Patents by Inventor Jyotica Patel

Jyotica Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microfabricated air bridges for quantum circuits
    Patent number: 11575077
    Abstract: A method for fabricating a bridge structure in a quantum mechanical device includes providing a substructure including a substrate having deposited thereon a layer of a first superconducting material divided into a first portion, a second portion and a third portion that are electrically insulated from each other; depositing a sacrificial layer on the substructure; electrically connecting the first portion and the second portion with a strip of a second superconducting material, the second superconducting material being different from the first superconducting material; and removing a portion of the sacrificial layer so as to form a bridge structure over the third portion between the first portion and the second portion, the bridge structure electrically connecting the first portion to the second portion while not electrically connecting the third portion to the first portion and not electrically connecting the third portion to the second portion.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: February 7, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Vivekananda P. Adiga, Hongwen Yan, John M. Papalia, David L. Rath, Jyotica Patel
  • MICROFABRICATED AIR BRIDGES FOR QUANTUM CIRCUITS
    Publication number: 20210217947
    Abstract: A method for fabricating a bridge structure in a quantum mechanical device includes providing a substructure including a substrate having deposited thereon a layer of a first superconducting material divided into a first portion, a second portion and a third portion that are electrically insulated from each other; depositing a sacrificial layer on the substructure; electrically connecting the first portion and the second portion with a strip of a second superconducting material, the second superconducting material being different from the first superconducting material; and removing a portion of the sacrificial layer so as to form a bridge structure over the third portion between the first portion and the second portion, the bridge structure electrically connecting the first portion to the second portion while not electrically connecting the third portion to the first portion and not electrically connecting the third portion to the second portion.
    Type: Application
    Filed: January 13, 2020
    Publication date: July 15, 2021
    Inventors: Vivekananda P. Adiga, Hongwen Yan, JOHN M. PAPALIA, David L. Rath, Jyotica Patel