Abstract: A semiconductor package circuit board has an indicator for specifying a location of a defective circuit board unit. The semiconductor package circuit board includes circuit board units arranged in an m-by-n matrix pattern. The indicator has marking areas arranged in an m-by-n matrix pattern so that the marking areas are marked in correspondence to locations of identified defective circuit board units of the circuit board units. An operator can readily put a defective mark on the indicator without any confusion. The operator or a sensor can readily recognize the defective mark. Since the indicator can be formed on the circuit board unit, the integration of the semiconductor package circuit board can be increased, and the productivity can be substantially improved. Furthermore, a pathway of the sensor can be reduced, and interferences that might occur if the sensor moves can be hindered.