Patents by Inventor Ka-Lok Leung

Ka-Lok Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WEATHERABLE LAYER FOR PHOTOVOLTAIC MODULE
    Publication number: 20120240981
    Abstract: The invention relates to a photovoltaic (PV) module including a weatherable layer, wherein the weatherable layer comprises thermoplastic vulcanizate (TPV). The weatherable layer endows the PV module with excellent temperature resistance, weatherability, and chemical resistance.
    Type: Application
    Filed: March 24, 2011
    Publication date: September 27, 2012
    Applicant: DU PONT APOLLO LTD.
    Inventors: Stephen Yau Sang Cheng, Ka-Lok Leung
  • WEATHERABLE LAYER FOR PHOTOVOLTAIC MODULE
    Publication number: 20120234376
    Abstract: The invention relates to a photovoltaic (PV) module including a weatherable layer, wherein the weatherable layer comprises an acrylic polymer. The weatherable layer endows the PV module with excellent temperature resistance, weatherability, and chemical resistance.
    Type: Application
    Filed: March 18, 2011
    Publication date: September 20, 2012
    Applicant: DU PONT APOLLO LTD.
    Inventors: Stephen Yau Sang CHENG, Ka-Lok LEUNG
  • POWDER COATING FOR PHOTOVOLTAIC MODULE
    Publication number: 20120090778
    Abstract: Disclosed herein is a backsheet for a photovoltaic module. The backsheet includes a dielectric layer, an adhesive layer disposed on the dielectric layer, a barrier layer disposed on the adhesive layer and bonded to the dielectric layer via the adhesive layer, and a weather resistant layer directly disposed on and bonded to the barrier layer by a powder coating method.
    Type: Application
    Filed: October 18, 2010
    Publication date: April 19, 2012
    Applicant: Du Pont Apollo Limited
    Inventors: Stephen Yau-Sang CHENG, Ka-Lok LEUNG
  • Apparatus and method for thin die detachment
    Patent number: 8026126
    Abstract: The invention provides an apparatus and method for thin die detachment involving the use of a collet for holding and detaching a die mounted on an adhesive surface of an adhesive film. An ejector device comprising a plurality of ejector pins is employed to partially delaminate said die from the adhesive surface for detachment by the collet. Each ejector pin is operative to contact and raise a second surface of the film opposite the adhesive surface at a position substantially at a corner of the die to be detached within a predetermined distance from the edges of said die.
    Type: Grant
    Filed: July 28, 2003
    Date of Patent: September 27, 2011
    Assignee: ASM Assembly Automation Ltd
    Inventors: Yiu Ming Cheung, Chi Ming Chong, Tat Wing Lee, Ka Lok Leung
  • Apparatus and method for thin die detachment
    Publication number: 20040115904
    Abstract: The invention provides an apparatus and method for thin die detachment involving the use of a collet for holding and detaching a die mounted on an adhesive surface of an adhesive film. An ejector device comprising a plurality of ejector pins is employed to partially delaminate said die from the adhesive surface for detachment by the collet. Each ejector pin is operative to contact and raise a second surface of the film opposite the adhesive surface at a position substantially at a corner of the die to be detached within a predetermined distance from the edges of said die.
    Type: Application
    Filed: July 28, 2003
    Publication date: June 17, 2004
    Inventors: Yiu Ming Cheung, Chi Ming Chong, Tat Wing Lee, Ka Lok Leung
  • Adaptor
    Patent number: D338188
    Type: Grant
    Filed: July 26, 1991
    Date of Patent: August 10, 1993
    Assignee: Comewell Industries Limited
    Inventors: Simon G. Lee, Ka-Lok Leung