Patents by Inventor Kadthala Ramaya Narendrnath
Kadthala Ramaya Narendrnath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11826875Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.Type: GrantFiled: October 5, 2021Date of Patent: November 28, 2023Assignee: Applied Materials, Inc.Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
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Publication number: 20230356353Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.Type: ApplicationFiled: July 12, 2023Publication date: November 9, 2023Inventors: Young J. Paik, Ashish Bhatnagar, Kadthala Ramaya Narendrnath
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Patent number: 11738421Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.Type: GrantFiled: April 26, 2021Date of Patent: August 29, 2023Assignee: Applied Materials, Inc.Inventors: Young J. Paik, Ashish Bhatnagar, Kadthala Ramaya Narendrnath
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Patent number: 11417561Abstract: An edge ring and process for fabricating an edge ring are disclosed herein. In one embodiment, an edge ring includes an annular body and a plurality of thermal breaks disposed within the annular body. The thermal breaks are disposed perpendicular to a center line of the annular body of the edge ring.Type: GrantFiled: January 24, 2020Date of Patent: August 16, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Govinda Raj, Kadthala Ramaya Narendrnath, Bopanna Ichettira Vasantha, Simon Yavelberg
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Publication number: 20220023990Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.Type: ApplicationFiled: October 5, 2021Publication date: January 27, 2022Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
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Patent number: 11179965Abstract: An electrostatic chuck includes a metal base plate, an electrostatic puck bonded to the metal base plate, and surface features on the surface of the electrostatic puck. The electrostatic puck includes an electrode embedded in the electrostatic puck. A surface of the electrostatic puck has a flatness of below 10 microns. The surface features include mesas and a sealing band around a perimeter of the electrostatic puck. The surface features have an average surface roughness of approximately 2-6 micro-inches. The corners of the surface features are not rounded.Type: GrantFiled: July 16, 2018Date of Patent: November 23, 2021Assignee: Applied Materials, Inc.Inventors: Vijay D. Parkhe, Kadthala Ramaya Narendrnath
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Patent number: 11161218Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.Type: GrantFiled: January 18, 2019Date of Patent: November 2, 2021Assignee: Applied Materials, Inc.Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
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Publication number: 20210245323Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.Type: ApplicationFiled: April 26, 2021Publication date: August 12, 2021Inventors: Young J. Paik, Ashish Bhatnagar, Kadthala Ramaya Narendrnath
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Publication number: 20210245322Abstract: A method of fabricating a polishing pad includes determining a desired distribution of voids to be introduced within a polymer matrix of a polishing layer of the polishing pad. Electronic control signals configured to be read by a 3D printer are generated which specify the locations where a polymer matrix precursor is to be deposited, and specify the locations of the desired distribution of voids where no material is to be deposited. A plurality of layers of the polymer matrix corresponding to the plurality of the first locations is successfully deposited with the 3D printer. Each layer of the plurality of layers of polymer matrix is deposited by ejecting a polymer matrix precursor from a nozzle. The polymer matrix precursor is solidified to form a solidified polymer matrix having the desired distribution of voids.Type: ApplicationFiled: April 26, 2021Publication date: August 12, 2021Inventors: Laxman Murugesh, Kadthala Ramaya Narendrnath
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Patent number: 11007619Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.Type: GrantFiled: December 20, 2018Date of Patent: May 18, 2021Assignee: Applied Materials, Inc.Inventors: Young J. Paik, Ashish Bhatnagar, Kadthala Ramaya Narendrnath
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Publication number: 20200161165Abstract: An edge ring and process for fabricating an edge ring are disclosed herein. In one embodiment, an edge ring includes an annular body and a plurality of thermal breaks disposed within the annular body. The thermal breaks are disposed perpendicular to a center line of the annular body of the edge ring.Type: ApplicationFiled: January 24, 2020Publication date: May 21, 2020Inventors: Govinda RAJ, Kadthala Ramaya NARENDRNATH, Bopanna Ichettira VASANTHA, Simon YAVELBERG
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Publication number: 20190152017Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.Type: ApplicationFiled: January 18, 2019Publication date: May 23, 2019Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
