Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.

Abstract: A wire bonding apparatus, comprising a bonding tool mounted on a bondhead body which is in turn mounted on a positioning table, is provided for bonding electronic devices. The positioning table has first and second motors coupled to it that are operative to drive the bondhead body to positions along respective first and second orthogonal axes. The bondhead body is connected to the positioning table through a pivot such that the bondhead body is rotatable relative to the positioning table about a third axis which is substantially orthogonal to the first and second axes. Further, a third motor drives the bondhead body to rotate about the third axis.

Abstract: A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet.

Abstract: A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet.

Abstract: A transducer is provided that comprises a horn that is configured to transmit vibrations along its length during operation in the form of an oscillatory waveform, such oscillatory waveform having a plurality of vibration nodal points. An ultrasonic generator is coupled to one end of the horn and a bonding tool is coupled to an opposite end of the horn for performing bonding operations. A first flange structure is located along the length of the horn at a first vibration nodal point for mounting the transducer, and a second flange structure is located along the length of the horn at a second vibration nodal point for mounting the transducer, such that the second flange structure is separated from the first flange structure by a distance of at least two consecutive vibration nodal points.

Abstract: A wire tensioner is provided for a wire bonder, the wire tensioner comprising a tubular body having a bore through which bonding wire is receivable and a bore outlet at an end of the tubular body from which the bonding wire is extendable towards a bonding tool. A chamber is formed next to the bore outlet that substantially encloses the bore outlet, the chamber including an air inlet connected to it that is operative to introduce clean air into the chamber. A vacuum outlet is connected to a side of the tubular body and is in fluid communication with the chamber via the bore, the vacuum outlet being operative to draw air from the bore outlet through the bore whereby to pull the wire.

Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.

Abstract: A bonding apparatus is provided comprising a bonding stage for holding a bonding tool, an air distribution system mounted to the bonding stage and an air inlet attached to the air distribution system. The air distribution system is connected to the air inlet for receiving air from the air inlet, and is operative to pass the air over multiple surfaces of the bonding stage for the purpose of temperature control.

Abstract: A thermal insulation system is provided for a component of a bonding system, such as an optical system. The thermal insulation system comprises multiple insulation layers located between the component and a heat source. The multiple insulation layers comprise at least one layer of moving air injected into the layer and a cover layer enclosing the layer of moving air. The multiple insulation layers may further comprise a layer of static air.

Abstract: A large electronic device having a bonding area on one side that comprises first and second portions may be bonded by first locating the first portion but not the second portion of the electronic device for bonding by a bonding tool. After the first portion of the electronic device has been bonded, the electronic device is conveyed to a rotary platform that is rotatable along a substantially horizontal plane. The electronic device is rotated on the rotary platform to change the respective positions of the bonded first portion and unbonded second portion of the electronic device, before the electronic device is conveyed to the bonding tool such that the second portion of the electronic device is located for bonding by the bonding tool. The second portion of the electronic device may then be bonded.

Abstract: An apparatus is provided for supplying a shielding gas during the bonding of wires to electronic components with a bonding tool comprising a horn and a capillary. The apparatus comprises a main body with an elongated slot having a width that extends into the main body from a side of the main body generally in a first direction and the slot also extends from a top surface to a bottom surface of the main body in a second direction perpendicular to the first direction for the width of the slot. The slot is sized to receive a tip of the capillary which is operable to pass through the slot in the second direction. A gas outlet, which may be formed inside the slot, supplies shielding gas into the slot.

Abstract: A bonding apparatus comprising a bond arm and a wire bonding tool mounted to the bond arm is provided with thermal insulation in the form of a thermal shield substantially enclosing the bonding tool for insulating the bonding tool from ambient heat.

Abstract: A bonding apparatus is provided which includes a device handler for handling electronic devices, the bonding apparatus including a bonding tool at which the electronic devices are locatable for bonding. A storage assembly is provided for storing multiple electronic devices and a conveying track is further provided for conveying electronic devices towards and away from the bonding tool. The device handler includes a rotary platform for holding an electronic device, and which is operable between an orientation wherein the rotary platform is aligned with the conveying track for transferring an electronic device between the rotary platform and the conveying track, and another orientation wherein the rotary platform is aligned with the storage assembly for transferring an electronic device between the rotary platform and the storage assembly.

Abstract: An apparatus and method for automatically controlling a clamp gap between clamping arms of a wire clamp is provided wherein a motor generates an actuation force for moving the clamping arms relative to each other. A resilient member is positioned such that the actuation force acts upon and flexes the resilient member to an extent that is proportional to the clamp gap, and the clamp gap is controlled by adjusting the amount of actuation force according to a predetermined relationship between the actuation force and the clamp gap.

Abstract: A clamping mechanism having clamping jaws is provided for holding an object. The clamping mechanism comprises a solenoid pad connected to at least one of the clamping jaws which is operative to actuate movement of the clamping jaw, and a solenoid motor that is operative to attract the solenoid pad towards it when it is energized. Further, a voice coil motor is rigidly coupled to the solenoid pad to drive the solenoid pad in directions towards or away from the solenoid motor.

Abstract: A wire tensioner is provided for a wire bonder, the wire tensioner comprising a tubular body having a bore through which bonding wire is receivable and a bore outlet at an end of the tubular body from which the bonding wire is extendable towards a bonding tool. A chamber is formed next to the bore outlet that substantially encloses the bore outlet, the chamber including an air inlet connected to it that is operative to introduce clean air into the chamber. A vacuum outlet is connected to a side of the tubular body and is in fluid communication with the chamber via the bore, the vacuum outlet being operative to draw air from the bore outlet through the bore whereby to pull the wire.

Abstract: A bonding apparatus comprising a bond arm and a wire bonding tool mounted to the bond arm is provided with thermal insulation in the form of a thermal shield substantially enclosing the bonding tool for insulating the bonding tool from ambient heat.

Abstract: A bonding apparatus is provided comprising a bonding stage for holding a bonding tool, an air distribution system mounted to the bonding stage and an air inlet attached to the air distribution system. The air distribution system is connected to the air inlet for receiving air from the air inlet, and is operative to pass the air over multiple surfaces of the bonding stage for the purpose of temperature control.

Abstract: A thermal insulation system is provided for a component of a bonding system, such as an optical system. The thermal insulation system comprises multiple insulation layers located between the component and a heat source. The multiple insulation layers comprise at least one layer of moving air injected into the layer and a cover layer enclosing the layer of moving air. The multiple insulation layers may further comprise a layer of static air.

Abstract: A clamping mechanism having clamping jaws is provided for holding an object. The clamping mechanism comprises a solenoid pad connected to at least one of the clamping jaws which is operative to actuate movement of the clamping jaw, and a solenoid motor that is operative to attract the solenoid pad towards it when it is energized. Further, a voice coil motor is rigidly coupled to the solenoid pad to drive the solenoid pad in directions towards or away from the solenoid motor.