Abstract: Disclosed embodiments provide techniques for scaling ecommerce with short-form video. A micro-website is created and is associated with a user ID. The user ID corresponds to a social media influencer, an expert in a subject matter, or a celebrity. The micro-website can be managed by a mobile application. Based on the user ID, a pre-approved electronic catalog of products is determined and used to populate the micro-website with one or more products for sale. The micro-website includes one or more short-form videos highlighting products for sale from the electronic catalog. The host of the short-form videos is the influencer, expert, or celebrity corresponding to the user ID. The micro-website includes an ecommerce link to allow fulfilling product orders. The short-form videos include a virtual purchase cart for ecommerce purchases that can be engaged by the user.

Abstract: A detachable probe card interface comprises a space transformer, a deformable connector, and a carrier board. The space transformer includes first electrical contacts and second electrical contacts, wherein the first electrical contacts are coupled to the second electrical contacts through one or more layers of the space transformer. The deformable connector includes a plurality of conductive particles arranged in columns coinciding with the second electrical contacts, wherein the conductive particles compress with one another when one or more forces are exerted on the deformable connector. The carrier board includes a plurality of vias aligned with the plurality of second electrical contacts on the space transformer, and a plurality of conductors disposed within the vias.

Abstract: A detachable probe card interface comprises a space transformer, a deformable connector, and a carrier board. The space transformer includes first electrical contacts and second electrical contacts, wherein the first electrical contacts are coupled to the second electrical contacts through one or more layers of the space transformer. The deformable connector includes a plurality of conductive particles arranged in columns coinciding with the second electrical contacts, wherein the conductive particles compress with one another when one or more forces are exerted on the deformable connector. The carrier board includes a plurality of vias aligned with the plurality of second electrical contacts on the space transformer, and a plurality of conductors disposed within the vias.

Abstract: A compressible contact pin. The contact pin includes a first contact element and a second contact element. A compressible member is coupled between the first contact element and the second contact element to compress when one or more external forces are applied between the first contact element and the second contact element. In addition, the compressible member maintains a separation distance between the first and second contact elements when no external forces are applied. A plurality of conductive particles is bounded by the compressible member to form an electrical connection between the first contact element and the second contact element. The conductive particles are configured to compress with one another when the compressible member is compressed.

Abstract: A compressible contact pin. The contact pin includes a first contact element and a second contact element. A compressible member is coupled between the first contact element and the second contact element to compress when one or more external forces are applied between the first contact element and the second contact element. In addition, the compressible member maintains a separation distance between the first and second contact elements when no external forces are applied. A plurality of conductive particles is bounded by the compressible member to form an electrical connection between the first contact element and the second contact element. The conductive particles are configured to compress with one another when the compressible member is compressed.

Abstract: A compressible contact pin. The contact pin includes a first contact element and a second contact element. A compressible member is coupled between the first contact element and the second contact element to compress when one or more external forces are applied between the first contact element and the second contact element. In addition, the compressible member maintains a separation distance between the first and second contact elements when no external forces are applied. An elastomeric connector is coupled between the first contact element and the second contact element. The elastomeric connector electrically couples the first contact element to the second contact element by deforming when the one or more external forces are applied between the first contact element and the second contact element.

Abstract: A probe card interface for interfacing a probe head with a first circuit. The probe card interface includes an impedance control element to interface a first set of pins of the probe head with the first circuit. The impedance control element is further configured to control the impedance of the first set of pins. The probe card interface includes a conductive plane to interface a second set of pins of the probe head with the first circuit. The conductive plane is further coupled to provide at least one of power or ground to the second set of pins.

Abstract: A compressible contact pin. The contact pin includes a first contact element and a second contact element. A compressible member is coupled between the first contact element and the second contact element to compress when one or more external forces are applied between the first contact element and the second contact element. In addition, the compressible member maintains a separation distance between the first and second contact elements when no external forces are applied. An elastomeric connector is coupled between the first contact element and the second contact element. The elastomeric connector electrically couples the first contact element to the second contact element by deforming when the one or more external forces are applied between the first contact element and the second contact element.

Abstract: A probe card interface for interfacing a probe head with a first circuit. The probe card interface includes an impedance control element to interface a first set of pins of the probe head with the first circuit. The impedance control element is further configured to control the impedance of the first set of pins. The probe card interface includes a printed circuit board (PCB) to interface a second set of pins of the probe head with the first circuit. The PCB is further coupled to provide at least one of power or ground to the second set of pins. For some embodiments, the PCB comprises a flexible polyimide substrate coupled between a first conductive layer and a second conductive layer. The first conductive layer is coupled to ground. The second conductive layer is coupled to a power source on the first circuit.

