Patents by Inventor Kadthala R. Narendrnath
Kadthala R. Narendrnath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8225927Abstract: A process has been developed that significantly reduces moisture absorption of components, resulting in a component which is less susceptible to moisture and adsorption/absorption effects to the components functionality. In one embodiment, a component having reduced susceptibility to moisture exposure includes a component disposed in an air-tight package, the component having a blocking gas disposed in pores on a surface of the component. In another embodiment, a method for preparing a component having reduced susceptibility to moisture exposure includes driving water from a component in a controlled environment, exposing the component in the controlled environment to a blocking gas, removing the component in the controlled environment, and optionally sealing the component in an air-tight package.Type: GrantFiled: November 11, 2010Date of Patent: July 24, 2012Assignee: Applied Materials, Inc.Inventors: Kadthala R. Narendrnath, Ashish Bhatnagar
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Publication number: 20110217208Abstract: A gas nozzle measurement apparatus comprises a controllable gas source to provide across a gas plate having gas nozzles, a flow of gas at a constant pressure or constant flow rate, and a sensor plate sized to cover an area comprising at least a portion of the front face of the gas plate. The sensor plate comprises gas flow sensors arranged in locations that correspond to positions of individual gas nozzles of the gas nozzles of the gas plate such that each gas flow sensor can measure a pressure, flow rate, density, or velocity of a gas stream passing through the individual gas nozzle that faces the gas flow sensor, and generate a signal indicative of, or display, the pressure, flow rate, density, or velocity of the gas stream passing through the individual gas nozzle.Type: ApplicationFiled: March 4, 2011Publication date: September 8, 2011Applicant: APPLIED MATERIALS, INC.Inventors: Kadthala R. NARENDRNATH, Ashish BHATNAGAR, Daniel L. MARTIN, Robert T. HIRAHARA, Gangadhar SHEELAVANT
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Publication number: 20110114519Abstract: A process has been developed that significantly reduces moisture absorption of components, resulting in a component which is less susceptible to moisture and adsorption/absorption effects to the components functionality. In one embodiment, a component having reduced susceptibility to moisture exposure includes a component disposed in an air-tight package, the component having a blocking gas disposed in pores on a surface of the component. In another embodiment, a method for preparing a component having reduced susceptibility to moisture exposure includes driving water from a component in a controlled environment, exposing the component in the controlled environment to a blocking gas, removing the component in the controlled environment, and optionally sealing the component in an air-tight package.Type: ApplicationFiled: November 11, 2010Publication date: May 19, 2011Applicant: APPLIED MATERIALS, INC.Inventors: KADTHALA R. NARENDRNATH, ASHISH BHATNAGAR
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Patent number: 6913670Abstract: A substrate support has a receiving surface capable of receiving a substrate during processing in a substrate processing chamber. The substrate support has a pedestal having a conduit to circulate a heat transfer fluid therein. A barrier about the conduit includes a fluid detection material capable of detecting a leakage of the fluid from the conduit be changing an attribute, for example, an optical or electrical property.Type: GrantFiled: April 8, 2002Date of Patent: July 5, 2005Assignee: Applied Materials, Inc.Inventors: Kadthala R. Narendrnath, Michael Douglas, Surinder Bedi
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Publication number: 20040190215Abstract: An electrostatic chuck comprises a dielectric member comprising (i) a first layer comprising a semiconductive material, and (ii) a second layer over the first layer, the second layer comprising an insulative material. The insulative material has a higher electrical resistance than the semiconductive material. An electrode in the dielectric member is chargeable to generate an electrostatic force. The chuck is useful to hold substrates, such as semiconductor wafers, during their processing in plasma processes.Type: ApplicationFiled: January 28, 2004Publication date: September 30, 2004Applicant: Applied Materials, Inc.Inventors: Edwin C. Weldon, Kenneth S. Collins, Arik Donde, Brian Lue, Dan Maydan, Robert J. Steger, Timothy Dyer, Ananda H. Kumar, Alexander M. Veytser, Kadthala R. Narendrnath, Semyon L. Kats, Arnold Kholodenko, Shamouil Shamouilian, Dennis S. Grimard
