Patents by Inventor K. Subramani
K. Subramani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12170186Abstract: Methods and apparatus for substrate processing are described. In some embodiments a showerhead assembly includes a heated showerhead having a heater and a gas diffusion plate coupled to the heater, the gas diffusion plate having a plurality of channels extending through the gas diffusion plate; an ion filter spaced from the heated showerhead, the ion filter having a first side facing the heated showerhead and a second side opposite the first side, the ion filter having a plurality of channels extending through the ion filter; a heat transfer ring in contact between the heated showerhead and the ion filter, the heat transfer ring being thermally conductive and electrically insulative, the heat transfer ring comprised of a plurality of elements spaced from one another along an interface between the heated showerhead and the ion filter; and a remote plasma region defined between the heated showerhead and the ion filter.Type: GrantFiled: April 15, 2022Date of Patent: December 17, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Anantha K. Subramani, Seyyed Abdolreza Fazeli, Yang Guo, Chandrashekara Baginagere, Ramcharan Sundar, Yunho Kim, Rajasekhar Patibandla
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Patent number: 12142458Abstract: Plasma source assemblies comprising a housing with an RF hot electrode having a body and a plurality of source electrodes extending vertically from the RF hot electrode toward the opening in a front face of the housing are described. Processing chambers incorporating the plasma source assemblies and methods of using the plasma source assemblies are also described.Type: GrantFiled: December 29, 2020Date of Patent: November 12, 2024Assignee: Applied Materials, Inc.Inventors: Anantha K. Subramani, Farzad Houshmand, Philip A. Kraus, Abhishek Chowdhury, John C. Forster, Kallol Bera
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Patent number: 11982359Abstract: Described are isolation valves, and chamber systems incorporating and methods of using the isolation valves. In some embodiments, an isolation valve may include a valve body and a flapper assembly. The valve body may define a first fluid volume, a second fluid volume, and a seating surface. The flapper assembly may include a flapper disposed inside the valve body having a flapper surface complimentary to the seating surface. The flapper may be pivotable within the valve body to a first position such that the flapper surface may be away from the seating surface to allow fluid flow between the first fluid volume and the second fluid volume. The flapper may be pivotable within the valve body to a second position such that the flapper surface may be proximate the seating surface to form a non-contact seal to restrict fluid flow between the first fluid volume and the second fluid volume.Type: GrantFiled: July 22, 2020Date of Patent: May 14, 2024Assignee: Applied Materials, Inc.Inventors: Benjamin Riordon, Anantha K. Subramani, Charles T. Carlson
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Patent number: 11953097Abstract: Described are isolation valves, and chamber systems incorporating and methods of using the isolation valves. In some embodiments, an isolation valve may include a valve body and a flapper assembly. The valve body may define a first fluid volume, a second fluid volume, and a seating surface. The flapper assembly may include a flapper disposed inside the valve body having a flapper surface complimentary to the seating surface. The flapper may be pivotable within the valve body to a first position such that the flapper surface may be away from the seating surface to allow fluid flow between the first fluid volume and the second fluid volume. The flapper may be pivotable within the valve body to a second position such that the flapper surface may be proximate the seating surface to form a non-contact seal to restrict fluid flow between the first fluid volume and the second fluid volume.Type: GrantFiled: July 22, 2020Date of Patent: April 9, 2024Assignee: Applied Materials, Inc.Inventors: Benjamin Riordon, Anantha K. Subramani, Charles T. Carlson
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Patent number: 11946140Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body. The first lid plate may define a plurality of apertures through the first lid plate. The systems may include a plurality of lid stacks equal to a number of the plurality of apertures. The systems may define a plurality of isolators. An isolator may be positioned between each lid stack and a corresponding aperture of the plurality of apertures. The systems may include a plurality of annular spacers. An annular spacer of the plurality of annular spacers may be positioned between each isolator and a corresponding lid stack of the plurality of lids stacks. The systems may include a plurality of manifolds. A manifold may be seated within an interior of each annular spacer of the plurality of annular spacers.Type: GrantFiled: March 26, 2021Date of Patent: April 2, 2024Assignee: Applied Materials, Inc.Inventors: Anantha K. Subramani, Seyyed Abdolreza Fazeli, Yang Guo, Ramcharan Sundar, Arun Kumar Kotrappa, Steven Mosbrucker, Steven D. Marcus, Xinhai Han, Kesong Hu, Tianyang Li, Philip A. Kraus