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Publication number: 20190118336Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.Type: ApplicationFiled: December 20, 2018Publication date: April 25, 2019Inventors: Young J. Paik, Ashish Bhatnagar, Kadthala Ramaya Narendrnath
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Patent number: 10213894Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.Type: GrantFiled: February 26, 2016Date of Patent: February 26, 2019Assignee: Applied Materials, Inc.Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
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Patent number: 10160093Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.Type: GrantFiled: December 4, 2009Date of Patent: December 25, 2018Assignee: Applied Materials, Inc.Inventors: Young J. Paik, Ashish Bhatnagar, Kadthala Ramaya Narendrnath
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Patent number: 10131126Abstract: Methods for fabricating and refurbishing an assembly are disclosed herein. The method begins by applying an adhesive layer onto a first substrate. A second substrate is placed onto the adhesive layer, thereby securing the two substrates together, the adhesive layer bounding at least one side of a channel that extends laterally between the substrates to an exterior of the assembly. And, the substrates and the adhesive layer are subjected to a bonding procedure and allowing outgassing of volatiles from the adhesive layer to escape from between the substrates through the channel, wherein the substrates bonded by the adhesive layer form a component for a semiconductor vacuum processing chamber.Type: GrantFiled: March 8, 2017Date of Patent: November 20, 2018Assignee: Applied Materials, Inc.Inventors: Kadthala Ramaya Narendrnath, Gangadhar Sheelavant, Monika Agarwal, Ashish Bhatnagar
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Publication number: 20180319205Abstract: An electrostatic chuck includes a metal base plate, an electrostatic puck bonded to the metal base plate, and surface features on the surface of the electrostatic puck. The electrostatic puck includes an electrode embedded in the electrostatic puck. A surface of the electrostatic puck has a flatness of below 10 microns. The surface features include mesas and a sealing band around a perimeter of the electrostatic puck. The surface features have an average surface roughness of approximately 2-6 micro-inches. The corners of the surface features are not rounded.Type: ApplicationFiled: July 16, 2018Publication date: November 8, 2018Inventors: Vijay D. Parkhe, Kadthala Ramaya Narendrnath
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Publication number: 20180236632Abstract: A method of fabricating a polishing pad includes determining a desired distribution of voids to be introduced within a polymer matrix of a polishing layer of the polishing pad. Electronic control signals configured to be read by a 3D printer are generated which specify the locations where a polymer matrix precursor is to be deposited, and specify the locations of the desired distribution of voids where no material is to be deposited. A plurality of layers of the polymer matrix corresponding to the plurality of the first locations is successfully deposited with the 3D printer. Each layer of the plurality of layers of polymer matrix is deposited by ejecting a polymer matrix precursor from a nozzle. The polymer matrix precursor is solidified to form a solidified polymer matrix having the desired distribution of voids.Type: ApplicationFiled: April 19, 2018Publication date: August 23, 2018Inventors: Laxman Murugesh, Kadthala Ramaya Narendrnath
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Patent number: 10056284Abstract: A method of manufacturing an electrostatic chuck includes bonding an electrostatic puck to a metal base plate, wherein the electrostatic puck has an electrode embedded in the electrostatic puck. The method further includes subsequently polishing a surface of the electrostatic puck to a flatness of below 10 microns and an average surface roughness of approximately 2-6 micro-inches. The method further includes subsequently forming surface features on a surface of the electrostatic puck, the surface features comprising mesas and a sealing band around a perimeter of the electrostatic puck.Type: GrantFiled: May 15, 2017Date of Patent: August 21, 2018Assignee: Applied Materials, Inc.Inventors: Vijay D. Parkhe, Kadthala Ramaya Narendrnath
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Patent number: 9993907Abstract: A method of fabricating a polishing pad includes determining a desired distribution of voids to be introduced within a polymer matrix of a polishing layer of the polishing pad. Electronic control signals configured to be read by a 3D printer are generated which specify the locations where a polymer matrix precursor is to be deposited, and specify the locations of the desired distribution of voids where no material is to be deposited. A plurality of layers of the polymer matrix corresponding to the plurality of the first locations is successfully deposited with the 3D printer. Each layer of the plurality of layers of polymer matrix is deposited by ejecting a polymer matrix precursor from a nozzle. The polymer matrix precursor is solidified to form a solidified polymer matrix having the desired distribution of voids.Type: GrantFiled: November 20, 2014Date of Patent: June 12, 2018Assignee: Applied Materials, Inc.Inventors: Laxman Murugesh, Kadthala Ramaya Narendrnath