Patents by Inventor Jyongsik Jang

Jyongsik Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11312870
    Abstract: The present inventive concept relates to a copper based conductive paste and its preparation method. The copper based conductive paste comprises a copolymer-copper composite comprising an imidazole-silane copolymer with partially cross-linked structure and a copper powder, a solvent, a binder and an additive. The imidazole-silane copolymer with partially cross-linked structure is introduced into the copper powder whose surface is treated by a hydrochloric acid aqueous solution and a phosphoric acid aqueous solution. The imidazole-silane copolymer is polymerized by using an imidazole monomer represented by following formula 1, a silane monomer represented by following formula 2 and a cross-linking agent. In Formula 1, X represents a hydrogen atom (H) or a methyl group (—CH3), and R1 represents a vinyl group or an allyl group. In Formula 2, Y represents a methoxy group, a 2-methoxy ethoxy group or an acetoxy group, and R2 represents a vinyl group.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: April 26, 2022
    Inventor: Jyongsik Jang
  • Publication number: 20210324208
    Abstract: The present inventive concept relates to a copper based conductive paste and its preparation method. The copper based conductive paste comprises a copolymer-copper composite comprising an imidazole-silane copolymer with partially cross-linked structure and a copper powder, a solvent, a binder and an additive. The imidazole-silane copolymer with partially cross-linked structure is introduced into the copper powder whose surface is treated by a hydrochloric acid aqueous solution and a phosphoric acid aqueous solution. The imidazole-silane copolymer is polymerized by using an imidazole monomer represented by following formula 1, a silane monomer represented by following formula 2 and a cross-linking agent. In Formula 1, X represents a hydrogen atom (H) or a methyl group (—CH3), and R1 represents a vinyl group or an allyl group. In Formula 2, Y represents a methoxy group, a 2-methoxy ethoxy group or an acetoxy group, and R2 represents a vinyl group.
    Type: Application
    Filed: February 21, 2019
    Publication date: October 21, 2021
    Inventor: Jyongsik JANG
  • Patent number: 9945038
    Abstract: Provided are a method of producing corrosion-protective copper paste through a single process and an application thereof to a dipole tag antenna. Copper powder is surface-etched by using a hydrochloric acid in an inert gas atmosphere, a phosphoric acid aqueous solution is added thereto to form copper phosphate on the etched surface of the copper powder, and then, a vinyl imidazole-silane copolymer and poly(4-styrenesulfonate) were introduced thereto to form a corrosion-protective coating layer on the surface of copper powder on which the copper phosphate has been formed, and a centrifuge and an agate mortar are used to prepare a copper paste having high viscosity and high dispersability. When a copper paste thin film is formed on a flexible film by screen printing, a produced dipole tag antenna may have high efficiency.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: April 17, 2018
    Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Jyongsik Jang, Keunyoung Shin
  • Publication number: 20160160359
    Abstract: Provided are a method of producing corrosion-protective copper paste through a single process and an application thereof to a dipole tag antenna. Copper powder is surface-etched by using a hydrochloric acid in an inert gas atmosphere, a phosphoric acid aqueous solution is added thereto to form copper phosphate on the etched surface of the copper powder, and then, a vinyl imidazole-silane copolymer and poly(4-styrenesulfonate) were introduced thereto to form a corrosion-protective coating layer on the surface of copper powder on which the copper phosphate has been formed, and a centrifuge and an agate mortar are used to prepare a copper paste having high viscosity and high dispersability. When a copper paste thin film is formed on a flexible film by screen printing, a produced dipole tag antenna may have high efficiency.
    Type: Application
    Filed: May 27, 2014
    Publication date: June 9, 2016
    Applicant: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Jyongsik JANG, Keunyoung SHIN
  • Patent number: 9236156
    Abstract: A preparing method of a reduced graphene oxide film, a reduced graphene oxide film prepared by the preparing method, a graphene electrode including the reduced graphene oxide film, an organic thin film transistor including the graphene electrode, and an antistatic film including the reduced graphene oxide film are provided. The method for preparing a reduced graphene oxide film comprises: coating a graphene oxide-dispersed solution on a substrate to form a graphene oxide thin film; and reducing the graphene oxide thin film using a chemical reduction method and a pressure-assisted thermal reduction method to form a reduced graphene oxide film.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: January 12, 2016
    Assignee: SNU R&DB FOUNDATION
    Inventors: Sung Hyun Kim, Jyongsik Jang, Kyoung-Hwan Shin
  • Publication number: 20150111039
    Abstract: The embodiments described herein pertain generally to a preparing method of a reduced graphene oxide film, a reduced graphene oxide film prepared by the preparing method, a graphene electrode including the reduced graphene oxide film, an organic thin film transistor including the graphene electrode, and an antistatic film including the reduced graphene oxide film.
    Type: Application
    Filed: March 20, 2014
    Publication date: April 23, 2015
    Applicant: SNU R&DB FOUNDATION
    Inventors: Sung Hyun KIM, Jyongsik JANG, Kyoung-Hwan SHIN
  • Patent number: 6919063
    Abstract: The present invention relates to a novel carbon nano-particle and a novel method of preparing the same and a transparent, conductive polymer composite containing the same. The carbon nano-particle has the mean diameter of 1 through 50 nm and the shape of sphere, rod or others, which is a novel material not known in the relevant art. Because of a particle size less than ½ of the shortest wavelength of a visible ray, a transparent resin containing the carbon nano-particle can maintain the transparency. Furthermore, the carbon nano-particle has the excellent electric conductivity and the ferromagnetic property, and can be made by a novel, low cost method entirely different from those of fullerene and carbon nanotube.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: July 19, 2005
    Assignee: Dong Woon International Co., Ltd.
    Inventors: Jyongsik Jang, Joon Hak Oh, Dong Cheol Kim
  • Publication number: 20040009346
    Abstract: The present invention relates to a novel carbon nano-particle and a novel method of preparing the same and a transparent, conductive polymer composite containing the same. The carbon nano-particle has the mean diameter of 1 through 50 nm and the shape of sphere, rod or others, which is a novel material not known in the relevant art. Because of a particle size less than ½ of the shortest wavelength of a visible ray, a transparent resin containing the carbon nano-particle can maintain the transparency. Furthermore, the carbon nano-particle has the excellent electric conductivity and the ferromagnetic property, and can be made by a novel, low cost method entirely different from those of fullerene and carbon nanotube.
    Type: Application
    Filed: March 11, 2003
    Publication date: January 15, 2004
    Inventors: Jyongsik Jang, Joon Hak Oh, Dong Cheol Kim
  • Patent number: 5525677
    Abstract: Novel agents for improving adhesion performance between fibers and resins in fiber reinforced polystyrene composites and synthesizing method thereof and method for improving adhesion performance in fiber reinforced polystyrene composites by using the copolymers are disclosed.The agents are copolymers of styrene and silane coupling agents, and the copolymers can be manufactured by copolymerizing styrene monomer and silane coupling agents in benzene solvent at nitrogen atmosphere by employing azobisisobutyronitrile (AIBN) and the like as an initiator after purifying the reactants and eliminating polymerization inhibitor from the reactants.The typical copolymer is poly(styrene-co-.gamma.-MPS)(.gamma.-MPS means .gamma.-methacryloxypropyltrimethoxysilane) which is manufactured by copolymerizing styrene monomer and .gamma.-MPS.
    Type: Grant
    Filed: April 17, 1995
    Date of Patent: June 11, 1996
    Assignee: Dongbu Chemical Co., Ltd.
    Inventors: Jongkoo Jeong, Jyongsik Jang, Junyup Lee