Patents by Inventor Jyh-Wen Sheen

Jyh-Wen Sheen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11431320
    Abstract: An even-mode resonator filter is disclosed. The even-mode resonator filter is provided with high stability, and comprises: a first even-mode resonance module, a second even-mode resonance module, a first filter unit and a second filter unit. In the present invention, the first even-mode resonance module comprises a first resonance unit and a second resonance unit, and the second even-mode resonance module comprises a third resonance unit and a fourth resonance unit. By letting the second resonance unit be coupled to the first resonance unit as well as making the third resonance unit be coupled to the fourth resonance unit, the even-mode resonator filter of the present invention has the advantage of eliminating unexpected resonance.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: August 30, 2022
    Assignee: ADVANCED CERAMIC X CORPORATION
    Inventors: Jyh-Wen Sheen, Chih-Ming Chang
  • Publication number: 20220173719
    Abstract: An even-mode resonator filter is disclosed. The even-mode resonator filter is provided with high stability, and comprises: a first even-mode resonance module, a second even-mode resonance module, a first filter unit and a second filter unit. In the present invention, the first even-mode resonance module comprises a first resonance unit and a second resonance unit, and the second even-mode resonance module comprises a third resonance unit and a fourth resonance unit. By letting the second resonance unit be coupled to the first resonance unit as well as making the third resonance unit be coupled to the fourth resonance unit, the even-mode resonator filter of the present invention has the advantage of eliminating unexpected resonance.
    Type: Application
    Filed: March 16, 2021
    Publication date: June 2, 2022
    Applicant: ADVANCED CERAMIC X CORPORATION
    Inventors: Jyh-Wen Sheen, Chih-Ming Chang
  • Publication number: 20220116007
    Abstract: A coupled resonator filter is disclosed. The coupled resonator filter is provided with high quality factor, and comprises: a first resonance unit, a second resonance unit and a main adjustment unit. In the present invention, the main adjustment unit is electrically connected between the first resonance unit and the second resonance unit, and comprises an adjustable capacitor. By changing a capacitance of the adjustable capacitor, a coupling coefficient between the first resonance unit and the second resonance unit is adjusted. As a result, the coupled resonator filter of the present invention included advantages of high controllability of the frequency bandwidth and high inhibition rate of noise signal.
    Type: Application
    Filed: February 16, 2021
    Publication date: April 14, 2022
    Applicant: ADVANCED CERAMIC X CORPORATION
    Inventors: Jyh-Wen Sheen, Chih-Ming Chang
  • Patent number: 11303260
    Abstract: A coupled resonator filter is disclosed. The coupled resonator filter is provided with high quality factor, and comprises: a first resonance unit, a second resonance unit and a main adjustment unit. In the present invention, the main adjustment unit is electrically connected between the first resonance unit and the second resonance unit, and comprises an adjustable capacitor. By changing a capacitance of the adjustable capacitor, a coupling coefficient between the first resonance unit and the second resonance unit is adjusted. As a result, the coupled resonator filter of the present invention included advantages of high controllability of the frequency bandwidth and high inhibition rate of noise signal.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: April 12, 2022
    Assignee: ADVANCED CERAMIC X CORPORATION
    Inventors: Jyh-Wen Sheen, Chih-Ming Chang
  • Publication number: 20180062235
    Abstract: Differing from conventional directional coupling device being implemented on a coin-like planar board, the present invention stacks a bottom substrate, at least one phase retarding unit, at least one reference ground unit, a coupled circuit layer, a main circuit layer, and a top substrate to form a miniature directional coupling device. Because this miniature directional coupling device not occupies too much circuit area when being applied in a mobile communication product, the miniature directional coupling device can meet the requirements of light weight and compact size demanded by high-technology mobile communications for the electronic components. It is worth explaining that, since the said phase retarding unit consists of many end-to-end connected transmission wires, engineers skilled in designing microwave circuit are able to carry out the modulation of coupling flatness of the miniature directional coupling device by changing a total length of the end-to-end connected transmission wires.
