Patents by Inventor Kai-An Cheng

Kai-An Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8851154
    Abstract: A cooling module includes a casing with a thermal-transmittance wall having an interior surface and an exterior surface, a coolant inlet, a vapor outlet, and a converting component with a plurality of orifices and dividing an interior of the casing into a coolant chamber and a vaporization chamber. A liquid coolant is ejected through the plurality of orifices to form plumes toward the interior surface of the thermal-transmittance wall and exchange heat with the thermal-transmittance wall resulting in coolant vapor. In a cooling system, a vapor conduit then carries the vapor to a condenser, and a coolant conduit returns the condensed coolant to the cooling module. The cooling system is used to cool a lamp device.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: October 7, 2014
    Assignee: MicroBase Technology Corp.
    Inventors: Kai-An Cheng, Chia-Chen Liao, Chun-Hsien Wu, Hsien-Chun Meng, Hsien Meng
  • Publication number: 20120026745
    Abstract: A lamp device includes a lamp housing, a light emitting component serving as a heat source and a cooling system. The cooling system includes a liquid coolant, a cooling module, a vapor conduit, a coolant conduit, and a condenser. The cooling module includes a casing and a converting component. The casing has a thermal-transmittance wall having an interior surface and an exterior surface, a coolant inlet and a vapor outlet. The converting component divides an interior of the casing into a coolant chamber and a vaporization chamber. The converting component is formed with a plurality of orifices for permitting the liquid coolant in the coolant chamber to be ejected therethrough to form plumes of the liquid coolant that travel toward the interior surface of the thermal-transmittance wall and that exchange heat with the thermal-transmittance wall to result in coolant vapor flowing out of the vaporization chamber via the vapor outlet.
    Type: Application
    Filed: July 29, 2011
    Publication date: February 2, 2012
    Inventors: Kai-An Cheng, Chia-Chen Liao, Chun-Hsien Wu, Hsien-Chun Meng, Hsien Meng
  • Publication number: 20110277491
    Abstract: A heat dissipation system includes a cooling device, a condenser, a vapor conveying duct and a cooling liquid conveying duct. The cooling device includes a housing, and an orifice plate dividing an inner space of the housing into a liquid supply chamber and an evaporation chamber proximate to the heat source, and formed with multiple micro orifices each having a diameter ranging from 5 to 1000 micrometers. The condenser includes a fluid inlet, a condensing chamber and a fluid outlet. The vapor conveying duct connects a vapor outlet of the housing and the fluid inlet of the condenser. The cooling liquid conveying duct connects a cooling liquid inlet of the housing and a fluid outlet of the condenser.
    Type: Application
    Filed: February 3, 2011
    Publication date: November 17, 2011
    Applicant: MicroBase Technology Group
    Inventors: Ching-Ping Wu, Kai-An Cheng, Chun-Hsien Wu, Ju-Hong Lin, Chia-Chen Liao, Hsien Meng, Hsien-Chun Meng