Patents by Inventor Jyun-Chi JHAN

Jyun-Chi JHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210225741
    Abstract: A lead frame includes a die paddle, a first lead, a second lead, an extending portion and at least one supporting portion. The first lead includes a first main portion and a first I/O portion opposite to the first main portion. The second lead includes a second main portion and a second I/O portion opposite to the second main portion. The first lead and the second lead surround the die paddle. The extending portion extends from the first main portion of the first lead. The supporting portion is connected to the extending portion.
    Type: Application
    Filed: January 22, 2020
    Publication date: July 22, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: I-Jen CHEN, Guo-Cheng LIAO, Jyun-Chi JHAN, Hui-Chen HSU
  • Publication number: 20210225742
    Abstract: Present disclosure provides a lead frame, including a die paddle and a plurality of leads surrounding the die paddle. Each of the leads including a finger portion proximal to the die paddle and a lead portion distal from the die paddle. The finger portion includes a main body and at least one support structure. The respective support structures on adjacent leads are mutually isolated, and a distance between the support structure and the die paddle is smaller than a distance between the lead portion and the die paddle. A semiconductor package structure including the lead frame described herein and a semiconductor package assembly including the semiconductor package structure described herein are also provided.
    Type: Application
    Filed: January 22, 2020
    Publication date: July 22, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jyun-Chi JHAN, Guo-Cheng LIAO