Abstract: The present invention includes device, system, method of using and making a microneedle array including the steps of forming one or more pins on a substrate, depositing one or more layers on the one or more pins and the substrate, exposing a portion of the one or more pins, and separating the one or more pins from the one or more layers to form the hollow microneedle array.

Abstract: A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and second contact areas are provided. A junction compound is formed on one of the first and second contact areas, and the first and second contact areas are positioned adjacent each other on opposing sides of the junction compound. The junction compound is then activated to couple the first and second microcomponents.

Abstract: The present invention includes device, system, method of using and making a microneedle array including the steps of forming one or more pins on a substrate, depositing one or more layers on the one or more pins and the substrate, exposing a portion of the one or more pins, and separating the one or more pins from the one or more layers to form the hollow microneedle array.

Abstract: Methods of rapidly prototyping microstructures such as HARMs are disclosed. A high precision process uses polymeric microstructure replication techniques and sacrificial layer etching techniques to mass produce high aspect ratio metallic and polymer micromold inserts. In one embodiment, after fabrication of an initial micromold insert, high aspect ratio replications are created by casting replication material, such as PDMS, directly onto the initial micromold insert. The replicated HARM is coated with a sacrificial layer and then electroplated to replicate another set of micromold inserts. After the electroplating process is completed, the sacrificial layer is etched away to release the replicated micromold inserts.

Abstract: Methods of rapidly prototyping microstructures such as HARMs are disclosed. A high precision process uses polymeric microstructure replication techniques and sacrificial layer etching techniques to mass produce high aspect ratio metallic and polymer micromold inserts. In one embodiment, after fabrication of an initial micromold insert, high aspect ratio replications are created by casting replication material, such as PDMS, directly onto the initial micromold insert. The replicated HARM is coated with a sacrificial layer and then electroplated to replicate another set of micromold inserts. After the electroplating process is completed, the sacrificial layer is etched away to release the replicated micromold inserts.