    Type: Application
    Filed: August 31, 2016
    Publication date: March 1, 2018
    Inventors: JHIN-YING LYU, WEI-JEN LEE, JYH-WEN SHEEN
  • Patent number: 9905901
    Abstract: Differing from conventional directional coupling device being implemented on a coin-like planar board, the present invention stacks a bottom substrate, at least one phase retarding unit, at least one reference ground unit, a coupled circuit layer, a main circuit layer, and a top substrate to form a miniature directional coupling device. Because this miniature directional coupling device not occupies too much circuit area when being applied in a mobile communication product, the miniature directional coupling device can meet the requirements of light weight and compact size demanded by high-technology mobile communications for the electronic components. It is worth explaining that, since the said phase retarding unit consists of many end-to-end connected transmission wires, engineers skilled in designing microwave circuit are able to carry out the modulation of coupling flatness of the miniature directional coupling device by changing a total length of the end-to-end connected transmission wires.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: February 27, 2018
    Assignee: ADVANCED CERAMIC X CORPORATION
    Inventors: Jhin-Ying Lyu, Wei-Jen Lee, Jyh-Wen Sheen
  • Patent number: 9748653
    Abstract: Differing from conventionally-used miniature cubic antenna being provided with a signal transceiving conductor on the outer surface thereof, the present invention provides a multilayer chip antenna formed by sequentially stacking a first coupling substrate, a signal transceiving metal layer, and a second coupling substrate. Particularly, the first coupling substrate and the second coupling substrate are disposed with a first metal layer and a second metal layer, respectively. Therefore, when the signal transceiving metal layer transmits or receives a wireless signal, not only a first coupling capacitor is induced between the signal transceiving metal layer and the first metal layer, but also a second coupling capacitor is simultaneously induced between the signal transceiving metal layer and the third metal layer; meanwhile, the first and second coupling capacitors are helpful to enhance the impedance bandwidth as the multilayer chip antenna transmits and/or receives a high-frequency wireless signal.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: August 29, 2017
    Assignee: ACX CORPORATION
    Inventors: Wei-Ren Yang, Wei-Jen Lee, Jyh-Wen Sheen
  • Publication number: 20040046618
    Abstract: A miniaturized balun with a four-wire system may be constructed with laminated construct for coupling from an unbalanced transmission line to a balanced transmission line, wherein unbalanced signals are input from a first pair of middle substrates, whilst balanced signal outputs are set up on a second pair of substrates disposed above and below the first pair. The use of such laminated circuit board makes it possible to reduce the overall size of the balanced converter considerably and ideal to implement the converter circuit on an integrated device.
    Type: Application
    Filed: September 10, 2002
    Publication date: March 11, 2004
    Inventors: Jyh-Wen Sheen, Chin-Feng Cheng
  • Patent number: 6677833
    Abstract: A multilayer band separator with a grounding parasitic capacitor. The separator includes a quasi-highpass filter, a semi-lumped lowpass filter and a phase shifter. The quasi-highpass filter includes a third capacitor connected to an input signal, a fourth capacitor with one end connected to the third capacitor and the other end connected to ground, an inductive element with one end connected to ground and the other end connected to the connection point of the third and fourth capacitors, and a second capacitor with one end connected to the connection point of the third capacitor, the fourth capacitor and the inductive element and the other end connected to a second output to pass a high-frequency output signal. The phase shifter is a transmission line element connected to the input signal.
    Type: Grant
    Filed: April 17, 2002
    Date of Patent: January 13, 2004
    Assignee: Industrial Technology Research Institute
    Inventor: Jyh-Wen Sheen
  • Publication number: 20030193386
    Abstract: A miniaturized common mode filter is composed of multiple substrates with a positive coil and a negative coil formed on alternate substrates. The positive coils are sequentially connected via conductive through holes defined in each substrate, as are the negative coils. The pattern of each positive coil is interlaced with that of each negative coil, whereby when the positive and negative coils are alternately stacked, the positive coils do not overlap negative coils. With such an interlaced configuration of the coils, the problem of the parasitic capacitance is eliminated. Moreover, the thickness of each substrate can be decreased so the size of the entire filter is effectively reduced.
