Abstract: A method includes depositing an etch stop layer over a first conductive feature, performing a first treatment to amorphize the etch stop layer, depositing a dielectric layer over the etch stop layer, etching the dielectric layer to form an opening, etching-through the etch stop layer to extend the opening into the etch stop layer, and filling the opening with a conductive material to form a second conductive feature.

Abstract: A touch sensing module includes a touch sensing circuit substrate, a glass substrate, a shielding layer, and an adhering member. The shielding layer is made of a photoresist material, and is provided on the glass substrate to shield a periphery thereof. The adhering member has a first adhering layer and a second adhering layer which are adhered to each other, wherein the first adhering layer is adhered on the glass substrate and the shielding layer, while the second adhering layer is adhered on the touch sensing circuit substrate. An area of the first adhering layer facing the glass substrate is smaller than that of the second adhering layer facing the touch sensing circuit substrate. Or, a hardness of the first adhering layer is less than that of the second adhering layer.