Patents by Inventor Kabul S. Sengupta

Kabul S. Sengupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image sensor mounted by mass reflow
    Patent number: 6753922
    Abstract: An imaging system includes an image sensor that is attached to a circuit board via a mass reflow process. The image sensor captures image data and provides the image data at an output of the imaging system. In one embodiment, the image sensor uses a color filter array (CFA) material that is substantially stable through the mass reflow process.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: June 22, 2004
    Assignee: Intel Corporation
    Inventors: Kabul S. Sengupta, Azar Assadi, Alan B. Alley, Robert C. Sundahl
  • Mass reflowable windowed package
    Patent number: 6191359
    Abstract: A windowed package is capable of withstanding a mass reflow process. During mass reflow, the entire package is subjected to the solder reflow temperature. In one embodiment, the lid comprises a ceramic frame and a glass window.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: February 20, 2001
    Assignee: Intel Corporation
    Inventors: Kabul S. Sengupta, Carl E. Sklenicka, Deborah L. Thompson, Raul A. Arellano, Naoyuki Nagai, Nobuyuki Takehashi, Kouichiro Nomoto