Abstract: Systems, methods, and computer program products are provided for using proximity sensing systems, such as Bluetooth low energy (LE) beacons, to uniquely identify remote computing systems, such as point of sale terminals. A mobile device includes an antenna, a baseband modem, and a contactless frontend, and is able to perform near-field communication transactions. The mobile device antenna receives radio communications from one or more Bluetooth LE beacons, the transmissions including data packets with a unique identifier. The mobile device calculates the signal strength of the one or more Bluetooth LE beacons at a time proximate to when a near-field communication transaction is initiated. The mobile device stores in its memory the data packet associated with the Bluetooth LE beacon broadcasting the strongest signal.

Abstract: A semiconductor device having a composite barrier structure over a transistor and a method for manufacturing the same is disclosed. The method includes a series of steps including: forming a transistor having source/drain regions within a fin structure and adjacent to a gate structure across over the fin structure; forming first source/drain contacts right above and electrically connected to the source/drain regions; depositing a composite barrier structure over the transistor and the first source/drain contacts; and forming second source/drain contacts right above and electrically connected to the first source/drain contacts. The method further includes depositing a second etch-stop layer before depositing the composite barrier structure and forming second source/drain contacts right above and electrically connected to the first source/drain contacts. The method also includes forming contacts over and electrically connected to the second source/drain contacts.

Abstract: Methods are described for removing edge bead on a wafer associated with a resist coating comprising a metal containing resist compositions. The methods can comprise applying a first bead edge rinse solution along a wafer edge following spin coating of the wafer with the metal based resist composition, wherein the edge bead solution comprises an organic solvent and an additive comprising a carboxylic acid, an inorganic fluorinated acid, a tetraalkylammonium compound, or a mixture thereof. Alternatively or additionally, the methods can comprise applying a protective composition to the wafer prior to performing an edge bead rinse. The protective composition can be a sacrificial material or an anti-adhesion material and can be applied only to the wafer edge or across the entire wafer in the case of the protective composition. Corresponding apparatuses for processing the wafers using these methods are presented.

Abstract: Embodiments of the present application relate to a method, a system, and a computer program product for authenticating a service. A method for authenticating a service is provided. The method includes receiving a first service request from a first terminal, generating a first link address that is used to link to an access location based on the received first service request, determining a preset terminal identifier corresponding to a second terminal, the preset terminal identifier being a terminal identifier preset by the user, sending the first link address to the second terminal, receiving a first link request, determining an issued terminal identifier based on the first link request, comparing the determined issued terminal identifier with the preset terminal identifier of the second terminal, and performing a next processing operation on the first service request based on the comparison result.

Abstract: A semiconductor packaging system includes a semiconductor device package having a semiconductor chip with two or more terminals and a protective structure encapsulating and electrically insulating the semiconductor chip. Two or more electrical conductors that are each electrically connected to one of the terminals extend to an outer surface of the protective structure. A first surface feature is on an exterior surface of the semiconductor device package. The system further includes a connectable package extender having a second surface feature configured to interlock with the first surface feature when the first surface feature is mated with the second surface feature so as to secure the package extender to the semiconductor device package. An extension portion adjoins and extends away from the exterior surface of the semiconductor device package when the package extender is secured to the semiconductor device package.

Abstract: The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion circuit is surface-mountable on a system board. The package module of the power conversion circuit includes: a substrate, a power device die, a molding layer and a plurality of pins. The substrate has a metal layer, an insulating substrate layer and a thermal conductive layer. The insulating substrate layer is disposed between the metal layer and the thermal conductive layer. The power device die is coupled to the metal layer. Devices on the metal layer of the substrate are embedded in the molding layer. The plurality of pins is electrically coupled to the metal layer and embedded in the molding layer, at least a contact surface of each of the pins which is electrically coupled to the system board is exposed, and the contact surface is parallel and/or perpendicular to the thermal conductive layer.

Abstract: A process for the preparation of a calcined mixed oxide comprising Al-, Ce- and Zr-oxides, comprising the steps of providing an aqueous slurry comprising hydroxides of cerium and zirconium, contacting the hydroxides of cerium and zirconium with an alumina precursor to obtain an aqueous suspension of solids, isolating the solids from the aqueous suspension and drying to obtain a solid composition, calcining the solid composition of step (c) at a temperature from 450° C. to 1200° C. for at least 1 hour to obtain a calcined mixed oxide.

Abstract: A structure is presented as a laminar structure having a first electrode, light-emitting diode epitaxial layer, silver reflecting layer, current barrier layer, metallic buffer layer, bonding layer, substrate and second electrode in turn, the silver reflecting layer covering the light-emitting diode epitaxial layer and having a bare region distributed as a pattern, the bare region being filled with a high temperature enduring reflecting material, the current barrier layer being patterned to be distributed over the silver reflecting layer in correspondence with the bare region, the metallic buffer layer separating the current barrier layer while covering the silver reflecting layer, whereby high temperature generated by the current barrier layer is sustained by the reflecting material to prevent the silver reflecting layer from cracking when being contacted with the high temperature of the current barrier layer and then ensure luminous efficiency of the light-emitting diode.

