Abstract: Disclosed are a method for forming a metal interconnection and a semiconductor device including the metal interconnection. The method includes the steps of forming a slope by etching a corner of a contact hole, which exposes a predetermined pattern formed on a substrate, forming a barrier metal layer on an interlayer dielectric layer, plasma-treating the barrier metal layer with hydrogen and nitrogen gases for about 27 to 37 seconds, heat-treating the substrate in a nitrogen atmosphere, forming a tungsten layer on the barrier metal layer through a two-step nucleation process and bulk deposition process, and performing a chemical mechanical polishing process on the tungsten layer until the interlayer dielectric layer is exposed. The method and the semiconductor device prevent defects of the metal interconnection, such as a volcano defect caused by fluorine penetration.

Abstract: A method for forming a tungsten plug is provided. The method can include forming a first tungsten seed layer on an insulating layer having a via hole, forming a second tungsten seed layer on the first tungsten seed layer, and forming a tungsten-buried layer in the via hole. The second tungsten seed layer can be from about 1.3 times to about 2.5 times thicker than the first tungsten seed layer.