    Type: Application
    Filed: September 24, 2002
    Publication date: October 16, 2003
    Inventors: Bin-Chyi Tseng, Jyh-Wen Sheen
  • Publication number: 20030058063
    Abstract: A multilayer band separator with a grounding parasitic capacitor. The separator includes a quasi-highpass filter, a semi-lumped lowpass filter and a phase shifter. The quasi-highpass filter includes a third capacitor connected to an input signal, a fourth capacitor with one end connected to the third capacitor and the other end connected to ground, an inductive element with one end connected to ground and the other end connected to the connection point of the third and fourth capacitors, and a second capacitor with one end connected to the connection point of the third capacitor, the fourth capacitor and the inductive element and the other end connected to a second output to pass a high-frequency output signal. The phase shifter is a transmission line element connected to the input signal.
    Type: Application
    Filed: April 17, 2002
    Publication date: March 27, 2003
    Inventor: Jyh-Wen Sheen
  • Publication number: 20030001710
    Abstract: A multi-layer radio frequency chip balun comprises a multi-layer dielectric structure. The equivalent circuit of the multi-layer dielectric structure comprises mainly an input port, first and second output ports, and a few even sections of broadside coupled lines. Each section of the coupled line is wired in a particular shape and is composed of two coupled lines. Each section of coupled line corresponds to a coupled coefficient. The sections of the coupled lines have completely symmetric structures on two sides with respect to the center geometrically. Both phase and amplitude are well balanced at the balanced ports. Moreover, the balance of phase and power can be adjusted by inserting a transmission line between two broadside coupled lines to achieve more complicated impedance match. The balun can be fabricated with low dielectric constant materials. In addition to the reduction in cost, the stability of the balun is also improved.
    Type: Application
    Filed: October 29, 2001
    Publication date: January 2, 2003
    Inventors: Ching-Wen Tang, Jyh-Wen Sheen
  • Publication number: 20020140081
    Abstract: A plurality of ceramic substrates are used to manufacture and integrate a highly integrated multi-layer circuit module. Integrated circuit devices are mounted on one or both surfaces of the circuit module whose multi-layer structure is divided into three types of integration regions including inter-connection integration regions, basic passive device integration regions and high frequency passive device integration regions. Connection layers are formed in the inter-connection integration regions for connecting integrated circuits. Basic passive device integration regions include capacitor, resistor and inductor layers. Filters, couplers and baluns are fabricated in the high frequency passive device integration regions. Shielding ground planes are provided for the isolation of devices to prevent electromagnetic interference. Standard input and output contacts are formed on the bottom surface so that the circuit module can be used as a modularized device.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 3, 2002
    Inventors: Young-Huang Chou, Jyh-Wen Sheen, Wen-Jen Tseng, Chin-Li Wang, Jian-Hong Chen, Ching-Wen Tang
  • Patent number: 6459413
    Abstract: An antenna operable in multiple frequency bands used in a personal wireless communication device comprises a first radiating element, a second radiating element, and a feed radiating element. The first radiating element is shaped as an extended bent wire to function as an antenna for a first frequency band. The second radiating element functions as an antenna for a second frequency band. The feed radiating element has at least two ends. One end is used as a signal feed point so that first and second frequency signals can share the same signal feed point. The other end electrically connects the first radiating element to the second radiating element and forms a top loaded structure. The extended bent wire antenna effectively reduces the overall length of the antenna.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: October 1, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-Jen Tseng, Jyh-Wen Sheen
  • Publication number: 20020089453
    Abstract: An antenna operable in multiple frequency bands used in a personal wireless communication device comprises a first radiating element, a second radiating element, and a feed radiating element. The first radiating element is shaped as an extended bent wire to function as an antenna for a first frequency band. The second radiating element functions as an antenna for a second frequency band. The feed radiating element has at least two ends. One end is used as a signal feed point so that first and second frequency signals can share the same signal feed point. The other end electrically connects the first radiating element to the second radiating element and forms a top loaded structure. The extended bent wire antenna effectively reduces the overall length of the antenna.
