Patents by Inventor Jyun Suzuki

Jyun Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring substrate and multi-piece wiring substrate
    Patent number: 9215802
    Abstract: A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface.
    Type: Grant
    Filed: December 25, 2012
    Date of Patent: December 15, 2015
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Jyun Suzuki, Naoki Kito, Masami Hasegawa, Chizuo Nakashima
  • WIRING SUBSTRATE AND MULTI-PIECE WIRING SUBSTRATE
    Publication number: 20140174803
    Abstract: A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface.
    Type: Application
    Filed: December 25, 2012
    Publication date: June 26, 2014
    Inventors: Jyun Suzuki, Naoki Kito, Masami Hasegawa, Chizuo Nakashima