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Patent number: 6721162Abstract: An electrostatic chuck has an electrode capable of being electrically charged to electrostatically hold a substrate. A composite layer covers the electrode. The composite layer comprises (1) a first dielectric material covering a central portion of the electrode, and (2) a second dielectric material covering a peripheral portion of the electrode, the second dielectric material having a different composition than the composition of the first dielectric material. The chuck is useful in a plasma process chamber to process substrates, such as semiconductor wafers.Type: GrantFiled: March 12, 2002Date of Patent: April 13, 2004Assignee: Applied Materials Inc.Inventors: Edwin C. Weldon, Kenneth S. Collins, Arik Donde, Brian Lue, Dan Maydan, Robert J. Steger, Timothy Dyer, Ananda H. Kumar, Alexander M. Veytser, Kadthala R. Narendrnath, Semyon L. Kats, Arnold Kholodenko, Shamouil Shamouilian, Dennis S. Grimard
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Publication number: 20030188830Abstract: A substrate support has a receiving surface capable of receiving a substrate during processing in a substrate processing chamber.. The substrate support has a pedestal having a conduit to circulate a heat transfer fluid therein. A barrier about the conduit includes a fluid detection material capable of detecting a leakage of the fluid from the conduit be changing an attribute, for example, an optical or electrical property.Type: ApplicationFiled: April 8, 2002Publication date: October 9, 2003Applicant: Applied Materials, Inc.Inventors: Kadthala R. Narendrnath, Michael Douglas, Surinder Bedi
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Patent number: 6581275Abstract: A method of fabricating an electrostatic chuck capable of holding a substrate in a chamber comprises forming an at least partially sintered dielectric insert, forming a dielectric preform comprising an electrode and a gas conduit, and placing the dielectric insert in the gas conduit of the dielectric preform, and sintering the dielectric preform and the dielectric insert.Type: GrantFiled: January 22, 2001Date of Patent: June 24, 2003Assignee: Applied Materials Inc.Inventors: Kadthala R. Narendrnath, Shamouil Shamouilian, Dennis S. Grimard
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Patent number: 6538872Abstract: An electrostatic chuck 55 for holding a substrate 30 comprises an electrostatic member 100 made from a dielectric 115 covering an electrode 105 that is chargeable to electrostatically hold the substrate 30. A base 175 that includes a heater 235 is joined to the electrostatic member 100. The base may be made from a composite material, such as a porous ceramic infiltrated with the metal, and may be joined to the electrostatic member by a bond layer.Type: GrantFiled: November 5, 2001Date of Patent: March 25, 2003Assignee: Applied Materials, Inc.Inventors: You Wang, Shamouil Shamouilian, Arnold Kholodenko, Alexander M. Veytser, Surinder S. Bedi, Kadthala R. Narendrnath, Semyon L. Kats, Dennis S. Grimard, Wing L. Cheng, Ananda H. Kumar
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Patent number: 6490146Abstract: An electrostatic chuck for holding a substrate has an electrostatic member having a dielectric covering an electrode that is chargeable to electrostatically hold the substrate. The bond layer has a metal layer that is infiltrated or brazed between the electrostatic member and the base. The base may be a composite of a ceramic and metal, the composite having a coefficient of thermal expansion within about ±30% of a coefficient of thermal expansion of the electrostatic member. The base may also have a heater.Type: GrantFiled: August 13, 2001Date of Patent: December 3, 2002Assignee: Applied Materials Inc.Inventors: You Wang, Shamouil Shamouilian, Arnold Kholodenko, Alexander M. Veytser, Surinder S. Bedi, Kadthala R. Narendrnath, Semyon L. Kats, Dennis S. Grimard, Wing L. Cheng, Ananda H. Kumar