    Type: Application
    Filed: January 10, 2001
    Publication date: July 11, 2002
    Inventors: Wen-Jen Tseng, Jyh-Wen Sheen
  • Patent number: 6404390
    Abstract: A wideband microstrip leaky-wave antenna, comprising a plurality of sections of antenna. Each section of antenna includes a major part of microstrip antenna, each of which has different and continuous width parameters and is connected serially by the way in which the width parameters of major part of microstrip are decreasing. Each band of each antenna's section constructs a continuous antenna's band. In addition, to prevent characteristic of bandwidth from limiting, the antenna can include a wideband feeding system. The wideband feeding system comprises at least one conductor-backed coplanar strips connected to major part of wideband antenna, a balun connected to the conductor-backed coplanar strip, and an input microstrip connected to the balun. The input microstrip is utilized for energy input, then transmitting energy to the end of the section antenna through the conductor-backed coplanar strip and the balun.
    Type: Grant
    Filed: January 18, 2001
    Date of Patent: June 11, 2002
    Assignee: Industrial Technology Research Institute
    Inventor: Jyh-Wen Sheen
  • Patent number: 6396460
    Abstract: The present invention relates to a chip antenna which comprises a substrate, a feeding pad, a feeding conductor, a matching unit, and a meandering conductor. The substrate formed with a dielectric material. By varying the length of the meandering conductor, the central frequency of the chip antenna can be properly obtained and controlled. The matching unit, which is formed by joining a matching conductor with a ground plate, uses the short-circuit function of the matching conductor to obtain the desired bandwidth. In this way, the chip antenna is well suited for applications in wireless communication systems, including personal mobile communication networks and equipment.
    Type: Grant
    Filed: May 9, 2001
    Date of Patent: May 28, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-Jen Tseng, Jyh-Wen Sheen, Jian-Hong Chen
  • Patent number: 6351192
    Abstract: A balun circuit includes a dielectric substrate having planar opposing surfaces; a groundplane conductor layer disposed on a first opposing surface; an interlayer conductor layer disposed on a second opposing surface and including first and second electrically isolated conducting strips, with a balance point gap between first ends thereof, and second ends thereof being short-circuited; an interlayer dielectric layer having substantially planar opposing surfaces, with a first opposing surface thereof being disposed over the interlayer conductor layer; and a top conductor layer disposed over a second opposing surface of the interlayer dielectric layer and including a third conducting strip overlying the first and second conducting strips, one end of the third conducting strip providing an unbalanced port terminal and another end of the third conducting strip being open-circuited.
    Type: Grant
    Filed: June 23, 2000
    Date of Patent: February 26, 2002
    Assignee: Industrial Technology Research Institute
    Inventor: Jyh-Wen Sheen
  • Patent number: 6340951
    Abstract: A wideband microstrip leaky-wave antenna comprising a substrate with a cavity, a microstrip line located on a first surface of the substrate and a conductive plate located on a second surface of substrate opposite to the first surface. Using the cavity between the microstrip line and the conductive plate can reduce the effective dielectric constant of the substrate and further increase the bandwidth of the antenna. In addition, the microstrip line also can be located in the cavity. In this case, there is no dielectric material between the microstrip line and the conductive plate.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: January 22, 2002
    Assignee: Industrial Technology Research Institute
    Inventor: Jyh-Wen Sheen
  • Publication number: 20020005807
    Abstract: A wideband microstrip leaky-wave antenna, comprising a plurality of sections of antenna. Each section of antenna includes a major part of microstrip antenna, each of which has different and continuous width parameters and is connected serially by the way in which the width parameters of major part of microstrip are decreasing. Each band of each antenna's section constructs a continuous antenna's band. In addition, To prevent characteristic of bandwidth from limiting, the antenna can include a wideband feeding system. The wideband feeding system comprises at least one conductor-backed coplaner strips connected to major part of wideband antenna, a balun connected to the conductor-backed coplaner strip, and an input microstrip connected to the balun. The input microstrip is utilized for energy input, then transmitting energy to the end of the section antenna through the conductor-backed coplaner strip and the balun.
    Type: Application
    Filed: January 18, 2001
    Publication date: January 17, 2002
    Applicant: Industrial Technology Research Institute
    Inventor: Jyh-Wen Sheen