Abstract: A method for delivering information to a targeted group of users includes establishing a network that includes a plurality of users and a plurality of entities being connected with each other based on the interest of the users in the entities; searching for a targeted group of users who match a specification of an interest profile and a specification of a spatial temporal profile among the users in the network; and delivering information to the targeted group of users. The interest profile is based on the relationships between each user and the entities that the user is interested in. The spatial temporal profile is based on the location and the time on which the user accesses the network. A system for delivering information to a targeted group of users is also provided.

Abstract: A resonant test probe for testing high-speed integrated circuit devices. The test probe includes a probe tip that makes electrical contact with a device under test to receive a test signal from the device, and an output circuit transmits the received test signal to a testing apparatus. The test probe also includes tuning circuitry coupled between the probe tip and the output circuit. The tuning circuitry is configured to tune a resonance frequency of the test probe to be substantially equal to an operating frequency of the device under test to enable the test probe to transmit the test signal to the device under test.

Abstract: A vertical probe interface system includes a flex PCB system where a portion of the flex PCB is pressed together to form a solid board and the other portion of the flex PCB is in layer or layers form. A metal plate mounts the flex PCB to the stiffener of the probe interface board. The flex PCB is electrically connected to the probe interface board by connectors, soldering or other known method.

Abstract: A probe card includes a printed circuit board (PCB) and a probe ring coupled to the PCB. The probe card further includes a plurality of probes coupled to the PCB and to the probe card, and includes a plurality of tubes respectively associated with the plurality of probes. Each tube is configured to surround at least a portion of the probe that the tube is associated with. Each tube includes an inner dielectric portion and an outer conductive portion. The conductive portion of each tube is electrically coupled to the PCB.

Abstract: A probe card includes a first probe plate having a first plurality of tapered apertures formed therein. Each of the tapered apertures has a first opening that is smaller than a second opening. The first openings and the second openings are on opposite surfaces of the first probe plate. The probe card further includes a second probe plate having a second plurality of tapered apertures formed therein. Each of the tapered apertures has a first opening that is smaller than a second opening. The first openings and the second openings are on opposite surfaces of the second probe plate. The surfaces having the second openings are disposed adjacent to one another. Pairs of the tapered apertures of the first and second probe plates substantially align. The probe card further includes a plurality of probes, wherein each of the probes is disposed in one of the pairs of the tapered apertures.

Abstract: The present invention provides a method for separating two highly pure fullerenes from a mixture of fullerenes comprising crystallizing a first fullerene component and a second fullerene component, wherein the phase equilibrium behavior of the mixture fed to a crystallizer is characterized by a region(s) where a pure fullerene of the two fullerenes or the solid solution or solvate thereof can be crystallized out.

Abstract: A method, apparatus and program storage device for determining an optimal number of tasks during reorganization of a database system with memory and processor constraints. The reorganization system identifies memory constraints, identifies processing capabilities and determines a number of reorganization processes and a combination of reorganization processes that provides a minimum reorganization time based upon the identified memory and processing constraints. The identified memory and processing capabilities identify a domain representing a set of rules applicable to the identified memory and processing capabilities. The set of rules of the identified domain are applied to determine an optimal number and combination of reorganization processes that minimizes a reorganization time.

Abstract: A method, apparatus and program storage device for managing buffers during online reorganization. An adaptive buffer is provided having a dynamically adjustable boundary, the adaptive buffer processes log records and pointers associated with the log records during online reorganization of a database. Adaptive switching is provided between a first and a second task during the processing of data log records and index log records during the online reorganization of the database.

Abstract: Hydrogen gas sensors employ an epitaxial layer of the thermodynamically stable form of aluminum nitride (AlN) as the “insulator” in an MIS structure having a thin metal gate electrode suitable for catalytic dissociate of hydrogen, such as palladium, on a semiconductor substrate. The AlN is deposited by a low temperature technique known as Plasma Source Molecular Beam Epitaxy (PSMBE). When silicon (Si) is used the semiconducting substrate, the electrical behavior of the device is that of a normal nonlinear MIS capacitor. When a silicon carbide (SiC) is used, the electrical behavior of the device is that of a rectifying diode. Preferred structures are Pd/AlN/Si and Pd/AlN/SiC wherein the SiC is preferably 6H—SiC.