Patents by Inventor Kayip Wong

Kayip Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10040140
    Abstract: A nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a nozzle body including a tip, the tip disposed at a distal end of the nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the nozzle body and configured to convey the solder ball to or from the tip. The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: August 7, 2018
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Chiwai Lo, Shenkuang Chou, Yiusing Ho, Kayip Wong, Xiangyuan Tan, Junqun Zhang
  • Publication number: 20160184915
    Abstract: A nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a nozzle body including a tip, the tip disposed at a distal end of the nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the nozzle body and configured to convey the solder ball to or from the tip. The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation.
    Type: Application
    Filed: December 29, 2014
    Publication date: June 30, 2016
    Inventors: Chiwai LO, Shenkuang CHOU, Yiusing HO, Kayip WONG, Xiangyuan TAN, Junqun ZHANG
  • Patent number: 8320081
    Abstract: A magnetic recording head includes a trailing surface and a plurality of bonding pads arranged on the trailing surface and in a row adapted for both bonding and testing. Each of the bonding pads has at least one side portion being coated with electrically conductive solder nonwettable coat to prevent short circuit between the adjacent bonding pads. The invention also discloses a head gimbal assembly with the magnetic recording head and a disk drive unit having such head gimbal assembly.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: November 27, 2012
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Shenkuang Chou, Liping Peng, Kayip Wong, Yanbin Wang, Lu Xiao, Bin Zhao
  • Patent number: 8295011
    Abstract: A slider for a head gimbal assembly includes a trailing surface, a plurality of connection pads arranged on the trailing surface adapted for both bonding the slider to a suspension of the head gimbal assembly and testing the performance of the slider. At least a part of the connection pads each comprises a bonding portion and a testing portion electrically connected to the bonding portion and larger than the bonding portion, all the bonding portions and the rest part of the connection pads are arranged in a first row and the testing portions are arranged outside the first row. The slider of the present invention has a new pad layout to facilitate bonding of the connection pads and permit to provide additional pads thereon to connect the additional sensors therein for precise reading and writing, thereby improving the performance of the slider. The invention also discloses a head gimbal assembly and a disk drive unit including the same.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: October 23, 2012
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Shenkuang Chou, Lu Xiao, Juren Ding, Kayip Wong, Yanbin Wang, Liping Peng
  • Publication number: 20110194209
    Abstract: A magnetic recording head includes a trailing surface and a plurality of bonding pads arranged on the trailing surface and in a row adapted for both bonding and testing. Each of the bonding pads has at least one side portion being coated with electrically conductive solder nonwettable coat to prevent short circuit between the adjacent bonding pads. The invention also discloses a head gimbal assembly with the magnetic recording head and a disk drive unit having such head gimbal assembly.
    Type: Application
    Filed: April 20, 2010
    Publication date: August 11, 2011
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Shenkuang Chou, Liping Peng, Kayip Wong, Yanbin Wang, Lu Xiao, Bin Zhao
  • Publication number: 20110194208
    Abstract: A slider for a head gimbal assembly includes a trailing surface, a plurality of connection pads arranged on the trailing surface adapted for both bonding the slider to a suspension of the head gimbal assembly and testing the performance of the slider. At least a part of the connection pads each comprises a bonding portion and a testing portion electrically connected to the bonding portion and larger than the bonding portion, all the bonding portions and the rest part of the connection pads are arranged in a first row and the testing portions are arranged outside the first row. The slier of the present invention has a new pad layout to facilitate bonding of the connection pads and permit to provide additional pads thereon to connect the additional sensors therein for precise reading and writing, thereby improving the performance of the slider. The invention also discloses a head gimbal assembly and a disk drive unit including the same.
    Type: Application
    Filed: April 20, 2010
    Publication date: August 11, 2011
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Shenkuang Chou, Lu Xiao, Juren Ding, Kayip Wong, Yanbin Wang, Liping Peng
  • Publication number: 20100290159
    Abstract: A common tray for HGA comprises a frame, a first inner bar, and a second inner bar parallel to and spaced from the first inner bar. Ends of the first and second inner bars connect to the opposite edges of the frame. A plurality of locating pillars and a plurality pairs of first bumps are uniformly-spaced formed on the first inner bar respectively. The first inner bar has portions between each said pair of first bumps recessed for forming spaces under the HGA. A plurality of second bumps are uniformly-spaced formed on the second inner bar for withstanding an edge of the base plate. The present common tray can replace five kinds of trays traditionally used in the HGA manufacturing process, and thus reduce the load/unload operations as well as the no-value stations and operators, thereby the productive efficiency is improved, and manufacturing cost is reduced.
    Type: Application
    Filed: May 18, 2009
    Publication date: November 18, 2010
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Shenkuang S. Chou, Kayip Wong, Chihung Yuen, ShuMing Zhang, Yuanjin Xu