Patents by Inventor Kae-an Liu

Kae-an Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heatpipe to help reduce radio frequency interference
    Patent number: 12160216
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: December 3, 2024
    Assignee: Intel Corporation
    Inventors: Kae-An Liu, Jaejin Lee, David W. Browning
  • Technologies for dynamic wireless noise mitigation using artificial intelligence
    Patent number: 11277160
    Abstract: Technologies for dynamic wireless noise mitigation include a computing device having a wireless modem and one or more antennas. The computing device activates one or more components of the computing device, monitors platform activity, and measures wireless noise received by the antennas. The computing device trains a noise prediction model based on the platform activity and the measured noise. The computing device may monitor platform activity and predict a noise prediction with the noise prediction model based on the monitored activity. The computing device may mitigate wireless noise received by the wireless antennas based on the noise prediction. The computing device may provide the noise prediction to the wireless modem. Other embodiments are described and claimed.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: March 15, 2022
    Assignee: Intel Corporation
    Inventors: Shahrnaz Azizi, Vinod Kristem, Jie Gao, Eduardo Alban, Kae-an Liu, Janardhan Koratikere Narayan, Xintian Lin, Ulun Karacaoglu, Atsuo Kuwahara, Timothy F. Cox, Vallabhajosyula Srinivasa Somayazulu, Maruti Gupta Hyde
  • HEATPIPE TO HELP REDUCE RADIO FREQUENCY INTERFERENCE
    Publication number: 20210104995
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.
    Type: Application
    Filed: December 15, 2020
    Publication date: April 8, 2021
    Applicant: Intel Corporation
    Inventors: Kae-An Liu, Jaejin Lee, David W. Browning
  • TECHNOLOGIES FOR DYNAMIC WIRELESS NOISE MITIGATION USING ARTIFICIAL INTELLIGENCE
    Publication number: 20200235765
    Abstract: Technologies for dynamic wireless noise mitigation include a computing device having a wireless modem and one or more antennas. The computing device activates one or more components of the computing device, monitors platform activity, and measures wireless noise received by the antennas. The computing device trains a noise prediction model based on the platform activity and the measured noise. The computing device may monitor platform activity and predict a noise prediction with the noise prediction model based on the monitored activity. The computing device may mitigate wireless noise received by the wireless antennas based on the noise prediction. The computing device may provide the noise prediction to the wireless modem. Other embodiments are described and claimed.
    Type: Application
    Filed: April 6, 2020
    Publication date: July 23, 2020
    Inventors: Shahrnaz Azizi, Vinod Kristem, Jie Gao, Eduardo Alban, Kae-an Liu, Janardhan Koratikere Narayan, Xintian Lin, Ulun Karacaoglu, Atsuo Kuwahara, Timothy F. Cox, Vallabhajosyula Srinivasa Somayazulu, Maruti Gupta Hyde