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Patent number: 6490144Abstract: A chamber 30 for processing a substrate 25 comprises a support 55 comprising a dielectric 60 enveloping an electrode 70. The electrode 70 may be chargeable to electrostatically hold the substrate 25 or may be chargeable to form an energized gas in the chamber 30 to process the substrate 25. A base 130 is below the support 55, and a compliant member 300 is positioned between the support 55 and the base 130. The compliant member 300 may be adapted to alleviate thermal stresses arising from a thermal expansion mismatch between the dielectric 60 and the base 130.Type: GrantFiled: November 29, 1999Date of Patent: December 3, 2002Assignee: Applied Materials, Inc.Inventors: Kadthala R. Narendrnath, Syed H. Askari, Dennis S. Grimard, Surinder S. Bedi, Ananda H. Kumar, Shamouil Shamouilian
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Patent number: 6481886Abstract: Apparatus for measuring wafer support assembly temperature in a semiconductor wafer processing system. The apparatus is a modular plug that is mounted to the support assembly. The plug contains a photoluminescent material that exhibits a decay in luminescence after an excitement which is indicative of the temperature of the support assembly.Type: GrantFiled: February 24, 2000Date of Patent: November 19, 2002Assignee: Applied Materials Inc.Inventors: Kadthala R. Narendrnath, Liang-Guo Wang, Shamouil Shamouilian, Paul E. Luscher, Hamid Noorbakhsh
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Patent number: 6462928Abstract: An electrostatic chuck 55 comprises an electrical connector 140 which is connected to the electrode 105 to conduct an electrical charge to the electrode 105. The electrical connector 140 comprises a refractory metal having a melting temperature of at least about 1500° C., such as for example, tungsten, titanium, nickel, tantalum, molybdenum, or alloys thereof. Preferably, the electrical connector 140 is bonded to the electrode 105 by a metal having a softening temperature of less than about 600° C., such as aluminum, indium, or low melting point alloys.Type: GrantFiled: May 7, 1999Date of Patent: October 8, 2002Assignee: Applied Materials, Inc.Inventors: Shamouil Shamouilian, You Wang, Surinder S. Bedi, Arnold Kholodenko, Alexander M. Veytser, Kadthala R. Narendrnath, Semyon L. Kats, Dennis S. Grimard, Wing L. Cheng, Ananda H. Kumar
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Publication number: 20020135969Abstract: An electrostatic chuck has an electrode capable of being electrically charged to electrostatically hold a substrate. A composite layer covers the electrode. The composite layer comprises (1) a first dielectric material covering a central portion of the electrode, and (2) a second dielectric material covering a peripheral portion of the electrode, the second dielectric material having a different composition than the composition of the first dielectric material. The chuck is useful in a plasma process chamber to process substrates, such as semiconductor wafers.Type: ApplicationFiled: March 12, 2002Publication date: September 26, 2002Applicant: Applied Materials, Inc.Inventors: Edwin C. Weldon, Kenneth S. Collins, Arik Donde, Brian Lue, Dan Maydan, Robert J. Steger, Timothy Dyer, Ananda H. Kumar, Alexander M. Veytser, Kadthala R. Narendrnath, Semyon L. Kats, Arnold Kholodenko, Shamouil Shamouilian, Dennis S. Grimard
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Patent number: 6440221Abstract: A temperature control system 145 is used to control the temperature of a process chamber 25 during processing of a semiconductor substrate 70. The temperature control system 145 comprises a heat exchanger plate 155 for removing heat from the chamber 25, and a heat transfer member 158 for conducting heat to the heat exchanger plate 155. The heat transfer member 158 comprises a lower heat conduction surface 205 bonded to an external surface of the chamber 25, and an upper heat transmitting surface 210 thermally coupled to the heat exchanger plate 155. Preferably, the temperature control assembly comprises a heater 150 for heating the chamber 25, and a computer control system 165 for regulating the heat removed by the heat exchanger plate 155 as well as the heat supplied by the heater 150, to maintain the chamber 25 at substantially uniform temperatures.Type: GrantFiled: May 20, 1998Date of Patent: August 27, 2002Assignee: Applied Materials, Inc.Inventors: Shamouil Shamouilian, Ananda H. Kumar, Kadthala R. Narendrnath, Eric Farahmand E Askarinam, Edwin C. Weldon, Michael Rice, Kenneth S. Collins
