Patents by Inventor Kadir TUNA

Kadir TUNA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROLESS NICKEL OR COBALT PLATING SOLUTION
    Publication number: 20230235462
    Abstract: An electroless nickel or cobalt plating solution, comprising nickel ions or cobalt ions, Ti3+ ions as reducing agent for reducing said nickel ions and cobalt ions, at least one accelerator selected from the group consisting of sulfites, dithionites, thiosulfates, tetrathionates, polythionates, disulfites, sulfides, disulfide, polysulfide, elemental sulfur and mixtures thereof; and one or more than one complexing agent, wherein the pH value of the plating solution is from 5 to 10.5.
    Type: Application
    Filed: June 10, 2021
    Publication date: July 27, 2023
    Inventors: Kadir TUNA, Thiago PUGLIESI GARCIA
  • TIN PLATING BATH AND A METHOD FOR DEPOSITING TIN OR TIN ALLOY ONTO A SURFACE OF A SUBSTRATE
    Publication number: 20220220617
    Abstract: The present invention concerns a tin plating bath comprising tin ions; titanium ions as reducing agent suitable to reduce tin ions to metallic tin; and at least one compound selected from the group consisting sulfites, dithionites, thiosulfates, tetrathionates, polythionates, disulfites, sulfides, disulfide, polysulfide, elemental sulfur or mixtures thereof. The present invention further discloses a method of depositing tin or a tin alloy onto a surface of a substrate. The tin plating bath is particularly suitable to be used in the electronics and semiconductor industry.
    Type: Application
    Filed: May 28, 2020
    Publication date: July 14, 2022
    Inventor: Kadir TUNA
  • Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
    Patent number: 11274375
    Abstract: The present invention concerns a tin plating bath comprising tin ions; at least one complexing agent selected from the group consisting of pyrophosphate ions, linear polyphosphate ions and cyclic polyphosphate ions and a nitrogen and sulfur containing stabilizing additive and titanium (III) ions as a reducing agent suitable to reduce tin ions to metallic tin. The present invention further discloses a method of depositing tin or a tin alloy onto a surface of a substrate. The tin plating bath is particularly suitable to be used in the electronics and semiconductor industry.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: March 15, 2022
    Assignee: Atotech Deutschland GmbH
    Inventors: Kadir Tuna, Arnd Kilian
  • TIN PLATING BATH AND A METHOD FOR DEPOSITING TIN OR TIN ALLOY ONTO A SURFACE OF A SUBSTRATE
    Publication number: 20190345623
    Abstract: The present invention concerns a tin plating bath comprising tin ions; at least one complexing agent selected from the group consisting of pyrophosphate ions, linear polyphosphate ions and cyclic polyphosphate ions and a nitrogen and sulfur containing stabilizing additive and titanium (III) ions as a reducing agent suitable to reduce tin ions to metallic tin. The present invention further discloses a method of depositing tin or a tin alloy onto a surface of a substrate. The tin plating bath is particularly suitable to be used in the electronics and semiconductor industry.
    Type: Application
    Filed: December 20, 2017
    Publication date: November 14, 2019
    Inventors: Kadir TUNA, Arnd KILIAN