Abstract: A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a second trace. The method may also comprise forming a channel in a sidewall of the via hole. The method may further comprise filling the via hole and the channel with a conductive material. The method may additionally comprise removing the conductive material from the via hole without depleting the channel, thereby forming an interconnect that couples the first trace to the second trace.

Abstract: Described are a method and system for secure transmission of data through a network. A subcarrier sequence for data transmission is generated. The subcarrier sequence designates at least one subcarrier from a number of orthogonal subcarriers for each of a plurality of intervals in a time sequence. The subcarrier sequence is provided to a receiver. A data signal that includes the subcarriers identified in the subcarrier sequence modulated according to the data is transmitted from a transmitter to the receiver. For additional security, the subcarrier sequence can be transmitted to the receiver using a communications channel that is separate from the communications channel for the data signal. The data signal is detected at the receiver and demodulated according to the subcarrier sequence.

Abstract: A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a second trace. The method may also comprise forming a channel in a sidewall of the via hole. The method may further comprise filling the via hole and the channel with a conductive material. The method may additionally comprise removing the conductive material from the via hole without depleting the channel, thereby forming an interconnect that couples the first trace to the second trace.

Abstract: A technique for enhancing circuit density and performance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for enhancing circuit density and performance of a microelectronic module. The method may comprise forming a discrete package, wherein the discrete package comprises one or more passive devices that are desirable for the performance of the microelectronic module. The method may also comprise coupling the discrete package to the microelectronic module.