Patents by Inventor Jyhwan LEE

Jyhwan LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shielding structure, semiconductor package structure with shielding structure
    Patent number: 11380625
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first device, a second device, and a shielding structure. The first device and the second device is one a first side of a substrate. The shielding structure includes a first portion and a second portion. The first portion is between the first device and the second device on the substrate, and the first portion includes a plurality of first shielding units arranged along a first direction. The second portion is between the first device and the second device, and the second portion includes a plurality of second shielding units arranged along a second direction different from the first direction. The second portion is configured as a first waveguide between the first device and the second device.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: July 5, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.
    Inventors: Soonheung Bae, Jyhwan Lee, Jaeshin Cho
  • SHIELDING STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE WITH SHIELDING STRUCTURE
    Publication number: 20220068831
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first device, a second device, and a shielding structure. The first device and the second device is one a first side of a substrate. The shielding structure includes a first portion and a second portion. The first portion is between the first device and the second device on the substrate, and the first portion includes a plurality of first shielding units arranged along a first direction. The second portion is between the first device and the second device, and the second portion includes a plurality of second shielding units arranged along a second direction different from the first direction. The second portion is configured as a first waveguide between the first device and the second device.
    Type: Application
    Filed: September 1, 2020
    Publication date: March 3, 2022
    Applicant: Advanced Semiconductor Engineering Korea, Inc.
    Inventors: Soonheung BAE, Jyhwan LEE, Jaeshin CHO