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Publication number: 20020095782Abstract: A method of fabricating an electrostatic chuck capable of holding a substrate in a chamber comprises forming an at least partially sintered dielectric insert, forming a dielectric preform comprising an electrode and a gas conduit, and placing the dielectric insert in the gas conduit of the dielectric preform, and sintering the dielectric preform and the dielectric insert.Type: ApplicationFiled: January 22, 2001Publication date: July 25, 2002Applicant: Applied Materials, Inc.Inventors: Kadthala R. Narendrnath, Shamouil Shamouilian, Dennis S. Grimard
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Patent number: 6414834Abstract: An electrostatic chuck 100 useful for holding a substrate 55 in a high density plasma, comprises an electrode 110 at least partially covered by a semiconducting dielectric 115, wherein the semiconducting dielectric 115 may have an electrical resistance of from about 5×109 &OHgr;cm to about 8×1010 &OHgr;cm.Type: GrantFiled: June 16, 2000Date of Patent: July 2, 2002Assignee: Applied Materials, Inc.Inventors: Edwin C. Weldon, Kenneth S. Collins, Arik Donde, Brian Lue, Dan Maydan, Robert J. Steger, Timothy Dyer, Ananda H. Kumar, Alexander M. Veytser, Kadthala R. Narendrnath, Semyon L. Kats, Arnold Kholodenko, Shamouil Shamouilian, Dennis S. Grimard
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Publication number: 20020075624Abstract: An electrostatic chuck for holding a substrate has an electrostatic member having a dielectric covering an electrode that is chargeable to electrostatically hold the substrate. The bond layer has a metal layer that is infiltrated or brazed between the electrostatic member and the base. The base may be a composite of a ceramic and metal, the composite having a coefficient of thermal expansion within about ±30% of a coefficient of thermal expansion of the electrostatic member. The base may also have a heater.Type: ApplicationFiled: August 13, 2001Publication date: June 20, 2002Applicant: Applied Materials, Inc.Inventors: You Wang, Shamouil Shamouilian, Arnold Kholodenko, Alexander M. Veytser, Surinder S. Bedi, Kadthala R. Narendrnath, Semyon L. Kats, Dennis S. Grimard, Wing L. Cheng, Ananda H. Kumar
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Publication number: 20020036881Abstract: An electrostatic chuck 55 comprises an electrostatic member 100 including a dielectric 115 having a surface 120 adapted to receive a substrate 30. The dielectric 115 covers an electrode 105 that is chargeable to electrostatically hold the substrate 30. The base 175 comprises a composite of a plurality of materials, such as, ceramic and metal, for example silicon carbide and aluminum. Optionally, a support 190 can be provided to support the base 175.Type: ApplicationFiled: May 7, 1999Publication date: March 28, 2002Inventors: SHAMOUIL SHAMOUILIAN, ANANDA H. KUMAR, ARNOLD KHOLODENKO, YOU WANG, ALEXANDER M. VEYTSER, SURINDER S. BEDI, KADTHALA R. NARENDRNATH, SEMYON L. KATS, DENNIS S. GRIMARD, WING L. CHENG
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Publication number: 20010042594Abstract: A temperature control system 145 is used to control the temperature of a process chamber 25 during processing of a semiconductor substrate 70. The temperature control system 145 comprises a heat exchanger plate 155 for removing heat from the chamber 25, and a heat transfer member 158 for conducting heat to the heat exchanger plate 155. The heat transfer member 158 comprises a lower heat conduction surface 205 bonded to an external surface of the chamber 25, and an upper heat transmitting surface 210 thermally coupled to the heat exchanger plate 155. Preferably, the temperature control assembly comprises a heater 150 for heating the chamber 25, and a computer control system 165 for regulating the heat removed by the heat exchanger plate 155 as well as the heat supplied by the heater 150, to maintain the chamber 25 at substantially uniform temperatures.Type: ApplicationFiled: May 20, 1998Publication date: November 22, 2001Inventors: SHAMOUIL SHAMOUILIAN, ANANDA H. KUMAR, KADTHALA R. NARENDRNATH, ERIC ASKARINAM, EDWIN C. WELDON, MICHAEL RICE, KENNETH S. COLLINS