Abstract: An electronic device comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity in a first surface and a plurality of lead through holes with inlet guides extending from the cavity to a second surface having a circuit thereon, an electronic element mounted in the cavity and having a plurality of leads, a plurality of the leads extending via the through holes from the element to the second surface, and a plurality of lead terminal recesses formed at the second surface for for receiving and forming terminal ends and connections of the leads to the circuit on the second surface.

Abstract: An electronic component adapted for surface mounting on a PC board has an elongate bobbin made of a dielectric material. A coil of wire is wound about the winding support surface of the bobbin. The coil has a pair of lead terminations which are wrapped around a pair of T-shaped lead termination support members extending from the same side of the bobbin. When the bobbin rests on top of a PC board, the support members position the wrapped lead terminations slightly above solder pads.

Abstract: A single in-line package adapted for surface mounting to a printed circuit board comprises an electronic component, a plurality of leads and a specially configured housing that encloses and protects the electronic component. The outer ends of the leads extend adjacent a tapered lower edge of the housing. The housing further has projections for engaging the upper surface of a printed circuit board to maintain the housing in a stable upright orientation with the outer ends of the leads in physical contact with corresponding solder pads on the printed circuit board during solder re-flow. The tapered edge of the housing is configured to permit subsequent inspection of a plurality of resulting solder joints for acceptable whetting.