Patents by Inventor Jyunsuke HOKKA

Jyunsuke HOKKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRIMER COMPOSITION, PRIMER COATING FILM AND FORMATION METHOD THEREFOR, AND FORMATION METHOD FOR COATING FILM
    Publication number: 20210071028
    Abstract: Provided is a primer composition capable of forming, in a short time, a primer coating film excellent in adhesion to a metal substrate, adhesion to a polyamide resin-containing finish coating film, and corrosion resistance. A primer composition comprises: a phenol resin (A); a polyamide resin (B); and a solvent (C), wherein the phenol resin (A) is a resol-type phenol resin, the polyamide resin (B) is soluble in the solvent (C), and a solid content mass ratio (A/B) between the phenol resin (A) and the polyamide resin (B) is 80/20 to 99/1.
    Type: Application
    Filed: October 24, 2018
    Publication date: March 11, 2021
    Applicant: NIPPON PAINT INDUSTRIAL COATINGS CO., LTD.
    Inventor: Jyunsuke HOKKA