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Publication number: 20240068096Abstract: In some embodiments, a showerhead assembly includes a heated showerhead having a heater plate and a gas distribution plate coupled together; an ion filter spaced from the heated showerhead; a spacer ring in contact between the heated showerhead and the ion filter; a remote plasma region between the heated showerhead and the ion filter; an upper isolator spaced from the spacer ring and supported on the ion filter; a sealing ring fastened to the heated showerhead sealing against the upper isolator and pushing the upper isolator against the ion filter; a gap between a bottom of the gas distribution plate and a top of the ion filter, the gap being in fluid communication with the remote plasma region; a first passage extending through the heater plate; and a second passage in communication with the first passage and extending through the gas distribution plate, the second passage extending to the gap.Type: ApplicationFiled: May 18, 2023Publication date: February 29, 2024Inventors: Anantha K. SUBRAMANI, Seyyed Abdolreza FAZELI, Yang GUO, Chandrashekara BAGINAGERE, Ramcharan SUNDAR, Steven MOSBRUCKER, John LEE, Yiyang WAN, Shumao ZHANG, Dhritiman Subha KASHYAP, Azhar ALI M.A
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Publication number: 20230390811Abstract: Exemplary semiconductor processing systems may include a processing chamber defining a processing region. The systems may include a foreline coupled with the processing chamber, the foreline defining a fluid conduit. The systems may include a radical generator having an inlet and an outlet. The outlet may be fluidly coupled with the foreline. The systems may include a gas source fluidly coupled with the inlet of the radical generator. The systems may include a throttle valve coupled with the foreline downstream of the radical generator.Type: ApplicationFiled: June 6, 2022Publication date: December 7, 2023Applicant: Applied Materials, Inc.Inventors: Khokan Chandra Paul, Truong Van Nguyen, Kelvin Chan, Diwakar Kedlaya, Anantha K. Subramani, Abdul Aziz Khaja, Vijet Patil, Yusheng Fang, Liangfa Hu, Prashant Kumar Kulshreshtha
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Patent number: 11830710Abstract: Apparatus and methods for forming and using internally divisible physical vapor deposition (PVD) process chambers using shutter disks are provided herein. In some embodiments, an internally divisible process chamber may include an upper chamber portion having a conical shield, a conical adaptor, a cover ring, and a target, a lower chamber portion having a substrate support having inner and outer deposition rings, and wherein the substrate support is vertically movable, and a shutter disk assembly configured to internally divide the process chamber and create a separate sealed deposition cavity and a separate sealed oxidation cavity, wherein the shutter disk assembly includes one or more seals disposed along its outer edges and configured to contact at least one of the conical shield, the conical adaptor, or the deposition rings to form the separate sealed deposition and oxidation cavities.Type: GrantFiled: June 24, 2022Date of Patent: November 28, 2023Assignee: APPLIED MATERIALS, INC.Inventors: John Joseph Mazzocco, Anantha K. Subramani, Yang Guo
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Microwave plasma source for spatial plasma enhanced atomic layer deposition (PE-ALD) processing tool
Patent number: 11823871Abstract: Plasma source assemblies, gas distribution assemblies including the plasma source assembly and methods of generating plasma are described. The plasma source assemblies include a powered electrode with a ground electrode adjacent a first side and a dielectric adjacent a second side. A first microwave generator is electrically coupled to the first end of the powered electrode through a first feed and a second microwave generator is electrically coupled to the second end of the powered electrode through a second feed.Type: GrantFiled: March 1, 2019Date of Patent: November 21, 2023Assignee: Applied Materials, Inc.Inventors: Jozef Kudela, Tsutomu Tanaka, Alexander V. Garachtchenko, Dmitry A. Dzilno, Avinash Shervegar, Kallol Bera, Xiaopu Li, Anantha K. Subramani, John C. Forster -
Patent number: 11802340Abstract: A cooling chamber comprising a support plate connected to a cryo pump and turbo pump, a clamp ring with a plurality of clamp pads on the bottom thereof where each clamp pad has a beveled surface directed downward and a lift plate to move the clamp ring from a clamp position to a loading position are described. Cluster tools incorporating the cooling chamber and methods of using the cooling chamber are also described.Type: GrantFiled: December 12, 2017Date of Patent: October 31, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Bharath Swaminathan, John Mazzocco, Hanbing Wu, Ashish Goel, Anantha K. Subramani