Abstract: smart power distribution system and a method to progressively dispatch the power is described. The method steps are all automatic and self-adaptive. The method can be executed in an unattended manner to automatically correlate real time data vs. historical data, planning data vs. operation data. Based on a long cycle periodical variation and short-term random variations in load, and taking into account the temporary load power supply and maintenance needs, a multi-stage progressive multiple time scales optimal dispatching method is developed, including the distributed power, micro-grids, energy storage devices, electric vehicles charge-discharge facility and other elements of the Intelligent power distribution systems, to achieve coordinated operation of the network, power, load resources to ensure a continuous safe and reliable smart power distribution system operated at high quality and efficiency.

Abstract: For LTE cellular data and Wi-Fi P2P technology coexistence scenario, a user equipment can generate in-device coexistence (IDC) indication message to the base station for DRX-based IDC solution. LTE data scheduling is described by a set of DRX parameters, while Wi-Fi P2P data scheduling is described by Opportunistic Power Saving (OppoPS) and Notification of Absence (NoA) parameters. When generating the IDC indication message for Wi-Fi P2P group client (GC), the DRX parameters must be selected carefully to maximize efficiency. Even though Wi-Fi shares less time, with proper time alignment, its coexistence performance could be better. For Wi-Fi P2P group owner (GO) with IDC TDM scheduling constraints, OppoPS and NoA should be aligned with DRX parameters to achieve best performance.

Abstract: A drive train device for a motor vehicle is disclosed. The drive train device has at least one component which is included for the purpose of transmitting a torque, and at least one cast-in element which is partially cast into the component, which is included for the purpose of transmitting the torque, where the component and the cast-in element are made of different materials. The drive train device has a sealing device which is included for the purpose of sealing a junction between the component and the cast-in element.

Abstract: A wire-winding device comprising: an upper cover; a spiral spring; a rotary base having a groove to accommodate the spiral spring on the bottom surface thereof; a transmission line winding around the rotary base; a lower cover assembled with the upper cover; and a pillar, an outlet, and a wire casing formed on one side of the groove, and two spacers surrounding the peripheral edge of the groove, the pillar having a first end portion which shifts outward to the edge of rotary base, the wire casing having a smooth curved surface formed on the bottom surface thereof near the outlet to enlarge the accommodating space near the outlet and reduce the friction between the transmission line and the spacers.

Abstract: A processing apparatus includes a spin coating chamber, an ultraviolet curing chamber, a transfer module and an enclosure. The transfer module is assigned with a plurality transfer destinations, in which two of the transfer destinations are respectively located within the spin coating chamber and the ultraviolet curing chamber. The transfer module, the spin coating chamber and the ultraviolet curing chamber are enclosed by the enclosure.

Abstract: A LED driver having at least one Integrated Circuit (IC), the IC programmable using a hardware description language; a first electronic switch operable to provide a first switching time period to control power factor voltage, the first switching time period programmable by the at least one IC; and a second electronic switch operable to provide a second switching time period to regulate ripple free constant DC electrical current flowing into the at least one LED, the second switching time period is programmable by the at least one IC.

Abstract: The invention relates to the preparation of thin tissue sections for mass spectrometric (MALDI) imaging, and proposes a method wherein a microcrystalline layer of the matrix material is produced on the surface of the thin tissue sections, and soluble analyte molecules are transported orthogonally through the thin tissue section to the matrix layer, without substantial lateral diffusion, by means of a solvent flow with alternating or constant direction, and are then deposited in the matrix layer and, if possible, embedded in the matrix crystals. A solvent flow which alternates in direction can be produced by successive, alternating phases of swelling and drying, brought about by periodic changes to the thin tissue section temperature and/or the partial pressures of the solvents. A continuous solvent flow can be generated by applying the thin tissue section onto a porous support which supplies solvent to the rear surface of the thin tissue section.

Abstract: An asphalt-urethane composition is disclosed which does not contain any of specific chemical substances, has adhesiveness to mineral-surfaced asphalt roofing and an asphalt groundwork, exhibits performance in temporary waterproofing with respect to the asphalt groundwork, performs adhesion of sand to the surface layer of the mineral-surfaced asphalt roofing and adjustment of irregularity, has adhesiveness of integrating with a urethane waterproof layer applied thereon, has excellent workability, construction efficiency, water resistance, and hot water resistance, has high strength and elasticity, has low temperature sensitivity, and has excellent finish properties. The asphalt-urethane composition can contain at least a component (A) obtained by adding an MDI prepolymer generated by reacting polyolefin polyol having two or more hydroxyl groups, short-chain polyhydric alcohol, and a monomer of MDI, a monomer of MDI, and a solvent a; and a component (B) including asphalt, a catalyst, and a solvent b.

Abstract: The consistency of a data structure is maintained where changes in the form of atomic operations are requested by more than one user to an object graph containing a plurality of objects. Operational transformations specifying how one atomic operation is transformed against another one are accessed and the object graph is modified with the first and second set of changes by employing the operational transformations on the atomic operations and applying the resulting transformed operations to the object graph. The transformed operations are recorded in a history log. The atomic operations are object operations that create or delete an object of the object graph and/or property operations changing a property of an object. Each operation retains the identifier of the object it acts on and information on each change of the object resulting from the operation. Multi-operation conflicts are resolved by defined conflict resolution events.

Abstract: Systems, apparatuses, and methods may include a circuit board having a plated through hole with a via portion and a stub portion and a self-coupled inductor electrically coupled to the via portion of the plated through hole. The self-coupled inductor may include a first inductor mutually coupled to a second inductor in series to reduce a capacitive effect of the stub portion of the plated through hole.