Patents by Inventor Ka Yee Mak
Ka Yee Mak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11276614Abstract: A pick and place LED testing apparatus, comprising: a test station operative in use to power a group of LEDs; a bondhead operative in use to pick said group of LEDs from a source wafer and place said group of LEDs on said test station for testing; and an optical sensor operative in use to measure an optical characteristic of said group of LEDs when tested, wherein at least a portion of said bondhead is translucent to provide an optical path from said group of LEDs to said optical sensor.Type: GrantFiled: July 31, 2020Date of Patent: March 15, 2022Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Shun Yan Lee, Sai Kit Wong, Chi Wah Yuen, Ka Yee Mak, Gary Peter Widdowson
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Publication number: 20220037213Abstract: A pick and place LED testing apparatus, comprising: a test station operative in use to power a group of LEDs; a bondhead operative in use to pick said group of LEDs from a source wafer and place said group of LEDs on said test station for testing; and an optical sensor operative in use to measure an optical characteristic of said group of LEDs when tested, wherein at least a portion of said bondhead is translucent to provide an optical path from said group of LEDs to said optical sensor.Type: ApplicationFiled: July 31, 2020Publication date: February 3, 2022Inventors: Shun Yan LEE, Sai Kit WONG, Chi Wah YUEN, Ka Yee MAK, Gary Peter WIDDOWSON
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Patent number: 11136202Abstract: Electronic components are transferred from a source surface for supplying electronic components to a destination surface for receiving electronic components by an ejector device that is locatable at an ejection position for pushing an electronic component mounted on the source surface towards the destination surface. A support device that is locatable at a receiving position supports the electronic component that is pushed onto the destination surface. Further, a pre-transfer imaging device inspects the electronic component before it is transferred from the source surface and a post-transfer imaging device inspects the electronic component after it has been transferred onto the destination surface, wherein the pre-transfer and post-transfer imaging devices are located on opposite sides of the source and destination surfaces.Type: GrantFiled: January 6, 2020Date of Patent: October 5, 2021Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Kui Kam Lam, Kai Siu Lam, Yen Hsi Tang, Hung Kit Chan, Ka Yee Mak
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Publication number: 20210206585Abstract: Electronic components are transferred from a source surface for supplying electronic components to a destination surface for receiving electronic components by an ejector device that is locatable at an ejection position for pushing an electronic component mounted on the source surface towards the destination surface. A support device that is locatable at a receiving position supports the electronic component that is pushed onto the destination surface. Further, a pre-transfer imaging device inspects the electronic component before it is transferred from the source surface and a post-transfer imaging device inspects the electronic component after it has been transferred onto the destination surface, wherein the pre-transfer and post-transfer imaging devices are located on opposite sides of the source and destination surfaces.Type: ApplicationFiled: January 6, 2020Publication date: July 8, 2021Inventors: Kui Kam LAM, Kai Siu LAM, Yen Hsi TANG, Hung Kit CHAN, Ka Yee MAK
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Patent number: 11056377Abstract: A semiconductor pick and place apparatus comprises: a pick arm having a main body, and a conduit incorporated in the main body for permitting fluid flow through the main body via the conduit, the conduit further defining a holding orifice which is operative in use to secure a semiconductor die, the conduit being configured to convey light received from one side of the pick arm through the holding orifice and an alignment window located on the main body to an opposite side of the pick arm.Type: GrantFiled: July 2, 2019Date of Patent: July 6, 2021Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Kui Kam Lam, Kai Siu Lam, Cheuk Ki Tam, Nim Tak Wong, Ka Yee Mak
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Publication number: 20210005498Abstract: A semiconductor pick and place apparatus comprises: a pick arm having a main body, and a conduit incorporated in the main body for permitting fluid flow through the main body via the conduit, the conduit further defining a holding orifice which is operative in use to secure a semiconductor die, the conduit being configured to convey light received from one side of the pick arm through the holding orifice and an alignment window located on the main body to an opposite side of the pick arm.Type: ApplicationFiled: July 2, 2019Publication date: January 7, 2021Inventors: Kui Kam LAM, Kai Siu LAM, Cheuk Ki TAM, Nim Tak WONG, Ka Yee MAK
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Patent number: 10684118Abstract: An apparatus for determining an orientation of a die mounted on a tape includes an imaging device, a light source and a conveying mechanism. The die is at least partially translucent and includes at least one orientation feature indicative of the orientation of the die. In use, the conveying mechanism conveys the tape to position the die at an inspection position between the imaging device and the light source. The light source projects light to the imaging device and the imaging device captures an image. The projected light from the light source passing through the die is obstructed by the at least one orientation feature of the die to cause the captured image to include an image of the at least one orientation feature, whereby the orientation of the die may be determined.Type: GrantFiled: April 9, 2019Date of Patent: June 16, 2020Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Kai Siu Lam, Chi Leung Mok, Nim Tak Wong, Ka Yee Mak