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Publication number: 20230335377Abstract: Methods and apparatus for substrate processing are described. In some embodiments a showerhead assembly includes a heated showerhead having a heater and a gas diffusion plate coupled to the heater, the gas diffusion plate having a plurality of channels extending through the gas diffusion plate; an ion filter spaced from the heated showerhead, the ion filter having a first side facing the heated showerhead and a second side opposite the first side, the ion filter having a plurality of channels extending through the ion filter; a heat transfer ring in contact between the heated showerhead and the ion filter, the heat transfer ring being thermally conductive and electrically insulative, the heat transfer ring comprised of a plurality of elements spaced from one another along an interface between the heated showerhead and the ion filter; and a remote plasma region defined between the heated showerhead and the ion filter.Type: ApplicationFiled: April 15, 2022Publication date: October 19, 2023Inventors: Anantha K. SUBRAMANI, Seyyed Abdolreza FAZELI, Yang GUO, Chandrashekara BAGINAGERE, Ramcharan SUNDAR, Yunho KIM, Rajasekhar PATIBANDLA
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Patent number: 11600476Abstract: A deposition system, and a method of operation thereof, includes: a cathode; a shroud below the cathode; a rotating shield below the cathode for exposing the cathode through the shroud and through a shield hole of the rotating shield; and a rotating pedestal for producing a material to form a carrier over the rotating pedestal, wherein the material having a non-uniformity constraint of less than 1% of a thickness of the material and the cathode having an angle between the cathode and the carrier.Type: GrantFiled: October 18, 2021Date of Patent: March 7, 2023Assignee: Applied Materials, Inc.Inventors: Anantha K. Subramani, Deepak Jadhav, Ashish Goel, Hanbing Wu, Prashanth Kothnur, Chi Hong Ching
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Patent number: 11545347Abstract: Apparatus and methods for forming and using internally divisible physical vapor deposition (PVD) process chambers using shutter disks are provided herein. In some embodiments, an internally divisible process chamber may include an upper chamber portion having a conical shield, a conical adaptor, a cover ring, and a target, a lower chamber portion having a substrate support having inner and outer deposition rings, and wherein the substrate support is vertically movable, and a shutter disk assembly configured to internally divide the process chamber and create a separate sealed deposition cavity and a separate sealed oxidation cavity, wherein the shutter disk assembly includes one or more seals disposed along its outer edges and configured to contact at least one of the conical shield, the conical adaptor, or the deposition rings to form the separate sealed deposition and oxidation cavities.Type: GrantFiled: February 24, 2021Date of Patent: January 3, 2023Assignee: APPLIED MATERIALS, INC.Inventors: John Joseph Mazzocco, Anantha K. Subramani, Yang Guo
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Publication number: 20220319822Abstract: Apparatus and methods for forming and using internally divisible physical vapor deposition (PVD) process chambers using shutter disks are provided herein. In some embodiments, an internally divisible process chamber may include an upper chamber portion having a conical shield, a conical adaptor, a cover ring, and a target, a lower chamber portion having a substrate support having inner and outer deposition rings, and wherein the substrate support is vertically movable, and a shutter disk assembly configured to internally divide the process chamber and create a separate sealed deposition cavity and a separate sealed oxidation cavity, wherein the shutter disk assembly includes one or more seals disposed along its outer edges and configured to contact at least one of the conical shield, the conical adaptor, or the deposition rings to form the separate sealed deposition and oxidation cavities.Type: ApplicationFiled: June 24, 2022Publication date: October 6, 2022Inventors: John Joseph MAZZOCCO, Anantha K. SUBRAMANI, Yang GUO
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Publication number: 20220307131Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body. The first lid plate may define a plurality of apertures through the first lid plate. The systems may include a plurality of lid stacks equal to a number of the plurality of apertures. The systems may define a plurality of isolators. An isolator may be positioned between each lid stack and a corresponding aperture of the plurality of apertures. The systems may include a plurality of annular spacers. An annular spacer of the plurality of annular spacers may be positioned between each isolator and a corresponding lid stack of the plurality of lids stacks. The systems may include a plurality of manifolds. A manifold may be seated within an interior of each annular spacer of the plurality of annular spacers.Type: ApplicationFiled: March 26, 2021Publication date: September 29, 2022Applicant: Applied Materials, Inc.Inventors: Anantha K. Subramani, Seyyed Abdolreza Fazeli, Yang Guo, Ramcharan Sundar, Arun Kumar Kotrappa, Steven Mosbrucker, Steven D. Marcus, Xinhai Han, Kesong Hu, Tianyang Li, Philip A. Kraus
