Abstract: The present invention generally relates to improvements to power banks and wireless chargers' overall durability and usefulness. Since power banks and wireless chargers have been around for a while, the present invention would take the core function of the power bank or wireless charger, encase them in water-resistant (and possibly scratch resistant) containers and combine them with either another device (ie: a watch) or another item (ie: a mirror), giving the invention a wider range of usefulness. In addition, the invention solves the issue of keeping the core function from being warm to the touch while charging in a purse, bag, or person's pant pockets. The present invention discloses three versions of itself for both power banks and wireless chargers, comprising of a storage case (FIGS. 1 and 2), cloth material (FIG. 3), and a cosmetic compact case (FIGS. 4 and 5).

Abstract: A method for generating a skyrmion, comprising: depositing a vertical metallic nanopillar electrode on a first side of a helimagnetic thin film, the helimagnetic thin film having a contact on a second side to provide a current drain; injecting a current through the vertical metallic nanopillar electrode to generate a rotating field; and applying a static upward magnetic field perpendicular to the helimagnetic thin film to maintain an FM phase background.

Abstract: An assembly and method for mounting an electronic package to a printed circuit board (PCB) in which a gasket is shaped to fit tightly around and under a perimeter edge of an electronic package. The electronic package may be carried by the PCB and comprise electrical package contacts on an underside of the package, which contact PCB contacts on the PCB. The gasket may be disposed between the underside of the package and the PCB substrate and surround the contacts, and may be shaped to fit around and under a perimeter edge of the package to protect the contacts from contamination.

Abstract: A method for generating a skyrmion, comprising: depositing a vertical metallic nanopillar electrode on a first side of a helimagnetic thin film, the helimagnetic thin film having a contact on a second side to provide a current drain; injecting a current through the vertical metallic nanopillar electrode to generate a rotating field; and applying a static upward magnetic field perpendicular to the helimagnetic thin film to maintain an FM phase background.

Abstract: An assembly and method for mounting an electronic package to a printed circuit board (PCB) in which a gasket is shaped to fit tightly around and under a perimeter edge of an electronic package.

Abstract: According to one embodiment of the invention, a digital to analog converter for converting a digital signal to an analog optical signal includes a light source and a plurality optical switches. Each optical switch is responsive to a respective one of a plurality of bits of a digital signal to selectively allow transmission of light from the light source through the switch. The digital to analog converter also includes a light combination system operable to combine the light passed through each of the switches and produce an analog optical signal indicative of the digital signal.

Abstract: According to one embodiment of the invention, a digital to analog converter for converting a digital signal to an analog optical signal includes a light source and a plurality optical switches. Each optical switch is responsive to a respective one of a plurality of bits of a digital signal to selectively allow transmission of light from the light source through the switch. The digital to analog converter also includes a light combination system operable to combine the light passed through each of the switches and produce an analog optical signal indicative of the digital signal.

Abstract: According to one embodiment of the invention, a digital to analog converter for converting a digital signal to an analog optical signal includes a light source and a plurality optical switches. Each optical switch is responsive to a respective one of a plurality of bits of a digital signal to selectively allow transmission of light from the light source through the switch. The digital to analog converter also includes a light combination system operable to combine the light passed through each of the switches and produce an analog optical signal indicative of the digital signal.

Abstract: According to one embodiment of the invention, a digital to analog converter for converting a digital signal to an analog optical signal includes a light source and a plurality optical switches. Each optical switch is responsive to a respective one of a plurality of bits of a digital signal to selectively allow transmission of light from the light source through the switch. The digital to analog converter also includes a light combination system operable to combine the light passed through each of the switches and produce an analog optical signal indicative of the digital signal.

