Patents by Inventor Ka On Yue

Ka On Yue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8226796
    Abstract: A collet is provided for picking up a die mounted on an adhesive surface. A flat platform at an end of the collet is configured to hold a planar surface of the die during pick-up of the die and a flange protruding from one side of the platform is operative to push against a side of the die which is substantially perpendicular to the planar surface of the die during a die pick-up process.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: July 24, 2012
    Assignee: ASM Assembly Automation Ltd
    Inventors: Yau Sun Fan, Wai Shing Ho, Hiu Leung Tse, Yee Fan Yeung, Ka On Yue
  • Publication number: 20100175828
    Abstract: A collet is provided for picking up a die mounted on an adhesive surface. A flat platform at an end of the collet is configured to hold a planar surface of the die during pick-up of the die and a flange protruding from one side of the platform is operative to push against a side of the die which is substantially perpendicular to the planar surface of the die during a die pick-up process.
    Type: Application
    Filed: January 14, 2009
    Publication date: July 15, 2010
    Inventors: Yau Sun Fan, Wai Shing Ho, Hiu Leung Tse, Yee Fan Yeung, Ka On Yue
  • Patent number: 7166990
    Abstract: A battery low-voltage protecting device is disclosed as including an input terminal connected, via a first lead wire and a switch driver circuit, with a positive terminal of a battery; an output terminal connected, via a second lead wire, with a load; a ground terminal connected, via a third lead wire, with an automobile body and a negative terminal of the battery; a declining voltage integrating circuit; a voltage detector; and a timer switch control circuit; in which the voltage of said declining voltage integrating circuit rises when the voltage of said battery rises, and falls when the voltage of said battery falls; and the declining voltage integrating circuit can differentiate between a quick fall in the voltage of the battery from a slow fall in the voltage of the battery, and output voltage signals to the voltage detector; and the voltage sensor can receive voltage signals outputted by the declining voltage integrating circuit, to compare the voltage signals with a pre-defined voltage level, and to ou
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: January 23, 2007
    Assignee: Kare Hong Kong Limited
    Inventor: Ka Yue Lo
  • Publication number: 20040227492
    Abstract: A battery low-voltage protecting device is disclosed as including an input terminal connected, via a first lead wire and a switch driver circuit, with a positive terminal of a battery; an output terminal connected, via a second lead wire, with a load; a ground terminal connected, via a third lead wire, with an automobile body and a negative terminal of the battery; a declining voltage integrating circuit; a voltage detector; and a timer switch control circuit; in which the voltage of said declining voltage integrating circuit rises when the voltage of said battery rises, and falls when the voltage of said battery falls; and the declining voltage integrating circuit can differentiate between a quick fall in the voltage of the battery from a slow fall in the voltage of the battery, and output voltage signals to the voltage detector; and the voltage sensor can receive voltage signals outputted by the declining voltage integrating circuit, to compare the voltage signals with a pre-defined voltage level, and to ou
    Type: Application
    Filed: May 12, 2004
    Publication date: November 18, 2004
    Applicant: Kare Hong Kong Limited
    Inventor: Ka Yue Lo
  • Patent number: 6276598
    Abstract: A method and apparatus are described for placing a plurality of balls in a predetermined array. The method and apparatus are particularly suitable for transferring solder balls to a ball grid array package. In the method the balls are transferred from a supply means 1 to a template 2 in which the balls are positioned in the desired array before being picked up by a ball pick head 3 for transfer to the final position while remaining in the desired array.
    Type: Grant
    Filed: July 13, 1999
    Date of Patent: August 21, 2001
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Chi Wah Cheng, Alfred Ka On Yue, Chiu Fai Wong
  • Patent number: 6109501
    Abstract: A wire bonding machine having a wire bonding head that provides five directions of movement or degrees of freedom. The radial direction of movement supports the wire bonding process and reduces the moving mass of the wire bonder during the generation of the wire bonds. The wire bonding machine further includes a selectable side view inspection system. Through a group of optical components, the assembly process can be selectively viewed from either a side view or a top view. The side view of the assembly process provides for improved analysis of the wire bond quality which can be monitored by a camera.
    Type: Grant
    Filed: January 11, 1999
    Date of Patent: August 29, 2000
    Assignee: ASM Assembly Automotion Ltd.
    Inventors: Chi Wah Cheng, Ka On Yue, Chiu Fai Wong
  • Patent number: 5897048
    Abstract: A wire bonding machine has a wire bonding head that provides five directions of movement or degrees of freedom. The radial direction of movement supports the wire bonding process and reduces the moving mass of the wire bonder during the generation of the wire bonds. The wire bonding machine further includes a selectable side view inspection system. Through a group of optical components, the assembly process can be selectively viewed from either a side view or a top view. The side view of the assembly process provides for improved analysis of the wire bond quality which can be monitored by a camera.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: April 27, 1999
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Chi Wah Cheng, Ka On Yue, Chiu Fai Wong