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Patent number: 10014450Abstract: The invention provides a light emitting diode device that comprises a light emitting diode die. The method for manufacturing the light emitting diode device comprises positioning a first stencil over a carrier, printing a phosphor material onto the carrier through at least one aperture of the first stencil to form a phosphor material piece on the carrier, and attaching the light emitting diode die onto the printed phosphor material piece.Type: GrantFiled: February 9, 2017Date of Patent: July 3, 2018Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Ka Yee Mak, Ho Yin Wong, Ho Yin Lou
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Patent number: 9671280Abstract: Method of generating a correction function for a light-emitting diode (LED) testing process, including: detecting light emitted by a reference LED and reflected from inactive LEDs on a panel within a field of view of a detector; varying a number of the inactive LEDs to derive uncorrected values of an optical parameter as a function of the number of inactive LEDs; detecting light emitted by the reference LED, or by an active LED having identical optical properties, in the absence of any other LEDs, to determine at least one reference value for each optical parameter; and calculating differences between the uncorrected values and each reference value to generate the correction function, the correction function being based on the number of inactive LEDs which are arranged within the field of view of the detector in the light detecting step.Type: GrantFiled: December 31, 2014Date of Patent: June 6, 2017Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Ka Yee Mak, Sai Kit Wong, Xiao Lan Liu, Jian Jun Ju
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Publication number: 20150198480Abstract: Disclosed is a method of generating a correction function for a light-emitting diode (LED) testing process.Type: ApplicationFiled: December 31, 2014Publication date: July 16, 2015Inventors: Ka Yee MAK, Sai Kit WONG, Xiao Lan LIU, Jian Jun JU
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Patent number: 8956892Abstract: Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.Type: GrantFiled: January 10, 2012Date of Patent: February 17, 2015Assignee: ASM Technology Singapore Pte. Ltd.Inventors: Kui Kam Lam, Ka Yee Mak, Yiu Yan Wong, Ming Li
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Publication number: 20130178002Abstract: Method and apparatus for fabricating a light-emitting diode package Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.Type: ApplicationFiled: January 10, 2012Publication date: July 11, 2013Applicant: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Kui Kam LAM, Ka Yee MAK, Yiu Yan WONG, Ming LI
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Patent number: 7204960Abstract: The invention provides an apparatus and method for calibrating a dispensing system. A dispenser dispenses a controlled quantity of material into a container for receiving material. A system, preferably a vision system comprising an image capturing device and an imaging system, is adapted to capture an image of a physical dimension of a quantity of dispensed material in a given time. The physical dimension may be a width of a top surface area, a height or a cross-sectional area of the dispensed material. A calibrating system is adapted to calculate a volume of the quantity of material based upon said physical dimension.Type: GrantFiled: March 3, 2003Date of Patent: April 17, 2007Assignee: ASM Assembly Automation Ltd.Inventors: Hon Chiu Hui, Wing Fai Lam, Lim Pun Kong, Ka Yee Mak, Ka Yin Lee
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Patent number: 6991825Abstract: The invention provides an apparatus and method for dispensing material onto a substrate. The apparatus comprises a dispensing system having a dipenser and a control system adapted to adjust a quantity of material to be dispensed onto the substrate. It also includes an image capturing system adapted to acquire an image of the material that is dispensed onto the substrate, a measuring system to analyze the image and measure the quantity of material dispensed, and a compensation system adapted to provide a correction signal to the control system to vary the quantity of material dispensed.Type: GrantFiled: May 10, 2002Date of Patent: January 31, 2006Assignee: ASM Assembly Automation Ltd.Inventors: Hon Chiu Hui, Wing Fai Lam, Ka Yee Mak, Man Lai Manly Chau
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Publication number: 20040175832Abstract: The invention provides an apparatus and method for calibrating a dispensing system. A dispenser dispenses a controlled quantity of material into a container for receiving material. A system, preferably a vision system comprising an image capturing device and an imaging system, is adapted to capture an image of a physical dimension of a quantity of dispensed material in a given time. The physical dimension may be a width of a top surface area, a height or a cross-sectional area of the dispensed material. A calibrating system is adapted to calculate a volume of the quantity of material based upon said physical dimension.Type: ApplicationFiled: March 3, 2003Publication date: September 9, 2004Applicant: ASM Assembly Automation LtdInventors: Hon Chiu Hui, Wing Fai Lam, Lim Pun Kong, Ka Yee Mak, Ka Yin Lee
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Publication number: 20030209560Abstract: The invention provides an apparatus and method for dispensing material onto a substrate. The apparatus comprises a dispensing system having a dipenser and a control system adapted to adjust a quantity of material to be dispensed onto the substrate. It also includes an image capturing system adapted to acquire an image of the material that is dispensed onto the substrate, a measuring system to analyze the image and measure the quantity of material dispensed, and a compensation system adapted to provide a correction signal to the control system to vary the quantity of material dispensed.Type: ApplicationFiled: May 10, 2002Publication date: November 13, 2003Applicant: ASM Assembly Automation LtdInventors: Hon Chiu Hui, Wing Fai Lam, Ka Yee Mak, Man Lai Manly Chau