Abstract: An adapter for a liquid container of a supply system of a wet process module for the treatment of substrates has a container part for fastening to the liquid container and a channel part for fastening to the supply system. The container part has a central opening and a fastening device for fastening the container part to the liquid container. The channel part has a continuous first channel portion and a continuous second channel portion, the first and the second channel portion each opening into the central opening of the container part.

Abstract: Disclosed is an apparatus for measuring a fluid flow through a pipe of a semiconductor manufacturing device, in particular a coater or a bonder. The apparatus includes a sealing structure arranged in the pipe, a flow structure having a fluid inlet arranged upstream of the sealing structure and a fluid outlet arranged downstream of the sealing structure, a first chamber arranged in the pipe upstream of the sealing structure, and a second chamber arranged in the pipe downstream of the sealing structure, and a measuring device, wherein the measuring device is adapted to measure a first fluid pressure in the first chamber and a second fluid pressure in the second chamber, wherein the measuring device is configured to determine the fluid flow based on the first and second fluid pressure.

Abstract: An adapter for a liquid container of a supply system of a wet process module for the treatment of substrates has a container part for fastening to the liquid container and a channel part for fastening to the supply system. The container part has a central opening and a fastening device for fastening the container part to the liquid container. The channel part has a continuous first channel portion and a continuous second channel portion, the first and the second channel portion each opening into the central opening of the container part.

Abstract: A nozzle tip adapter has a suction duct, a supply duct, and a base body with a device end and a substrate end. The base body has a nozzle tip recess at its substrate end for receiving a nozzle tip and a projecting portion extending into the nozzle tip recess, wherein the suction duct extends through the projecting portion and the supply duct opens into the nozzle tip recess, wherein the suction duct is being at least partially surrounded by the supply duct. Further, a nozzle assembly and a nozzle are disclosed.

Abstract: Disclosed is an apparatus for measuring a fluid flow through a pipe of a semiconductor manufacturing device, in particular a coater or a bonder. The apparatus includes a sealing structure arranged in the pipe, a flow structure having a fluid inlet arranged upstream of the sealing structure and a fluid outlet arranged downstream of the sealing structure, a first chamber arranged in the pipe upstream of the sealing structure, and a second chamber arranged in the pipe downstream of the sealing structure, and a measuring device, wherein the measuring device is adapted to measure a first fluid pressure in the first chamber and a second fluid pressure in the second chamber, wherein the measuring device is configured to determine the fluid flow based on the first and second fluid pressure.

Abstract: A nozzle tip adapter has a suction duct, a supply duct, and a base body with a device end and a substrate end. The base body has a nozzle tip recess at its substrate end for receiving a nozzle tip and a projecting portion extending into the nozzle tip recess, wherein the suction duct extends through the projecting portion and the supply duct opens into the nozzle tip recess, wherein the suction duct is being at least partially surrounded by the supply duct. Further, a nozzle assembly and a nozzle are shown.

Abstract: A bottle cap adapter for supplying liquids, particularly viscous liquids, comprising: a body part; and a vent tube comprising a first opening and a second opening, the first opening being configured to be put inside a bottle in the vicinity of the bottom of the bottle, wherein the body part further comprises a first surface and a second surface, the first surface being perpendicular to the vent tube and the second surface being parallel to or tilted to the first surface, e.g., by an angle of 0° to 40°, wherein the body part further comprises a channel from the first surface to the second surface, wherein at least one part of the channel comprises a connector extending to the second surface, the connector being complementary to a connector of the bottle, wherein the body part is further configured to be coupled to a bottle supply system, and wherein the vent tube is at least partially located in the channel of the body part.

Abstract: A bottle cap adapter for supplying liquids, particularly viscous liquids, comprising: a body part; and a vent tube comprising a first opening and a second opening, the first opening being configured to be put inside a bottle in the vicinity of the bottom of the bottle, wherein the body part further comprises a first surface and a second surface, the first surface being perpendicular to the vent tube and the second surface being parallel to or tilted to the first surface, e.g., by an angle of 0° to 40°, wherein the body part further comprises a channel from the first surface to the second surface, wherein at least one part of the channel comprises a connector extending to the second surface, the connector being complementary to a connector of the bottle, wherein the body part is further configured to be coupled to a bottle supply system, and wherein the vent tube is at least partially located in the channel of the body part.

Abstract: Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

Abstract: Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

Abstract: Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

Abstract: Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

Abstract: Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

Abstract: Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

Abstract: Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

Abstract: Described are apparatus, equipment, systems, architecture, and methods for dispensing one or more process fluids to one or more processing stations, involving the use of at least one a multi-chamber pump, including an embodiment for spin-coating microelectronic or semiconductor substrates.

Abstract: Described are dispensing apparatuses and methods of their use, the dispensing apparatuses having one or more process chamber inside of a control chamber, and the volume of the process chamber increases or decreases by adding or removing control fluid from the control chamber, with proper valving, to cause fluid to flow into and out of the process chamber, for use in dispensing fluid, especially in precise amounts.

Abstract: Described are dispensing apparatuses and methods of their use, the dispensing apparatuses having one or more process chamber inside of a control chamber, and the volume of the process chamber increases or decreases by adding or removing control fluid from the control chamber, with proper valving, to cause fluid to flow into and out of the process chamber, for use in dispensing fluid, especially in precise amounts.