Abstract: A method for making a light-emitting diode (LED) emitter module includes providing a substrate and providing two or more groups of LED dies disposed on the substrate. Each group has one or more LED dies, and each of the LED dies is coupled to an electrical contact and electrical paths are configured for feeding separate electrical currents to the groups of LED dies. The method also includes determining information associating a plurality output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with an LED die from one of the two or more groups of LED dies. The method also includes storing the information in the memory device, and providing a circuit for accessing the information in a memory device.

Abstract: The present utility model discloses an oil-smoke removal device, including an oil-smoke removal device body, which is provided with an air inlet at one end, and an air outlet at the other end, and an absorption and decomposition device for decomposing and absorbing the oil-smoke is provided in the middle of the oil-smoke removal device body. The oil-smoke removal device provided by the present utility model is a structure mainly applied for absorbing oil-smoke during barbecue, and it uses the absorption and decomposition device in the structure to achieve the objective of effective adsorption and decomposition of the oil-smoke contained in the oil-smoke gas, which greatly reduces the environmental pollution caused by oil-smoke emissions, resulting in a very good effect in the practical application.

Abstract: An emitter for an LED-based lighting device has multiple groups of LEDs that are independently addressable, allowing the emitter to be tuned to a desired color bin (e.g., a specific white color) by adjusting the relative current supplied to different groups. The LED dies for the groups and a phosphor chip for each LED die are individually selected such that each LED-die/phosphor-chip combination produces light in a desired source region associated with the group to which the LED belongs. Robotic pick-and-place systems can be used to automate assembly of the emitters by selecting LED dies from a bin based on spectral characteristics and phosphor chips from a number of distinct phosphor chip types.

Abstract: A method for making a light-emitting diode (LED) emitter module includes providing a substrate and providing two or more groups of LED dies disposed on the substrate. Each group has one or more LED dies, and each of the LED dies is coupled to an electrical contact and electrical paths are configured for feeding separate electrical currents to the groups of LED dies. The method also includes determining information associating a plurality output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with an LED die from one of the two or more groups of LED dies. The method also includes storing the information in the memory device, and providing a circuit for accessing the information in a memory device.

Abstract: A light emitting device can include a substrate with LED chips disposed on a surface of the substrate. The LED chips can include chips of at least four different colors. Electrical paths disposed in part on the substrate and in part within the substrate can connect the LED chips into at least three independently addressable groups, and the number of independently addressable groups can be less than the number of colors of LED chips, so that at least one of the groups includes LED chips of two or more different colors.

Abstract: A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.

Abstract: A method for making a light-emitting diode (LED) emitter module includes providing a substrate and providing two or more groups of LED dies disposed on the substrate. Each group has one or more LED dies, and each of the LED dies is coupled to an electrical contact and electrical paths are configured for feeding separate electrical currents to the groups of LED dies. The method also includes determining information associating a plurality output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with an LED die from one of the two or more groups of LED dies. The method also includes storing the information in the memory device, and providing a circuit for accessing the information in the memory device.

Abstract: A light emitting device can include a substrate with LED chips disposed on a surface of the substrate. The LED chips can include chips of at least four different colors. Electrical paths disposed in part on the substrate and in part within the substrate can connect the LED chips into at least three independently addressable groups, and the number of independently addressable groups can be less than the number of colors of LED chips, so that at least one of the groups includes LED chips of two or more different colors.

Abstract: A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.

Abstract: LED-based light source modules can incorporate color tunability and brightness control, allowing a user to select a desired color temperature and/or brightness and to change either or both dynamically. An emitter can include multiple independently addressable groups of LEDs, each emitting light of a different color. By controlling the relative operating current provided to each group, a desired color temperature can be achieved, and by controlling the absolute operating currents, the brightness of the output light can be controlled. Pulse width modulation (PWM) can be used to control the relative and absolute operating currents. Smooth, gradual transitions between brightness and/or color temperature settings in response to changes can be provided.

Abstract: A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.

