Patents by Inventor Jyunichi Tsuchiya
Jyunichi Tsuchiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6492739Abstract: A QFP adapted to lowering the heat resistance and increasing the number of pins, and a method of producing the same. The QFP includes a heat-radiating metal plate having bumpers formed at the four corners thereof as a unitary structure, a semiconductor chip mounted on the heat-radiating metal plate, leads provided on the heat-radiating metal plate and surrounding the peripheries of the semiconductor chip, bonding wires for connecting the leads to the semiconductor chip, and a sealing resin member for sealing part of the semiconductor chip, inner leads of the leads, bonding wires and part of the heat-radiating metal plate. The tips of the bumpers integrally formed with the heat-radiating metal plate are positioned outside the tips of the outer leads that are protruding from the sealing resin member. In the QFP producing method, the heat-radiating metal plate having the bumpers and the lead frame having the leads are secured outside the sealing resin member.Type: GrantFiled: March 25, 2002Date of Patent: December 10, 2002Assignees: Hitachi, Ltd., Hitachi Tohbu Semiconductor, Ltd.Inventors: Kuniharu Muto, Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu
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Publication number: 20020096791Abstract: A QFP adapted to lowering the heat resistance and increasing the number of pins, and a method of producing the same. The QFP includes a heat-radiating metal plate having bumpers formed at the four corners thereof as a unitary structure, a semiconductor chip mounted on the heat-radiating metal plate, leads provided on the heat-radiating metal plate and surrounding the peripheries of the semiconductor chip, bonding wires for connecting the leads to the semiconductor chip, and a sealing resin member for sealing part of the semiconductor chip, inner leads of the leads, bonding wires and part of the heat-radiating metal plate. The tips of the bumpers integrally formed with the heat-radiating metal plate are positioned outside the tips of the outer leads that are protruding from the sealing resin member. In the QFP producing method, the heat- radiating metal plate having the bumpers and the lead frame having the leads are secured outside the sealing resin member.Type: ApplicationFiled: March 25, 2002Publication date: July 25, 2002Applicant: Hitachi, Ltd.Inventors: Kuniharu Muto, Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu
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Patent number: 6392308Abstract: A QFP adapted to lowering the heat resistance and increasing the number of pins, and a method of producing the same. The QFP includes a heat-radiating metal plate having bumpers formed at the four corners thereof as a unitary structure, a semiconductor chip mounted on the heat-radiating metal plate, leads provided on the heat-radiating metal plate and surrounding the peripheries of the semiconductor chip, bonding wires for connecting the leads to the semiconductor chip, and a sealing resin member for sealing part of the semiconductor chip, inner leads of the leads, bonding wires and part of the heat-radiating metal plate. The tips of the bumpers integrally formed with the heat-radiating metal plate are positioned outside the tips of the outer leads that are protruding from the sealing resin member. In the QFP producing method, the heat-radiating metal plate having the bumpers and the lead frame having the leads are secured outside the sealing resin member.Type: GrantFiled: February 28, 2001Date of Patent: May 21, 2002Assignees: Hitachi, Ltd., Hitachi Tohbu Semiconductor, Ltd.Inventors: Kuniharu Muto, Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu
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Patent number: 6320270Abstract: A QFP adapted to lowering the heat resistance and increasing the number of pins, and a method of producing the same. The QFP includes a heat-radiating metal plate having bumpers formed at the four corners thereof as a unitary structure, a semiconductor chip mounted on the heat-radiating metal plate, leads provided on the heat-radiating metal plate and surrounding the peripheries of the semiconductor chip, bonding wires for connecting the leads to the semiconductor chip, and a sealing resin member for sealing part of the semiconductor chip, inner leads of the leads, bonding wires and part of the heat-radiating metal plate. The tips of the bumpers integrally formed with the heat-radiating metal plate are positioned outside the tips of the outer leads that are protruding from the sealing resin member. In the QFP producing method, the heat- radiating metal plate having the bumpers and the lead frame having the leads are secured outside the sealing resin member.Type: GrantFiled: February 9, 2000Date of Patent: November 20, 2001Assignee: Hitachi, Ltd.Inventors: Kuniharu Muto, Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu
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Publication number: 20010006259Abstract: A QFP adapted to lowering the heat resistance and increasing the number of pins, and a method of producing the same. The QFP includes a heat-radiating metal plate having bumpers formed at the four corners thereof as a unitary structure, a semiconductor chip mounted on the heat-radiating metal plate, leads provided on the heat-radiating metal plate and surrounding the peripheries of the semiconductor chip, bonding wires for connecting the leads to the semiconductor chip, and a sealing resin member for sealing part of the semiconductor chip, inner leads of the leads, bonding wires and part of the heat-radiating metal plate. The tips of the bumpers integrally formed with the heat-radiating metal plate are positioned outside the tips of the outer leads that are protruding from the sealing resin member. In the QFP producing method, the heat- radiating metal plate having the bumpers and the lead frame having the leads are secured outside the sealing resin member.Type: ApplicationFiled: February 28, 2001Publication date: July 5, 2001Applicant: Hitachi, Ltd.Inventors: Kuniharu Muto, Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu
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Patent number: 6104085Abstract: A QFP adapted to lowering the heat resistance and increasing the number of pins, and a method of producing the same. The QFP includes a heat-radiating metal plate having bumpers formed at the four corners thereof as a unitary structure, a semiconductor chip mounted on the heat-radiating metal plate, leads provided on the heat-radiating metal plate and surrounding the peripheries of the semiconductor chip, bonding wires for connecting the leads to the semiconductor chip, and a sealing resin member for sealing part of the semiconductor chip, inner leads of the leads, bonding wires and part of the heat-radiating metal plate. The tips of the bumpers integrally formed with the heat-radiating metal plate are positioned outside the tips of the outer leads that are protruding from the sealing resin member. In the QFP producing method, the heat-radiating metal plate having the bumpers and the lead frame having the leads are secured outside the sealing resin member.Type: GrantFiled: April 27, 1999Date of Patent: August 15, 2000Assignees: Hitachi, Ltd., Hitachi Tohbu Semiconductor, Ltd.Inventors: Kuniharu Muto, Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu
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Patent number: 5808359Abstract: A QFP adapted to lowering the heat resistance and increasing the number of pins includes a heat-radiating metal plate having bumpers formed at the four corners thereof as a unitary structure, a semiconductor chip mounted on the heat-radiating metal plate, leads provided on the heat-radiating metal plate and surrounding the peripheries of the semiconductor chip, bonding wires for connecting the leads to the semiconductor chip, and a sealing resin member for sealing part of the semiconductor chip, inner leads of the leads, bonding wires and part of the heat-radiating metal plate. The tips of the bumpers integrally formed with the heat-radiating metal plate are positioned outside the tips of the outer leads that are protruding from the sealing resin member. In the QFP producing method, the heat-radiating metal plate having the bumpers and the lead frame having the leads are secured outside the sealing resin member.Type: GrantFiled: October 25, 1995Date of Patent: September 15, 1998Assignees: Hitachi, Ltd, Hitachi Tohbu Semiconductor, Ltd.Inventors: Kuniharu Muto, Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu