Patents by Inventor Jyun-Jia Huang

Jyun-Jia Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11924534
    Abstract: This disclosure provides a lens assembly that has an optical path and includes a lens element and a light-blocking membrane layer. The lens element has an optical portion, and the optical path passes through the optical portion. The light-blocking membrane layer is coated on the lens element and adjacent to the optical portion. The light-blocking membrane layer has a distal side and a proximal side that is located closer to the optical portion than the distal side. The proximal side includes two extension structures and a recessed structure. Each of the extension structures extends along a direction away from the distal side, and the extension structures are not overlapped with each other in a direction in parallel with the optical path. The recessed structure is connected to the extension structures and recessed along a direction towards the distal side.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: March 5, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Jyun-Jia Cheng, Yu Chen Lai, Ming-Ta Chou, Cheng-Feng Lin, Chen-Yi Huang
  • Publication number: 20230228629
    Abstract: The present invention provides an adaptive temperature slope calibration method of a thermal sensor, wherein the method includes the steps of: obtaining a parameter of the thermal sensor under a temperature environment; calibrating a temperature slope of the thermal sensor by using the parameter of the thermal sensor obtained under the temperature environment without using parameter(s) of the thermal sensor under other temperature environment(s); and storing the temperature slope of the thermal sensor for subsequent use of detecting temperature.
    Type: Application
    Filed: November 20, 2022
    Publication date: July 20, 2023
    Applicant: MEDIATEK INC.
    Inventors: Min-Hang Hsieh, Jyun-Jia Huang, Chien-Sheng Chao
  • Patent number: 11513012
    Abstract: A thermal sensor with non-ideal coefficient elimination is shown. The thermal sensor has a bandgap circuit, a dual-phase voltage-to-frequency converter, and a frequency meter. The bandgap circuit outputs a temperature-dependent voltage. The dual-phase voltage-to-frequency converter is coupled to the bandgap circuit in the normal phase to perform a voltage-to-frequency conversion based on the temperature-dependent voltage, and is disconnected from the bandgap circuit in the coefficient capturing phase to perform the voltage-to-frequency conversion based on the supply voltage. The frequency meter is coupled to the dual-phase voltage-to-frequency converter to calculate the temperature-dependent frequency corresponding to the normal phase of the dual-phase voltage-to-frequency converter. The frequency meter also calculates the temperature-independent frequency corresponding to the coefficient capturing phase of the dual-phase voltage-to-frequency converter.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: November 29, 2022
    Assignee: MEDIATEK INC.
    Inventors: Ta-Hsin Lin, Jyun-Jia Huang
  • Publication number: 20220357211
    Abstract: The present invention provides a processing circuit including logic cells and a thermal sensor. The thermal sensor is positioned within the logic cells and surrounded by the logic cells, and the logic cells and the thermal sensor are all implemented by core devices.
    Type: Application
    Filed: April 13, 2022
    Publication date: November 10, 2022
    Applicant: MEDIATEK INC.
    Inventors: Min-Hang Hsieh, Jyun-Jia Huang, Chien-Sheng Chao, Ghien-An Shih, Ching-Chung Ko, Yu-Cheng Su, Lin-Chien Chen, Ai-Yun Liu, Chia-Hsin Hu
  • Patent number: 11467041
    Abstract: The present invention provides a thermal sensor integrated IC having a resistor and a converting circuit. The resistor is implemented by at least one metal line, wherein a resistance of the resistor is varied with a temperature of the resistor, the resistor has a first terminal and a second terminal, and one of the first terminal and the second terminal is arranged to provide a voltage signal corresponding to the resistance. The converting circuit is coupled to the resistor, and is configured to convert the voltage signal to an output signal for determining the temperature. In one embodiment, the at least one metal line is made by copper.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: October 11, 2022
    Assignee: MEDIATEK INC.
    Inventors: Ta-Hsin Lin, Jyun-Jia Huang
  • Publication number: 20200386629
    Abstract: A thermal sensor with non-ideal coefficient elimination is shown. The thermal sensor has a bandgap circuit, a dual-phase voltage-to-frequency converter, and a frequency meter. The bandgap circuit outputs a temperature-dependent voltage. The dual-phase voltage-to-frequency converter is coupled to the bandgap circuit in the normal phase to perform a voltage-to-frequency conversion based on the temperature-dependent voltage, and is disconnected from the bandgap circuit in the coefficient capturing phase to perform the voltage-to-frequency conversion based on the supply voltage. The frequency meter is coupled to the dual-phase voltage-to-frequency converter to calculate the temperature-dependent frequency corresponding to the normal phase of the dual-phase voltage-to-frequency converter. The frequency meter also calculates the temperature-independent frequency corresponding to the coefficient capturing phase of the dual-phase voltage-to-frequency converter.
    Type: Application
    Filed: May 6, 2020
    Publication date: December 10, 2020
    Inventors: Ta-Hsin LIN, Jyun-Jia HUANG
  • Publication number: 20190204163
    Abstract: The present invention provides a thermal sensor integrated IC having a resistor and a converting circuit. The resistor is implemented by at least one metal line, wherein a resistance of the resistor is varied with a temperature of the resistor, the resistor has a first terminal and a second terminal, and one of the first terminal and the second terminal is arranged to provide a voltage signal corresponding to the resistance. The converting circuit is coupled to the resistor, and is configured to convert the voltage signal to an output signal for determining the temperature. In one embodiment, the at least one metal line is made by copper.
    Type: Application
    Filed: October 2, 2018
    Publication date: July 4, 2019
    Inventors: Ta-Hsin Lin, Jyun-Jia Huang
  • Patent number: 9887672
    Abstract: A distortion compensation method for a class-D audio amplifier has the steps of connecting a compensation circuit to the class-D audio amplifier; providing a feed-forward signal from the compensation circuit to the loop filter, wherein the feed-forward signal contains replicate high-frequency components replicated from original high-frequency components of the class-D audio amplifier; and adding the feed-forward signal to those of the class-D audio amplifier. By adding the feed-forward signal, PWM-intermodulated distortion resulted from the high-frequency components is reduced. The class-D audio amplifier still maintains loop stability without affecting its phase margin.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: February 6, 2018
    Assignees: National Cheng Kung University, Megawin Technology Co., Ltd.
    Inventors: Tai-Haur Kuo, Shih-Hsiung Chien, Jyun-Jia Huang