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Patent number: 11446740Abstract: An additive manufacturing system includes a platen to support an object to be fabricated, a dispenser assembly positioned above the platen, and an energy source configured to selectively fuse a layer of powder. The dispenser assembly includes a first dispenser, a second dispenser, and a drive system. The first dispenser delivers a first powder in a first linear region that extends along a first axis, and the second dispenser delivers a second powder in a second linear region that extends parallel to the first linear region and is offset from the first linear region along a second axis perpendicular to the first axis. The drive system a drive system moves the support with the first dispenser and second dispenser together along the second axis.Type: GrantFiled: March 30, 2018Date of Patent: September 20, 2022Assignee: Applied Materials, Inc.Inventors: Christopher A. Rowland, Anantha K. Subramani, Kasiraman Krishnan, Kartik Ramaswamy, Thomas B. Brezoczky, Swaminathan Srinivasan, Jennifer Y. Sun, Simon Yavelberg, Srinivas D. Nemani, Nag B. Patibandla, Hou T. Ng
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Patent number: 11371148Abstract: A method includes receiving one or more parameters associated with a plurality of metal plates. The method further includes determining, based on the one or more parameters, a plurality of predicted deformation values associated with the plurality of metal plates. Each of the plurality of predicted deformation values correspond to a corresponding metal plate of the plurality of metal plates. The method further includes causing, based on the plurality of predicted deformation values, the plurality of metal plates to be diffusion bonded to produce a bonded metal plate structure.Type: GrantFiled: August 24, 2020Date of Patent: June 28, 2022Assignee: Applied Materials, Inc.Inventors: Sumit Agarwal, Anantha K Subramani, Yang Guo, Siva Chandrasekar
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Patent number: 11368003Abstract: Embodiments of the present disclosure generally relate to a unitary electrical conduit that includes a central conductor, a socket coupled to a first end of the central conductor, a male insert coupled to a second end of the central conductor a dielectric sheath surrounding the central conductor, and an outer conductor surrounding the dielectric sheath, wherein a substantially 90 degree bend is formed along a length thereof.Type: GrantFiled: June 3, 2020Date of Patent: June 21, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Philip Allan Kraus, Anantha K. Subramani
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Patent number: 11335543Abstract: Embodiments disclosed herein include an RF return assembly. In an embodiment, the RF return assembly comprises a first plate with a flange, where a first hole and a second hole pass through the flange. The RF return assembly may further comprise a second plate over the first plate, and a first body positioned above the flange. In an embodiment, the RF return assembly further comprises a second body positioned below the flange, where the first body is affixed to the second body by a pillar that passes through the first hole. In an embodiment, the RF return assembly further comprises a spring attached between the second plate and the second body, where the spring passes through the second hole, and a conductive band to electrically couple the first body to the flange.Type: GrantFiled: March 25, 2020Date of Patent: May 17, 2022Assignee: Applied Materials, Inc.Inventors: Anantha K. Subramani, Arun Kumar Kotrappa, Hanish Panavalappil Kumarankutty Kumar, Ramcharan Sundar
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Publication number: 20220139684Abstract: Apparatus and methods for forming and using internally divisible physical vapor deposition (PVD) process chambers using shutter disks are provided herein. In some embodiments, an internally divisible process chamber may include an upper chamber portion having a conical shield, a conical adaptor, a cover ring, and a target, a lower chamber portion having a substrate support having inner and outer deposition rings, and wherein the substrate support is vertically movable, and a shutter disk assembly configured to internally divide the process chamber and create a separate sealed deposition cavity and a separate sealed oxidation cavity, wherein the shutter disk assembly includes one or more seals disposed along its outer edges and configured to contact at least one of the conical shield, the conical adaptor, or the deposition rings to form the separate sealed deposition and oxidation cavities.Type: ApplicationFiled: February 24, 2021Publication date: May 5, 2022Inventors: John Joseph MAZZOCCO, Anantha K. SUBRAMANI, Yang GUO