Patents by Inventor Kagehisa Yamamoto

Kagehisa Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 6576381
    Abstract: The present invention alleviates the operational problems in production of flip chips and provides a semiconductor device superior in various reliabilities. The preset invention lies in an encapsulated semiconductor device comprising: (a) a polybenzoxazole resin film for chip protection, obtained by coating, on a circuit-formed chip, a positive photosensitive resin composition comprising 100 parts by weight of a polyamide and 1 to 100 parts by weight of a photosensitive diazoquinone compound, and subjecting the coated composition to patterning and curing, and (b) a bump electrode.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: June 10, 2003
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Takashi Hirano, Kagehisa Yamamoto, Toshio Banba, Hiroaki Makabe