Patents by Inventor Ka Fai Edward Lau

Ka Fai Edward Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10694800
    Abstract: A manufacturing method including providing a mold including at least two mold parts having first and second molding surfaces which are complementarily profiled to give shape to headwear; shaping a first substrate in the mold resulting in the first substrate having a non-planar profile which matches at least a portion of the profile of the molding surfaces; shaping a second substrate in the mold resulting in the second substrate having a non-planar profile which matches the profile of the molding surfaces; overlaying the first substrate on the second substrate and matching their non-planar profile to form a combined substrate; placing a third substrate in the mold with the combined substrate, sandwiching the first substrate; and shaping the third substrate with the combined substrate in the mold resulting in the third substrate having a non-planar profile which matches the profile of the molding surfaces, thereby forming a seamless structure for the headwear.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: June 30, 2020
    Assignee: ROYAL SHINY (HONG KONG) LIMITED
    Inventor: Ka Fai Edward Lau
  • Publication number: 20170265552
    Abstract: A manufacturing method including providing a mould including at least two mould parts having first and second moulding surfaces which are complementarily profiled to give shape to headwear; shaping a first substrate in the mould resulting in the first substrate having a non-planar profile which matches at least a portion of the profile of the moulding surfaces;shaping a second substrate in the mould resulting in the second substrate having a non-planar profile which matches the profile of the moulding surfaces; overlaying the first substrate on the second substrate and matching their non-planar profile to form a combined substrate; placing a third substrate in the mould with the combined substrate, sandwiching the first substrate; and shaping the third substrate with the combined substrate in the mould resulting in the third substrate having a non-planar profile which matches the profile of the moulding surfaces, thereby forming a seamless structure for the headwear.
    Type: Application
    Filed: December 16, 2016
    Publication date: September 21, 2017
    Inventor: Ka Fai Edward Lau