Abstract: Some implementations described herein provide techniques and apparatuses for an integrated circuit device including a trench capacitor structure that has a merged region. A material filling the merged region is different than a material that is included in electrode layers of the trench capacitor structure. Furthermore, the material filling the merged region includes a coefficient of thermal expansion and a modulus of elasticity that, in combination with the architecture of the trench capacitor structure, reduce thermally induced stresses and/or strains within the integrated circuit device relative to another integrated circuit device having a trench capacitor structure including a merged region and electrode layers of a same material.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a substrate comprising first opposing sidewalls defining a first trench and second opposing sidewalls defining a second trench laterally offset from the first trench. A stack of layers comprises a plurality of conductive layers and a plurality of dielectric layers alternatingly stacked with the conductive layers. The stack of layers comprises a first segment in the first trench and a second segment in the second trench. A first lateral distance between the first segment and the second segment aligned with a first surface of the substrate is greater than a second lateral distance between the first segment and the second segment below the first surface of the substrate.

Abstract: A solar cell, comprising: a substrate, including p-n doping structure formed within said substrate; material attached to the back of said substrate, where said material includes glass mixture, aluminum material, organic medium and additive. Wherein said glass needs to be formed by combining two or more glasses: the main composition for post-mixed glass should include Al2O3, Bi2O5, B2O3, SiO2, PbO, Tl2O3 and other metal and non-metal oxides. For the material composition, aluminum powder content is 60˜80 mass %, with approximately 90 to 99.99% purity. Additives include C10˜C24 stearic acid, with the content of less than 5 mass %. The C10˜C24 stearic acid may include oleic acid. Organic medium content is roughly 20˜35 mass %. Wherein said organic medium includes 60˜90 mass % ether class organic solvent, 10˜20 mass % cellulosic resin and 1˜5 mass % of leveling agent, rheological agent or thixotropic agent.