermal expansion. The first film having a second positive coefficient of thermal expansion is over the substrate. The second film having a third negative coefficient of thermal expansion is over the substrate.

Abstract: A light emitting device is provided. The light emitting device includes a substrate, at least one light emitting chip and a first heat dissipation element. The substrate has a top surface and a bottom surface, and contacts are disposed on the top surface. The light emitting chip disposed on the top surface of the substrate is in contact with the contacts. The light emitting chip includes a light emitting layer, a positive electrode and a negative electrode. The light emitting layer is excited to emit a light by a current applied between the positive electrode and the negative electrode. The first heat dissipation element is disposed at the bottom surface of the substrate for transferring the heat generated by the light emitting chip out of the light emitting device, thus the operation temperature of the light emitting chip can be lowered.

Abstract: A heat shield and a crystal growth equipment are provided, in which the length-adjustable and hybrid-angle heat shield is provided for the crystal growth equipments. The heat shield is adapted for not only guiding the inert gas flow but also speeding up the flow rate of the gas and the cooling rate of the crystal so as to raise the axial temperature gradient at the solid-molten interface, the growth rate of the crystal and the productivity. The heat shield further can also reduce the possibility of microdefect nucleation to improve the quality of crystal at the same time. In addition, the length of heat shield can be adjusted according to the distance between the heat shield and the semiconductor material melt in different crucibles in case that the crucibles are made by different factories. This can reduce the cost of the heat shield manufacturing.