Abstract: According to a method of manufacturing a vertical-cavity surface-emitting semiconductor laser element in accordance with the present invention, a process of wet etching is performed for a part that is oxidized in a layer of an AlGaAs (42) which configures a layer having an index of refraction as lower and in which a composition of aluminum is designed to be as higher comparing to the other pairs of layers in a DBR mirror at an upper side that are formed at an inner side of a mesa post (38). And then a process of filling up again is performed with making use of a layer of polyimide (26). Moreover, an etchant that includes such as a hydrofluoric acid or a buffered hydrofluoric acid or an aqueous ammonia or the like is made use in order to perform such the process of wet etching.

Abstract: A vertical cavity surface emitting laser element as described herein can suppress of any dislocation, when a distributed Bragg reflector (DBR) mirror is formed on the onto a substrate (1). The vertical cavity surface emitting laser can be designed so that an average of strain in the DBR mirror (2) and a layer thickness of the DBR mirror (2) are in reference to a curvature of the substrate (1) in order to satisfy a predetermined condition, and then nitrogen can be added into the DBR mirror (2) with a composition that corresponds to a designed average of strain in the DBR mirror (2). For example, the average composition of nitrogen can be designed to be between 0.028% and 0.390%.

Abstract: According to a method of manufacturing a vertical-cavity surface-emitting semiconductor laser element in accordance with the present invention, a process of wet etching is performed for a part that is oxidized in a layer of an AlGaAs (42) which configures a layer having an index of refraction as lower and in which a composition of aluminum is designed to be as higher comparing to the other pairs of layers in a DBR mirror at an upper side that are formed at an inner side of a mesa post (38). And then a process of filling up again is performed with making use of a layer of polyimide (26). Moreover, an etchant that includes such as a hydrofluoric acid or a buffered hydrofluoric acid or an aqueous ammonia or the like is made use in order to perform such the process of wet etching.

Abstract: By making use of a vertical cavity surface emitting laser element (100) in accordance with the present invention, it becomes able to suppress as properly an occurrence of any dislocation therein even in a case where there is formed a DBR mirror onto a substrate (1), by designing to be set for between an average of strain in a DBR mirror at the lower side thereof (2) and a layer thickness of such the DBR mirror at the lower side thereof (2) in reference to a curvature of the substrate (1) in order to be satisfied a predetermined condition, and then by performing an addition of nitrogen into the DBR mirror at the lower side thereof (2) with a composition thereof that corresponds to the designed average of strain in the DBR mirror at the lower side thereof (2) to be set therefor, such as the composition of between 0.028% and 0.