Abstract: A specific combination of two different polyolefin clarifying and nucleating agents, namely 3,4-dimethyldibenzylidene sorbitol and p-methyldibenzylidene sorbitol is provided. Such a combination surprisingly provides improved clarification and crystallization temperatures to polypropylene articles and formulations, better than bis-p-methyldibenzylidene sorbitol alone and equivalent or better than 3,4-dimethyldibenzylidene sorbitol. Such a combination of compounds thus permits the utilization of a new additive for the purpose of modifying polyolefin properties, such as polypropylene clarification and nucleation. The inventive combination may be introduced within any polyolefin composition, again preferably polypropylene, which may then be molded into any shape or form. A method of producing a polyolefin plastic utilizing the inventive combination of compounds is also provided.

Abstract: A specific combination of two different polyolefin clarifying and nucleating agents, namely 3,4-dimethyldibenzylidene sorbitol and p-methyldibenzylidene sorbitol is provided. Such a combination surprisingly provides improved clarification and crystallization temperatures to polypropylene articles and formulations, better than bis-p-methyldibenzylidene sorbitol alone and equivalent or better than 3,4-dimethyldibenzylidene sorbitol. Such a combination of compounds thus permits the utilization of a new additive for the purpose of modifying polyolefin properties, such as polypropylene clarification and nucleation. The inventive combination may be introduced within any polyolefin composition, again preferably polypropylene, which may then be molded into any shape or form. A method of producing a polyolefin plastic utilizing the inventive combination of compounds is also provided.

Abstract: A device suitable for dispensing a plurality of like articles therefrom, the device characterized as having a plurality of columns for storing and dispensing the articles, each column having a front opening for dispensing the articles and a bottom side for holding the articles, each column having resilient spring means for biasing the articles towards the front opening of the column, the improvement being a tilt ramp attached to the front opening, wherein the ramp is at a decreased angle.

Abstract: A device suitable for dispensing a plurality of like articles therefrom, the device characterized as having a plurality of columns for storing and dispensing the articles, each column having a front opening for dispensing the articles and a bottom side for holding the articles, each column having resilient spring means for biasing the articles towards the front opening of the column, the improvement being a tilt ramp attached to the front opening, wherein the ramp is at a decreased angle

Abstract: Solder is deposited on chip elements or other potentially irregular surfaces by applying solder paste to a thin porous sheet such as cotton twill cloth so that the solder paste fills open areas therein. The solder volume is thus regulated by the texture and structure of the porous sheet. The porous sheet is then placed in compression against the surface to which solder is to be applied and the solder in the solder paste reflowed in an oven, preferably including a nitrogen atmosphere. At the same time, excess flux is absorbed by the porous sheet to facilitate subsequent cleaning while the reflow of solder is accurately and repeatably controlled. The process and resulting structure are particularly appropriate to the manufacture of discrete electronic devices which include an array of chip components such as capacitor chips sandwiched between plate structures. The process and structure also provides highly repeatable, high quality solder connections between curved surfaces.

Abstract: Disclosed is a high solidus temperature, high service temperature, high strength ternary solder alloy. The components of the alloy are a major portion of Sn and lesser portions of Bi, and In.

Abstract: A high solidus temperature, high service temperature, high strength multi-component solder alloy having a major portion of Sn and effective amounts of Sb, Bi and Cu.

Abstract: Disclosed is a lead-free, high solidus temperature, high Sn alloy. The solder alloys contain in excess of 90 weight percent Sn, and an effective amount of Ag and Bi, optionally with Sb or with Sb and Cu. Another form of the alloy contains Ag and Sb, optionally with Bi.

Abstract: The lead free alloy is a low solidus temperature, multi-component solder alloy containing at least about 50 weight percent Bi, up to about 50 weight percent Sn (basis total Sn and Bi), and an effective amount of a physical and mechanical property enhancing third component. The third component can be Cu, In, Ag, and combinations of Cu and Ag.

Abstract: Disclosed is a high solidus temperature, high service temperature, high strength ternary solder alloy. The components of the alloy are a major portion of Sn and lesser portions of Bi, and In.

Abstract: Disclosed is a high solidus temperature, high service temperature, high strength multi-component solder alloy containing a major portion of Sn, and effective amounts of Ag, Bi and In. Preferably the solder alloy contains 78.4 weight percent Sn, 2.0 weight % Ag, 9.8 weight % Bi, and 9.8 weight % In.