Abstract: A bond head having a bonding tool for bonding an electronic component includes a rotary motion mechanism and a linear positioning mechanism coupled to the rotary motion mechanism. The rotary motion mechanism is operative to rotate the bonding tool for adjusting an angular orientation of the electronic component held by the bonding tool. The rotary motion mechanism includes a rotary assembly operative to rotate the bonding tool about a first rotary axis and a flexural rotary table operative to rotate the bonding tool about respective second and third rotary axes, the first, second and third rotary axes being orthogonal to one another. The linear positioning mechanism is operative to drive the bonding tool to move parallel to the first rotary axis as well as a first plane that is parallel to a second plane on which the second and third rotary axes are located to adjust the position of the electronic component.

Abstract: A semiconductor die bonding device has a bond arm body, a collet attached at a first end of the bond arm body for holding a semiconductor die during a pick-and-place operation, and a voice coil actuator located at a second end of the bond arm body for driving the bond arm body to rotate about a pivot positioned between the collet and the voice coil actuator. The voice coil actuator includes a pair of arc magnets having concave arced surfaces facing the pivot that form an arc-shaped gap between the arc magnets, and an arc coil including a concave arced surface disposed within the arc-shaped gap that is configured to be movable relative to the arc magnets.

Abstract: A device for measuring a force applied to a component when the component is being bonded to a component carrier, or when the component is being encapsulated includes a deformable portion and a contacting stem connected to the deformable portion. The deformable portion is configured to incorporate a sensor for detecting a degree of deformation of the deformable portion caused by application of the force in order to measure the force. In use, the contacting stem is positionable to contact the component or the component carrier so that the deformable portion is deformed when the force is applied to the component. One or more such devices may be included in a sintering or encapsulation apparatus for measuring the said force.

Abstract: A syringe housing has a space that is sized for accommodating a syringe containing a fluid to be dispensed. The syringe is insertable into the syringe housing through an opening at a first end of the syringe housing, and a nozzle configured to engage a dispensing tip of the syringe is located at a second end of the syringe housing opposite to the first end. A syringe adaptor, which includes a pneumatic connector that is connectable to a gas supply for introducing a gas into an air chamber enclosed within the syringe housing and the syringe, is removably coupled to the syringe housing for retaining the syringe after it has been inserted into the syringe housing. The gas is operative in use to apply a force inside the syringe to drive dispensation of the fluid through the nozzle.

Abstract: An ultrasonic transducer that is configured to selectively operate at first or second resonant frequency during wire bonding operations includes an elongated transducer body an aperture for mounting a piezoelectric driver stack for driving the ultrasonic transducer to operate at the first or second resonant frequency and a mounting flange connected to the transducer body at a first nodal vibration region of the transducer body when the ultrasonic transducer is operated at the first resonant frequency. The elongated transducer has a length substantially equal to two wavelengths of a first oscillatory wave that is transmitted along the length of the transducer body when the transducer is operated at the first resonant frequency, and substantially equal to a half wavelength of a second oscillatory wave that is transmitted along the length of the transducer body when the transducer is operated at the second resonant frequency.

Abstract: An ultrasonic transducer includes an elongated transducer body with an aperture for mounting a piezoelectric driver stack for driving the ultrasonic transducer to operate at a first resonant frequency, a mounting flange for mounting the transducer body to a wire bonding machine, a rigid connecting member having first and second ends which are respectively connected to the mounting flange and the transducer body at a first nodal vibration region of the transducer body when the ultrasonic transducer is operated at the first resonant frequency and a flexible connecting member extending between the mounting flange and the transducer body at a second nodal vibration region of the transducer body when the ultrasonic transducer is operated at the first resonant frequency.

Abstract: A pick-up chuck for handling a substrate has a chuck body defining a support surface, a gas relay aperture for transmitting a gas, a vacuum aperture portion configured in use to generate a vacuum force to pick up the substrate, and a flow of said gas through the gas relay aperture onto the said support surface towards the vacuum aperture portion. A gas bearing structure arranged on said support surface is shaped to provide a gas bearing between the substrate and said support surface by utilizing the flow of said gas between the gas relay aperture and the vacuum aperture portion.