Abstract: LED-based light source modules can incorporate color tunability and brightness control, allowing a user to select a desired color temperature and/or brightness and to change either or both dynamically. An emitter can include multiple independently addressable groups of LEDs, each emitting light of a different color. By controlling the relative operating current provided to each group, a desired color temperature can be achieved, and by controlling the absolute operating currents, the brightness of the output light can be controlled. Pulse width modulation (PWM) can be used to control the relative and absolute operating currents. Smooth, gradual transitions between brightness and/or color temperature settings in response to changes can be provided.

Abstract: A first sequence of pulses having a high frequency can be modulated using a second sequence of pulses having a lower frequency. The pulse width of the second sequence of pulses can be perturbed from a nominal pulse width on a per-pulse basis, within a perturbation range corresponding to the pulse period of the first sequence of pulses. In one application, the resulting output can be used to drive LEDs. In some instances, two or more channels of LEDs of different colors can be supported, with the pulse width of the first pulse sequence being selected per-channel based on a desired light color and the nominal pulse width of the second pulse sequence being selected for all channels based on a desired brightness.

Abstract: A method for making a light-emitting diode (LED) emitter module includes providing a substrate and providing two or more groups of LED dies disposed on the substrate. Each group has one or more LED dies, and each of the LED dies is coupled to an electrical contact and electrical paths are configured for feeding separate electrical currents to the groups of LED dies. The method also includes determining information associating a plurality output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with an LED die from one of the two or more groups of LED dies. The method also includes storing the information in the memory device, and providing a circuit for accessing the information in the memory device.

Abstract: A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.

Abstract: A light-emitting diode (LED) emitter module includes a substrate having a plurality of base layers of an electrically insulating material, a plurality of electrical contacts disposed on a top one of the base layer, and a plurality of electrical paths coupled to the electrical contacts, wherein at least a portion of the plurality of electrical paths is disposed between the base layers. The emitter module also includes two or more groups of light-emitting diodes (LEDs), each group having one or more LEDs, and each of the LEDs is coupled to an electrical contact. The electrical paths are configured for feeding separate electrical currents to the groups of LEDs. The emitter module also includes a memory device containing information associating a plurality of output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying an electric current for each of the two or more groups of LEDs.

Abstract: A first sequence of pulses having a high frequency can be modulated using a second sequence of pulses having a lower frequency. The pulse width of the second sequence of pulses can be perturbed from a nominal pulse width on a per-pulse basis, within a perturbation range corresponding to the pulse period of the first sequence of pulses. In one application, the resulting output can be used to drive LEDs. In some instances, two or more channels of LEDs of different colors can be supported, with the pulse width of the first pulse sequence being selected per-channel based on a desired light color and the nominal pulse width of the second pulse sequence being selected for all channels based on a desired brightness.

Abstract: The color of an LED-based lamp can be tuned to a desired color or color temperature. The lamp can include two or more independently addressable groups of LEDs associated with different colors or color temperatures and a total-internal-reflection (TIR) color-mixing lens to produce light of a uniform color by mixing the light from the different groups of LEDs. The color of the output light is tuned by controllably dividing an input current among the groups of LEDs. Tuning can be performed once, e.g., during manufacture, and the lamp does not require active feedback components for maintaining color temperature.

Abstract: The color of an LED-based lamp can be tuned to a desired color or color temperature. The lamp can include two or more independently addressable groups of LEDs associated with different colors or color temperatures and a total-internal-reflection (TIR) color-mixing lens to produce light of a uniform color by mixing the light from the different groups of LEDs. The color of the output light is tuned by controllably dividing an input current among the groups of LEDs. Tuning can be performed once, e.g., during manufacture, and the lamp does not require active feedback components for maintaining color temperature.

Abstract: An emitter for an LED-based lighting device has multiple groups of LEDs that are independently addressable, allowing the emitter to be tuned to a desired color bin (e.g., a specific white color) by adjusting the relative current supplied to different groups. The LED dies for the groups and a phosphor chip for each LED die are individually selected such that each LED-die/phosphor-chip combination produces light in a desired source region associated with the group to which the LED belongs. Robotic pick-and-place systems can be used to automate assembly of the emitters by selecting LED dies from a bin based on based on spectral characteristics and phosphor chips from a number of distinct phosphor chip types.