Patents by Inventor Kahlil HOSSEINI

Kahlil HOSSEINI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140220742
    Abstract: A method for forming a thin semiconductor device is disclosed. In one embodiment, a lead frame is provided over a carrier. At least one semiconductor chip is provided on the lead frame and the at least one semiconductor chip is enclosed with an encapsulating material. The thickness of the at least one semiconductor chip and the encapsulating material are reduced. At least one through connection is formed in the encapsulating material and at least one electrical contact element is formed over the at least one semiconductor chip and the at least one through connection.
    Type: Application
    Filed: April 4, 2014
    Publication date: August 7, 2014
    Applicant: Infineon Technologies AG
    Inventor: Kahlil HOSSEINI