Abstract: A device for measuring a force applied to a component when the component is being bonded to a component carrier, or when the component is being encapsulated includes a deformable portion and a contacting stem connected to the deformable portion. The deformable portion is configured to incorporate a sensor for detecting a degree of deformation of the deformable portion caused by application of the force in order to measure the force. In use, the contacting stem is positionable to contact the component or the component carrier so that the deformable portion is deformed when the force is applied to the component. One or more such devices may be included in a sintering or encapsulation apparatus for measuring the said force.

Abstract: A device for measuring and regulating a volume of a fluid dispensed by a time-pressure dispenser, the device comprising: an adaptor for releasably coupling a syringe to the device, the syringe containing a fluid to be dispensed; a probe configured to be coupled with a piston of the syringe, the piston being operative to apply a pressure for ejecting the fluid from the syringe upon the application of an air pressure to the piston; and a displacement detector operative in use to determine a position of the probe so as to determine a position of the piston when dispensing the fluid, whereby to regulate the volume of the fluid dispensed from the syringe.

Abstract: A device for measuring and regulating a volume of a fluid dispensed by a time-pressure dispenser, the device comprising: an adaptor for releasably coupling a syringe to the device, the syringe containing a fluid to be dispensed; a probe configured to be coupled with a piston of the syringe, the piston being operative to apply a pressure for ejecting the fluid from the syringe upon the application of an air pressure to the piston; and a displacement detector operative in use to determine a position of the probe so as to determine a position of the piston when dispensing the fluid, whereby to regulate the volume of the fluid dispensed from the syringe.

Abstract: A driving system has a driving motor body operative to produce a driving force for driving an object to move in reciprocating directions. A pivotal support is located between the driving motor body and a machine base for supporting the driving motor body on the machine base. The pivotal support causes at least a portion of the driving motor body to rotate relative to the machine base in an opposite direction to a direction of the driving force produced by the driving motor body to drive the object, so as to reduce vibration transmission to the machine base.

Abstract: A substrate cleaning apparatus for cleaning debris from a substrate has a first air jet nozzle defining a first air jet aperture configured to provide a first air jet, a second air jet nozzle defining a second air jet aperture configured to provide a second air jet, and a vacuum nozzle defining a vacuum aperture positioned between the first air jet nozzle and the second air jet nozzle. The vacuum aperture further comprises lobe apertures radially extending transversely to a first axis extending between the first air jet nozzle and the second air jet nozzle.

Abstract: A driving system has a driving motor body operative to produce a driving force for driving an object to move in reciprocating directions. A pivotal support is located between the driving motor body and a machine base for supporting the driving motor body on the machine base. The pivotal support causes at least a portion of the driving motor body to rotate relative to the machine base in an opposite direction to a direction of the driving force produced by the driving motor body to drive the object, so as to reduce vibration transmission to the machine base.

Abstract: A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.

Abstract: An SMT screen printer 100 is disclosed herein. In a described embodiment, the screen printer 100 comprises: i) a stencil 110 with a plurality of apertures; ii) a paste dispenser arranged to dispense a paste material through the plurality of apertures of the stencil to form a print pattern of the stencil to form a print pattern of the paste material on an electronic device; iii) an image capturing device in the form of a fiducial camera 176 arranged to capture at least one image of the plurality of apertures 114 of the stencil 110; iv) a processor 180 arranged to select which of the apertures 114 require cleaning based on the at least one captured image; and v) a cleaning device 138 arranged to clean the selected apertures 114. A method of cleaning a stencil 110 of an SMT screen printer 100 is also disclosed.

Abstract: A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.

Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.

Abstract: An SMT screen printer 100 is disclosed herein. In a described embodiment, the screen printer 100 comprises: i) a stencil 110 with a plurality of apertures; ii) a paste dispenser arranged to dispense a paste material through the plurality of apertures of the stencil to form a print pattern of the stencil to form a print pattern of the paste material on an electronic device; iii) an image capturing device in the form of a fiducial camera 176 arranged to capture at least one image of the plurality of apertures 114 of the stencil 110; iv) a processor 180 arranged to select which of the apertures 114 require cleaning based on the at least one captured image; and v) a cleaning device 138 arranged to clean the selected apertures 114.

Abstract: Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.

Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.