Patents by Inventor Jyun-Ji LU

Jyun-Ji LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11397453
    Abstract: A heat dissipation system includes a single fan, first and second heat sources, first, second, and third heat pipes, and first and second heat dissipation arrays. The first heat pipe is thermally coupled with the first heat source. The second heat pipe is thermally coupled with the second heat source. The third heat pipe has a first position thermally coupled with the first heat pipe and a second position thermally coupled with the second heat pipe. The first heat dissipation array is arranged around the first position and thermally coupled with the third heat pipe. The second heat dissipation array is arranged around the second position and thermally coupled with the third heat pipe. The single fan is between the first and second heat sources, and configured to blow airflows towards the first and second heat sources, the first and second heat dissipation arrays.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: July 26, 2022
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Jyun-Ji Lu, Sheng-Chieh Hsu, Chih-Kai Yang
  • Publication number: 20210149463
    Abstract: A heat dissipation system includes a single fan, first and second heat sources, first, second, and third heat pipes, and first and second heat dissipation arrays. The first heat pipe is thermally coupled with the first heat source. The second heat pipe is thermally coupled with the second heat source. The third heat pipe has a first position thermally coupled with the first heat pipe and a second position thermally coupled with the second heat pipe. The first heat dissipation array is arranged around the first position and thermally coupled with the third heat pipe. The second heat dissipation array is arranged around the second position and thermally coupled with the third heat pipe. The single fan is between the first and second heat sources, and configured to blow airflows towards the first and second heat sources, the first and second heat dissipation arrays.
    Type: Application
    Filed: June 8, 2020
    Publication date: May 20, 2021
    Inventors: Jyun-Ji LU, Sheng-Chieh HSU, Chih-Kai YANG
  • Publication number: 20200159296
    Abstract: An electronic device includes a casing wall and a heat dissipation module. The heat dissipation module includes a heat dissipation fin set, a cooling fan, and an isolation layer. The heat dissipation fin set is disposed adjacent to the casing wall, and has a first air inlet and a second air inlet. The heat dissipation fin set includes a plurality of heat dissipation fins. The cooling fan has an air outlet. The air outlet is adjacent to the first air inlet and is spaced from the second air inlet. The isolation layer has at least a part between the first air inlet and the second air inlet.
    Type: Application
    Filed: December 11, 2018
    Publication date: May 21, 2020
    Inventors: Wei-Sheng ZHU, Sheng-Chieh HSU, Kai-Lin KUO, Jyun-Ji LU